Patents by Inventor CHANG-YU KUO

CHANG-YU KUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230411421
    Abstract: A semiconductor structure includes a first shallow trench isolation (STI) structure within a semiconductor substrate. The first STI structure includes a buffer structure, an adhesion structure, an electromagnetic reflection structure, and a fill structure. The adhesion structure is between and adhesively bonded to the buffer structure and the electromagnetic reflection structure. The electromagnetic reflection structure is between the adhesion structure and the fill structure to reflect electromagnetic radiation.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 21, 2023
    Inventors: Ching-Heng LIU, Chang Yu KUO, Ya-Wen WU
  • Publication number: 20090051563
    Abstract: An electronic device includes a main housing with a plurality of electronic components contained therein, and a remote controller configured for controlling the electronic components contained in the main housing. A receptacle is formed in the main housing and a charging unit is disposed in the main housing. The remote controller is detachably docked in the receptacle and configured for being charged by the charging unit when the remote controller is installed in the receptacle.
    Type: Application
    Filed: December 7, 2007
    Publication date: February 26, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHANG-YU KUO, JUNG-LIANG HUNG