Abstract: A method for forming a package structure and the package structure formed therefrom are described. The structure includes a first die, a second die, a third die and a filling material. The second and third dies are stacked on and bonded with the first die. The filling material is disposed on the first die and filled between the second and third dies. The first die, the second die and the third die are electrically connected and bonded, sidewalls of the first die are revealed, and at least one sidewall of the second die and at least one sidewall of the third die are revealed.

Abstract: An alkyl bisphenol composition and a method for preparing the same are provided. The alkyl bisphenol composition includes 99.85 wt % to 99.999 wt % of an alkyl bisphenol; 0.0001 wt % to 0.01 wt % of a monophenolic compound; 0.0001 wt % to 0.01 wt % of a reaction adduct of alkyl bisphenol; and 0.0001 wt % to 0.1497 wt % of an aromatic compound, wherein the aromatic compound is not the alkyl bisphenol, the monophenolic compound, or the reaction adduct of alkyl bisphenol.

Abstract: An electrocatalyst composition is provided. The electrocatalyst composition includes a carrier and active substances, including zinc and bismuth, deposited on the surface of the carrier. The weight ratio of zinc to bismuth is between 0.001 and 0.025. The surface of bismuth includes completely oxidized bismuth (Bi3+) and incompletely oxidized bismuth (Bi2+), and the ratio of the incompletely oxidized bismuth to the completely oxidized bismuth is between 0.005 and 0.25.

Abstract: Disclosed herein are nanoparticles and method for manufacturing the same. The nanoparticle is essentially composed of albumin and polyethylene glycol, wherein the albumin is covalently crosslinked with the polyethylene glycol.

Abstract: Disclosed herein are nanoparticles and method for manufacturing the same. The nanoparticle is essentially composed of albumin and polyethylene glycol, wherein the albumin is covalently crosslinked with the polyethylene glycol.

Abstract: A LED driver circuit, including a LED module, a bias circuit, a first switch, an inductor, a regulator, a controller, a second switch, and a current-to-voltage converter, is used to provide a load current for the LED module, wherein the bias circuit is biased by a first bias current and the regulator is biased by a second bias current, and the first bias current and the second bias current are drawn from the load current. Besides, the controller can be implemented with a low voltage controller.

Abstract: A LED driver circuit, including a LED module, a bias circuit, a first switch, an inductor, a regulator, a controller, a second switch, and a current-to-voltage converter, is used to provide a load current for the LED module, wherein the bias circuit is biased by a first bias current and the regulator is biased by a second bias current, and the first bias current and the second bias current are drawn from the load current. Besides, the controller can be implemented with a low voltage controller.

Abstract: An assembling device and method for mounting a second plate to a first plate is described. The assembling device is an alignment jig includes a first carrier plate having a first air channel and a first carrier area and a second carrier plate having a second air channel and a second carrier area. The first air channel is linked to the first carrier area and the first plate is on the first carrier area. The second carrier plate and the first carrier plate are joined together through a pivot and the second carrier plate is stacked over the first carrier plate. The second air channel is linked to the second carrier area. The second plate is over the second carrier area. The second carrier plate or the first carrier plate has a third air channel and the corresponding second or third plate has an opening exposing the third air channel.