Abstract: A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the isolating layers, followed by heating and pressurization processes to secure the metal foil onto the substrate.

Abstract: A method of fabricating a passive device on a printed circuit board. A first substrate and a second substrate are provided. Each of the first and the second substrates has an insulation core layer and a conductive layer on the insulation core layer. A dielectric layer is coated on the first substrate to cover a surface of the conductive layer thereon as an internal dielectric layer. The second substrate is laminated onto the internal dielectric layer, so that the conductive layers of the first and the second substrates are adjacent to the internal dielectric layer.

Abstract: A method of laminating copper foil onto a substrate of a printed circuit board, wherein the substrate has an upper surface and a lower surface. Isolating material is coated onto both surfaces of the substrate to form isolating layers on the substrate. The isolating layers can be formed by roll coating, spray coating or screen printing. The thickness of the isolating layers can be controlled in accordance to the requirements of the circuits. Various types of metal foils can be laminated onto the adhesive layers, followed by heating and pressurization processes to secure the metal foil onto the substrate.