Patents by Inventor Chang-Yu Huang
Chang-Yu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145482Abstract: A thin film transistor includes a bottom gate, a semiconductor layer, a top gate, a first auxiliary conductive pattern, a source, and a drain. The semiconductor layer includes a first semiconductor region, a second semiconductor region, a first heavily doped region, a second heavily doped region, a third heavily doped region, a first lightly doped region, a second lightly doped region, and a third lightly doped region. The first heavily doped region and the second heavily doped region are respectively located on two sides of the first semiconductor region. Two ends of the second semiconductor region are directly connected to the third heavily doped region and the third lightly doped region, respectively. The top gate is electrically connected to the bottom gate. The source and the drain are respectively electrically connected to the third heavily doped region and the second heavily doped region of the semiconductor layer.Type: ApplicationFiled: December 19, 2022Publication date: May 2, 2024Applicant: AUO CorporationInventors: Ssu-Hui Lu, Chang-Hung Li, Kuo-Yu Huang, Maw-Song Chen
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Publication number: 20240128219Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
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Patent number: 11942585Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.Type: GrantFiled: July 2, 2021Date of Patent: March 26, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Cheng-Hsuan Wu, Chang-Yu Lin, Yu-Sheng Huang
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Publication number: 20240088119Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.Type: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii
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Patent number: 11929319Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes two dies, an encapsulant, a first metal line and a plurality of dummy vias. The encapsulant is disposed between the two dies. The first metal line is disposed over the two dies and the encapsulant, and electrically connected to the two dies. The plurality of dummy vias is disposed over the encapsulant and aside the first metal line.Type: GrantFiled: July 22, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ching-Yu Huang, Han-Ping Pu, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh
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Publication number: 20240044720Abstract: A semiconductor device includes a first substrate and a first device layer. The first device layer is disposed on the first substrate and includes a first region and a second region of the first device layer. The first device layer includes at least one first device and a sensor aside the at least one first device. The sensor includes a first resistor with a first non-linear temperature resistance curve and a second resistor with a second non-linear temperature resistance curve. A temperature of the sensor is linearly related to a difference between a first resistance of the first resistor at the temperature and a second resistance of the second resistor at the temperature.Type: ApplicationFiled: August 4, 2022Publication date: February 8, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sin-I Du, Sui-An Yen, Chih-Pin Hung, Chang-Yu Huang, Chung-Liang Cheng
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Publication number: 20240006922Abstract: A method and apparatus for controlling an intermediate resonant circuit in a wireless power or IPT system includes regulating a secondary with which the intermediate circuit is magnetically coupled so as to control the VA in the intermediate resonant circuit and to control magnetic leakage fields.Type: ApplicationFiled: July 13, 2023Publication date: January 4, 2024Inventors: Grant Anthony COVIC, Chang-Yu HUANG, Ahmed BILAL, Duleepa Jayanath THRIMAWITHANA
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Publication number: 20230261038Abstract: A capacitor structure is provided. The capacitor structure includes a first electrode and a second electrode. The first electrode includes a first segment and a third segment. The second electrode includes a second segment and a fourth segment, the second segment is interposed between the first segment and the third segment, and the third segment is interposed between the second segment and the fourth segment. A first distance is between the first segment and the second segment, and a second distance between the second segment and the third segment. The first distance is different from the second distance.Type: ApplicationFiled: February 14, 2022Publication date: August 17, 2023Inventors: CHANG-YU HUANG, YI HSUAN LIN, CHIH-PIN HUNG
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Patent number: 11167733Abstract: A device for inflating a tire includes a forward sleeve including an internally threaded head; an air intake assembly including a joining member secured to the forward sleeve and having a constricted section and an air inlet; an air intake extending out of the joining member at an acute angle and having an air channel for communicating with the air inlet through the constricted section, and a connector; and a rear sleeve secured to the joining member; and a valve assembly including a rod through both the rear sleeve and the joining member; a mounting sleeve in the forward sleeve and having a groove at a first end, the groove being in the internally threaded head, and a fitting hole communicating with the groove; a flexible tubular member in the mounting sleeve; a handle secured to the rod; and a snap ring on the rod.Type: GrantFiled: November 4, 2020Date of Patent: November 9, 2021Assignee: JINDAI AUTO SUPPLIES CO., LTDInventors: Jui Meng Huang, Yen Chun Huang, Chang Yu Huang
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Publication number: 20210129605Abstract: A device for inflating a tire includes a forward sleeve including an internally threaded head; an air intake assembly including a joining member secured to the forward sleeve and having a constricted section and an air inlet; an air intake extending out of the joining member at an acute angle and having an air channel for communicating with the air inlet through the constricted section, and a connector; and a rear sleeve secured to the joining member; and a valve assembly including a rod through both the rear sleeve and the joining member; a mounting sleeve in the forward sleeve and having a groove at a first end, the groove being in the internally threaded head, and a fitting hole communicating with the groove; a flexible tubular member in the mounting sleeve; a handle secured to the rod; and a snap ring on the rod.Type: ApplicationFiled: November 4, 2020Publication date: May 6, 2021Inventors: JUI MENG HUANG, YEN CHUN HUANG, CHANG YU HUANG
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Publication number: 20210129602Abstract: A tire pressure gauge includes a first tube having a first end secured to a connector; a joining member having a first end secured to a second end of the first tube; a check valve in the joining member and including and air outlet and an air inlet configured to be in fluid communication between the first tube and the air outlet; a spring biased pressure relief device projecting out of the joining member; a second tube threadedly secured to a second end of the joining member; a plunger in a first end of the second tube; a compression spring in the second tube and biased between the plunger and a second end of the second tube; and a rod-shaped measuring device through the compression spring, the measuring device having a first end secured to the plunger and a second end extending out of the second tube.Type: ApplicationFiled: November 4, 2020Publication date: May 6, 2021Inventors: JUI MENG HUANG, YEN CHUN HUANG, CHANG YU HUANG
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Patent number: 10903697Abstract: Certain aspects of the present disclosure provide methods and apparatus for multi-phase coil control in power transfer systems. One example power transfer device generally includes a plurality of coils configured to generate at least one charging field, the plurality of coils comprising a first coil and a second coil, and a controller configured to identify that a coupling factor between the first coil and a third coil, which is external to the power transfer device, is at or below a threshold, and to adjust, based on the identification, one or more parameters associated with a current applied to the first coil to transfer power from the first coil to the second coil.Type: GrantFiled: March 19, 2019Date of Patent: January 26, 2021Assignee: WiTricity CorporationInventors: Chang-Yu Huang, Mickel Bipin Budhia, Michael Le Gallais Kissin, Jonathan Beaver, Nicholas Athol Keeling
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Patent number: 10886786Abstract: In certain aspects, methods and systems for controlling power transfer at a wireless power receiver are disclosed. In certain aspects, a method includes determining a duty cycle of a DC-DC converter of the wireless power receiver. The method further includes determining a duty cycle limit for an AC switching controller based on the determined duty cycle. The method further includes determining an operational duty cycle for the AC switching controller. The method further includes comparing the operational duty cycle to the duty cycle limit. The method further includes adjusting at least one of a desired voltage and current input to the DC-DC converter when the operational duty cycle is greater than the duty cycle limit.Type: GrantFiled: September 6, 2019Date of Patent: January 5, 2021Assignee: WiTricity CorporationInventors: Chang-Yu Huang, Michael Le Gallais Kissin, Jonathan Beaver
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Patent number: 10860769Abstract: An integrated circuit (IC) design method includes receiving a spatial correlation matrix, R, of certain property of post-fabrication IC devices; and deriving a random number generation function g(x, y) such that random numbers for a device at a coordinate (x, y) can be generated by g(x, y) independent of other devices, and all pairs of random numbers satisfy the spatial correlation matrix R. The method further includes receiving an IC design layout having pre-fabrication IC devices, each of the pre-fabrication IC devices having a coordinate and a first value of the property. The method further includes generating random numbers using the coordinates of the pre-fabrication IC devices and the function g(x, y); deriving second values of the property by applying the random numbers to the first values; and providing the second values to an IC simulation tool.Type: GrantFiled: December 19, 2019Date of Patent: December 8, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Katherine Chiang, Cheng Hsiao, Chang-Yu Huang, Juan Yi Chen, Ke-Wei Su, Chung-Kai Lin, Lester Chang, Min-Chie Jeng
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Patent number: 10797506Abstract: In certain aspects, methods and systems for converting DC power to AC power by a wireless power receiver are disclosed. Certain aspects provide a wireless power receiver including a resonant circuit. The wireless power receiver includes a first switching circuit coupled to the resonant circuit, the first switching circuit configured to act as an inverter and generate a first signal, based on an output from a battery, at a resonant frequency of the resonant circuit, the first signal having an envelope at a first frequency. The wireless power receiver includes a second switching circuit coupled to the resonant circuit that is configured to bias the second switching circuit at the resonant frequency in response to the first signal, wherein the second switching circuit is configured to act as a rectifier and is configured to extract the envelope to generate a second signal at half of the first frequency.Type: GrantFiled: April 5, 2018Date of Patent: October 6, 2020Assignee: WiTricity CorporationInventors: Edward Van Boheemen, Chang-Yu Huang, Michael Le Gallais Kissin
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Publication number: 20200303968Abstract: Certain aspects of the present disclosure provide methods and apparatus for multi-phase coil control in power transfer systems. One example power transfer device generally includes a plurality of coils configured to generate at least one charging field, the plurality of coils comprising a first coil and a second coil, and a controller configured to identify that a coupling factor between the first coil and a third coil, which is external to the power transfer device, is at or below a threshold, and to adjust, based on the identification, one or more parameters associated with a current applied to the first coil to transfer power from the first coil to the second coil.Type: ApplicationFiled: March 19, 2019Publication date: September 24, 2020Applicant: WiTricity CorporationInventors: Chang-Yu Huang, Mickel Bipin Budhia, Michael Le Gallais Kissin, Jonathan Beaver, Nicholas Athol Keeling
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Patent number: 10720277Abstract: Systems and methods are described for a ferrite arrangement that mitigates dimensional-tolerance effects on performance of a wireless charging pad, such as a WEVC pad. These systems and methods include a power-transfer structure having ferrite bars arranged to form ferrite strips in a staggered pattern to provide a path for magnetic flux induced by a magnetic field. The staggered pattern includes a series of ferrite strips that alternate defined starting-point locations at opposing sides of the power-transfer structure. Ending-point locations of the ferrite strips are not defined, but are based on an accumulation of lengthwise dimensional tolerances of the ferrite bars used to form the ferrite strips. Using the staggered pattern in a base power-transfer structure defines a coupling range for coupling with a vehicle power-transfer structure and a range limit for associated magnetic field emissions by the base power-transfer structure.Type: GrantFiled: September 8, 2017Date of Patent: July 21, 2020Assignee: WiTricity CorporationInventors: Mickel Bipin Budhia, Chang-Yu Huang, Nicholas Athol Keeling, Michael Le Gallais Kissin
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Patent number: 10668829Abstract: Systems and methods are described for a passive flux bridge for charging electric vehicles. These systems and methods include a mobile apparatus including mobility components and a material with high magnetic permeability and electrical resistivity. In aspects, the mobility components, e.g., wheels or continuous track, are configured to enable movement of the apparatus and positioning of the apparatus proximate to a vehicle power-transfer apparatus of an electric vehicle. The magnetically permeable and electrically resistive material, e.g., ferrite, is configured to passively channel magnetic flux between a base power-transfer system and the vehicle power-transfer system to wirelessly charge a battery of the electric vehicle.Type: GrantFiled: May 4, 2018Date of Patent: June 2, 2020Assignee: WiTricity CorporationInventors: William Henry Von Novak, III, Cody Wheeland, Jonathan Beaver, Xi Gong, Chang-Yu Huang, Martin Thienel
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Patent number: 10673274Abstract: A magnetic flux pad for receiving or generating magnetic flux. The pad includes two pole areas (11, 12) associated with a magnetically permeable core 14. Coils 17 define the pole areas. The pad allows useable flux to be generated at a significant height above a surface of the pad.Type: GrantFiled: April 30, 2015Date of Patent: June 2, 2020Assignee: AUCKLAND UNISERVICES LIMITEDInventors: John Talbot Boys, Chang-yu Huang, Grant Anthony Covic, Mickel Bipin Budhia
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Publication number: 20200125782Abstract: An integrated circuit (IC) design method includes receiving a spatial correlation matrix, R, of certain property of post-fabrication IC devices; and deriving a random number generation function g(x, y) such that random numbers for a device at a coordinate (x, y) can be generated by g(x, y) independent of other devices, and all pairs of random numbers satisfy the spatial correlation matrix R. The method further includes receiving an IC design layout having pre-fabrication IC devices, each of the pre-fabrication IC devices having a coordinate and a first value of the property. The method further includes generating random numbers using the coordinates of the pre-fabrication IC devices and the function g(x, y); deriving second values of the property by applying the random numbers to the first values; and providing the second values to an IC simulation tool.Type: ApplicationFiled: December 19, 2019Publication date: April 23, 2020Inventors: Katherine Chiang, Cheng Hsiao, Chang-Yu Huang, Juan Yi Chen, Ke-Wei Su, Chung-Kai Lin, Lester Chang, Min-Chie Jeng