Patents by Inventor Chang'an LI

Chang'an LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11997016
    Abstract: Embodiments of the present disclosure provide a routing control method, network device, and controller. The method may include the network device obtaining a route suppression request. The method may also include determining the second routing entry. Furthermore, the method may include setting a state of the second routing entry to a non-delivery state that is used to indicate that the second routing entry does not need to be delivered to a forwarding table. In the method, the network device may have a first routing entry and a second routing entry, an address prefix of the first routing entry is a first address prefix, an address prefix of the second routing entry is a second address prefix, a network segment to which the second address prefix belongs is a subset of a network segment to which the first address prefix belongs, and a mask in the second address prefix is greater than a mask in the first address prefix.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 28, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Shunwan Zhuang, Chang Wang, Nan Wu, Zhenbin Li, Hui Ni
  • Patent number: 11996342
    Abstract: A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation plate includes first through holes extended from the first upper surface to the first lower surface. The second heat dissipation plate has a second upper surface and a second lower surface. The second heat dissipation plate includes second through holes extended from the second upper surface to the second lower surface. The heat generating assemblies are disposed between the first heat dissipation plate and the second heat dissipation plate. The fixture components include fix screws and nuts. The fix screws penetrate through the first heat dissipation plate and the second heat dissipation plate along the first through holes and the second through holes.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hsiang Lao, Yuan-Sheng Chiu, Hung-Chi Li, Shih-Chang Ku, Tsung-Shu Lin
  • Publication number: 20240171513
    Abstract: Systems and methods are described for effectively managing and maintaining a communication network by monitoring communications to detect a loop condition, and effectively route the communication to one or more destinations known to reduce or eliminate the occurrence of a looping condition.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 23, 2024
    Inventors: Chia-Chang Li, Mohamed Barache, Robert Lambardia
  • Publication number: 20240165181
    Abstract: A composition for inhibiting intestinal permeability, treating leaky gut related diseases and/or preventing leaky gut related diseases including a Chinese herbal compound material or a Chinese herbal compound extract is provided. The Chinese herbal compound material includes Ganoderma, red jujube, longan and lotus seed. Moreover, the Chinese herbal compound extract includes a Ganoderma extract, a red jujube extract, a longan extract and a lotus seed extract.
    Type: Application
    Filed: June 1, 2023
    Publication date: May 23, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: I-Hong PAN, Kuei-Chang LI, Zong-Keng KUO, Chu-Hsun LU, Yen-Wu HSIEH, Shu-Fang WEN
  • Publication number: 20240171684
    Abstract: Methods and systems for routing voice over internet protocol (VOIP) are described. A service provider may provide a VOIP infrastructure for routing VOIP calls. One or more other service providers may join the VOIP infrastructure. A computing device may identify the service provider servicing the VOIP calls and may further process the calls accordingly.
    Type: Application
    Filed: January 29, 2024
    Publication date: May 23, 2024
    Inventors: Chia-Chang Li, Eric Wong, Vengatarajulu Rajasekar, Satish Sampangiramiah
  • Patent number: 11991662
    Abstract: Multiple user equipments (UEs) may initiate independent ranging sessions at nearly the same time and location and which may interfere with each other. A UE that receives multiple initial messages for ranging determines if there is temporal separation between the ranging sessions. The UE may further determine if there is geographic separation between the ranging sessions, e.g., the initiating UEs are separated. If separation is lacking, the UE separates available ranging signal properties, such as frequency bandwidth, timing instances, and identifiers, and communicates different sets of ranging signal properties to each initiating UE. The multiple ranging sessions may be performed using the different sets of ranging signal properties with less risk of interference.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: May 21, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Chang-Sik Choi, Kapil Gulati, Gene Wesley Marsh, Junyi Li
  • Patent number: 11988430
    Abstract: An air conditioning unit includes: a first refrigeration system including a first evaporator, a first compressor, a first condenser, a first one-way valve, and a first throttling element connected in sequence in a loop as well as a second one-way valve connected in parallel with the first compressor, and a first fluorine pump connected in parallel with the first one-way valve; and a second refrigeration system including a second evaporator, a second compressor, a second condenser, a third one-way valve, and a second throttling element connected in sequence in a loop as well as a fourth one-way valve connected in parallel with the second compressor, and a second fluorine pump connected in parallel with the third one-way valve, where the first evaporator and the second evaporator are arranged front and rear in sequence along a return air cooling duct.
    Type: Grant
    Filed: November 24, 2022
    Date of Patent: May 21, 2024
    Assignee: Vertiv Tech Co., Ltd.
    Inventors: Jie Guo, Sheng He, Chang Liu, Xiuling Li
  • Patent number: 11991109
    Abstract: In an aspect, an initiator transmits a positioning reference signal. The initiator receives a plurality of responder positioning reference signals sent from individual responders of a plurality of responders. The initiator transmits a measurement message comprising a first set of measurements that are determined based on the positioning reference signal and the plurality of responder positioning reference signals. The initiator receives responder measurement messages sent from the individual responders of the plurality of responders. The initiator receives updated map information from an anchor and updates pre-existing map information based on the updated map information.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: May 21, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Chang-Sik Choi, Kapil Gulati, Junyi Li
  • Patent number: 11991317
    Abstract: According to some embodiments, a method performed by a software defined wide area network (SD-WAN) controller communicably coupled to a voice gateway comprises determining a user profile from one or more stored user profiles is to be associated with an analog telephone and transmitting the user profile to the voice gateway. In particular embodiments, the SD-WAN controller may receive a request to associate the analog telephone with a user from the voice gateway.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: May 21, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Haitao Zhang, Chang-Ho Lin, Jing Li, Ming Lin Chen, Nanditha Shenoy
  • Patent number: 11990557
    Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 21, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang, Yi-Chang Chang
  • Publication number: 20240160306
    Abstract: A display panel, including an active area and a peripheral area, which is located outside of the active area, wherein the active area comprises a base substrate, and a display structure layer and a touch structure layer sequentially arranged on the base substrate; the peripheral area includes an isolation dam, a first ground trace and a second ground trace arranged on the base substrate; and the first ground trace is located at a side of the isolation dam close to the active area, and the second ground trace is located at a side of the isolation dam away from the active area.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 16, 2024
    Inventors: Chang LUO, Xiping LI, Hongwei MA, Ming HU, Wei HE, Youngyik KO, Haijun QIU, Yi ZHANG, Taofeng XIE, Tianci CHEN, Qun MA, Xinghua LI, Ping WEN, Yang ZHOU, Yuanqi ZHANG, Xiaoyan YANG, Shun ZHANG, Pandeng TANG, Yang ZENG, Tong ZHANG, Xiaofei HOU, Zhidong WANG, Haoyuan FAN, Jinhwan HWANG
  • Patent number: 11980844
    Abstract: The present invention relates to a method for carbon dioxide capture and concentration by partitioned multistage circulation based on mass transfer-reaction regulation. In the present invention, multiple means such as multistage circulating absorption, intelligent multi-factor regulation, pre-washing and cooling, inter-stage cooling, post-stage washing, slurry cleaning, cooling water waste heat utilization, small-particle-size and high-density spraying, external strengthening field such as a thermal field/ultrasonic field/electric field, and catalysis by composite catalyst are adopted, so that the target for low cost, low energy consumption, stability and high efficiency is realized. The secondary pollutants are effectively inhibited while carbon dioxide is efficiently captured; meanwhile, high-efficiency capture, low-energy desorption, and high-purity concentration of carbon dioxide are implemented.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: May 14, 2024
    Assignee: ZHEJIANG UNIVERSITY
    Inventors: Xiang Gao, Chenghang Zheng, Chang Liu, Can Zhou, You Zhang, Zhongyang Zhao, Yongxin Zhang, Yang Zhang, Qinwu Li, Weiguo Weng, Weihong Wu, Qingyi Li, Xiao Zhang, Tao Wang
  • Patent number: 11980440
    Abstract: There is provided a physiological detection device including a light source, a light detector, a processing unit and a display device. The light source emits light to illuminate a skin surface. The light detector receives the light from the skin surface to output detected signals. The processing unit confirms an attached state according to the detected signals and controls the display device to show an indication signal or a warning message when the attached state is confirmed not good.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: May 14, 2024
    Assignee: PIXART IMAGING INC.
    Inventors: Ming-Chang Li, Ren-Hau Gu
  • Publication number: 20240152266
    Abstract: Provided are a terminal control method, system and apparatus, a computer device, and a storage medium. The method comprises: establishing connection with a controlled terminal; acquiring a first interaction interface of the controlled terminal; displaying a second interaction interface, wherein the second interaction interface matches the first interaction interface of the controlled terminal; receiving a touch-control operation of a user on the second interaction interface; according to the touch-control operation, controlling the controlled terminal to perform a touch control response; acquiring a first touch-control response interface of the controlled terminal, wherein the first touch-control response interface is an interface displayed by the controlled terminal after performing a touch control response; and displaying a second touch-control response interface, wherein the second touch-control response interface matches the first touch-control response interface of the controlled terminal.
    Type: Application
    Filed: December 25, 2019
    Publication date: May 9, 2024
    Inventors: Ren XU, Ning ZHAO, Feng ZHOU, Kefeng LI, Chang WU, Wei WANG
  • Patent number: 11978729
    Abstract: A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a package substrate having a first surface and a second surface opposite to the first surface. Several integrated devices are bonded to the first surface of the package substrate. A first underfill element is disposed over the first surface and surrounds the integrated devices. A first molding layer is disposed over the first surface and surrounds the integrated devices and the first underfill element. A semiconductor die is bonded to the second surface of the package substrate. A second underfill element is disposed over the second surface and surrounds the semiconductor die. A second molding layer is disposed over the second surface and surrounds the semiconductor die and the second underfill element. Several conductive bumps are disposed over the second surface and adjacent to the second molding layer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu
  • Publication number: 20240145691
    Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.
    Type: Application
    Filed: March 14, 2023
    Publication date: May 2, 2024
    Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
  • Publication number: 20240143699
    Abstract: A consensus graph learning-based multi-view clustering method includes: S11, inputting an original data matrix to obtain a spectral embedding matrix; S12, calculating a similarity graph matrix and a Laplacian matrix based on the spectral embedding matrix; S13, applying spectral clustering to the calculated similarity graph matrix to obtain spectral embedding representations; S14, stacking inner products of the normalized spectral embedding representations into a third-order tensor and using low-rank tensor representation learning to obtain a consistent distance matrix; S15, integrating spectral embedding representation learning and low-rank tensor representation learning into a unified learning framework to obtain a objective function; S16, solving the obtained objective function through an alternative iterative optimization strategy; S17, constructing a consistent similarity graph based on the solved result; and S18, applying spectral clustering to the consistent similarity graph to obtain a clustering resul
    Type: Application
    Filed: December 7, 2021
    Publication date: May 2, 2024
    Applicant: ZHEJIANG NORMAL UNIVERSITY
    Inventors: Xinzhong ZHU, Huiying XU, Zhenglai LI, Chang TANG, Jianmin ZHAO
  • Publication number: 20240145448
    Abstract: A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a package substrate having a first surface and a second surface opposite to the first surface. Several integrated devices are bonded to the first surface of the package substrate. A first underfill element is disposed over the first surface and surrounds the integrated devices. A first molding layer is disposed over the first surface and surrounds the integrated devices and the first underfill element. A semiconductor die is bonded to the second surface of the package substrate. A second underfill element is disposed over the second surface and surrounds the semiconductor die. A second molding layer is disposed over the second surface and surrounds the semiconductor die and the second underfill element. Several conductive bumps are disposed over the second surface and adjacent to the second molding layer.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Heh-Chang HUANG, Fu-Jen LI, Pei-Haw TSAO, Shyue-Ter LEU
  • Publication number: 20240147629
    Abstract: A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Applicants: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd., Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD.
    Inventors: CHANG-HE ZHU, YANG LI, JIAN WANG, LI-KUN LIU, YAN-LU LI
  • Patent number: D1025392
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: April 30, 2024
    Assignee: ACON BIOTECH (HANGZHOU) CO.LTD.
    Inventors: Zheng Jun Cai, Fang Li Tong, Yu Jiao Du, Chang Fu Yang, Yong Ling Fan