Abstract: Disclosed is a method for manufacturing gas cylinders. The disclosed method for manufacturing gas cylinders comprises: a) a step of producing a liner using a liner blower machine; b) a step of applying an adhesive to the threads of the produced liner; c) a step of coupling a bushing to the threads of the liner; d) a step of leaving the liner having undergone step c) for 30 minutes to 2 hours at room temperature so as to naturally harden the adhesive; e) a liner-flaming step of heat-treating the outer surface of the liner with plasma; f) a step of coupling a shaft to the liner; g) a winding step of mixing multiple fiberglass strands with a resin and a hardening agent, and wrapping the mixture around the outer surface of the liner; h) a dry-hardening step of drying the cylinder made of the composite material and having undergone the winding step for 70 to 90 minutes at a temperature of 70° C. to 90° C.

Abstract: A lens barrel may be detachably coupled to a capturing device may comprise a first lens assembly having first lenses mounted therein. A second lens assembly may be coupled to the first lens assembly and may have second lenses mounted therein. The second lenses may be aligned with the first lenses along an optic axis, and an adjusting portion may be provided in the first lens assembly and may be configured to adjust a position of the first lenses relative to the second lenses along a direction the optic axis by an electromagnetic force.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.

Abstract: Disclosed is a method for manufacturing gas cylinders. The disclosed method for manufacturing gas cylinders comprises: a) a step of producing a liner using a liner blower machine; b) a step of applying an adhesive to the threads of the produced liner; c) a step of coupling a bushing to the threads of the liner; d) a step of leaving the liner having undergone step c) for 30 minutes to 2 hours at room temperature so as to naturally harden the adhesive; e) a liner-flaming step of heat-treating the outer surface of the liner with plasma; f) a step of coupling a shaft to the liner; g) a winding step of mixing multiple fiberglass strands with a resin and a hardening agent, and wrapping the mixture around the outer surface of the liner; h) a dry-hardening step of drying the cylinder made of the composite material and having undergone the winding step for 70 to 90 minutes at a temperature of 70° C. to 90° C.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: Disclosed are a method of folding multiple filaments and a bundle of filament produced by the same. More particularly, the method of folding multiple filaments includes release-winding the filaments under a uniform release-winding tension, folding the released filaments in non-twisted states and winding the folded filaments to produce a bundle of filament, so as to effectively prevent some of the filaments in the bundle of filament from hanging down or becoming loose due to different tensions when the bundle of filament is release-wound for post processing. The bundle of filaments includes a plurality of filaments combined together in a non-twisted manner and has highly uniform weight of the filaments per unit length of the bundle of filament, wherein the standard deviation of the weight of each filament ranges from 0.0001 to 0.01 from their average weight.

Abstract: A lens barrel assembly, a camera including the lens barrel assembly, and a method of assembling a lens barrel are disclosed. The lens barrel assembly is provided that includes an optical lens, a unitary barrel having an outlet slit defined therethrough, and a flexible printed circuit board extending through the outlet slit to communicate signals between an area inside the barrel and an area outside the barrel.

Abstract: Disclosed are a method of folding multiple filaments and a bundle of filament produced by the same. More particularly, the method of folding multiple filaments includes release-winding the filaments under a uniform release-winding tension, folding the released filaments in non-twisted states and winding the folded filaments to produce a bundle of filament, so as to effectively prevent some of the filaments in the bundle of filament from hanging down or becoming loose due to different tensions when the bundle of filament is release-wound for post processing. The bundle of filaments includes a plurality of filaments combined together in a non-twisted manner and has highly uniform weight of the filaments per unit length of the bundle of filament, wherein the standard deviation of the weight of each filament ranges from 0.0001 to 0.01 from their average weight.

Abstract: Disclosed are a method of folding multiple filaments and a bundle of filament produced by the same. More particularly, the method of folding multiple filaments includes release-winding the filaments under a uniform release-winding tension, folding the released filaments in non-twisted states and winding the folded filaments to produce a bundle of filament, so as to effectively prevent some of the filaments in the bundle of filament from hanging down or becoming loose due to different tensions when the bundle of filament is release-wound for post processing. The bundle of filament includes a plurality of filaments folded together in non-twisted states and has a standard deviation in weight of the filaments per unit length of the bundle of filament ranging from 0.0001 to 0.01.

Abstract: An optical assembly and/or a photographing apparatus including a lens mounting member on which at least one lens is mounted; a transfer portion for moving the lens mounting member; a guide member for guiding a movement of the lens mounting member; a base member on which the transfer portion and the guide member are arranged; and a lens cap apparatus having at least one barrier for opening and closing an optical path passing through the at least one lens, wherein the lens cap apparatus is configured to open and close the barrier by contact with the guide member when the lens cap apparatus is moved closer to or farther from the base member.

Abstract: A lens barrel assembly, a camera including the lens barrel assembly, and a method of assembling a lens barrel are disclosed. The lens barrel assembly is provided that includes an optical lens, a unitary barrel having an outlet slit defined therethrough, and a flexible printed circuit board extending through the outlet slit to communicate signals between an area inside the barrel and an area outside the barrel.

Abstract: Disclosed are wholly aromatic polyamide filament and a method of manufacturing the same, characterized in that, in a process of preparing wholly aromatic polyamide polymer, a multiple tubular feed pipe for polymeric monomer and polymerization solvent with specific construction of adjacent inner paths 11a and outer paths 11b which are alternately arranged one another is used to feed either aromatic diacid chloride A or aromatic diamine dissolved in the polymerization solvent B into a polymerization reactor 20 through corresponding one among the inner and outer paths 11a and 11b. The present invention is effective to progress uniform and homogeneous polymerization over all of area of a polymerization reactor 20 leading to reduction of deviation in degree of polymerization, since polymeric monomers are miscible and react together very well immediately after putting the monomers into the reactor 20.

Abstract: Disclosed are wholly aromatic polyamide filament and a method of manufacturing the same, characterized in that, in a process of preparing wholly aromatic polyamide polymer, a multiple tubular feed pipe for polymeric monomer and polymerization solvent with specific construction of adjacent inner paths 11a and outer paths 11b which are alternately arranged one another is used to feed either aromatic diacid chloride A or aromatic diamine dissolved in the polymerization solvent B into a polymerization reactor 20 through corresponding one among the inner and outer paths 11a and 11b. The present invention is effective to progress uniform and homogeneous polymerization over all of area of a polymerization reactor 20 leading to reduction of deviation in degree of polymerization, since polymeric monomers are miscible and react together very well immediately after putting the monomers into the reactor 20.

Abstract: A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.

Abstract: A lens barrel assembly and a camera including the lens barrel assembly are provided. The lens barrel assembly includes a barrel case accommodating at least one optical lens, and a flexible printed circuit board (FPCB) configured to transmit signals between an area inside of the barrel case and an area outside of the barrel case. The barrel case comprises an outlet slit formed in the barrel case. The outlet slip being configured for extending the flexible printed circuit board to the area outside of the barrel case. Accordingly, the lens barrel assembly has an improved extension structure for extending the flexible printed circuit board which is configured to transmit signals between the inside and the outside of the lens barrel assembly.

Abstract: A camera having a detachable lens is provided. More particularly, the camera includes a main body and a lens module configured so that it can be mounted to or detached from the main body according to a rotating state of the lens module with respect to the main body. The camera also includes a first coupling structure that is configured to provide the lens module with coupling when the lens module is set to a mounting position. The camera also includes a secondary coupling structure that is configured to provide the lens module with temporary coupling when the lens module is set to a detaching position. As a result of this structure, an unwanted dropping of the lens module due to an instant loss of supporting force when the lens module is detached from the main body may be prevented.

Abstract: An optical assembly and/or a photographing apparatus including a lens mounting member on which at least one lens is mounted; a transfer portion for moving the lens mounting member; a guide member for guiding a movement of the lens mounting member; a base member on which the transfer portion and the guide member are arranged; and a lens cap apparatus having at least one barrier for opening and closing an optical path passing through the at least one lens, wherein the lens cap apparatus is configured to open and close the barrier by contact with the guide member when the lens cap apparatus is moved closer to or farther from the base member.

Abstract: A digital photographing apparatus and a moving picture capturing method performed by the same, and more particularly to, a removal of noise of a digital photographing apparatus from sound of a moving picture when the moving picture is being captured. The method of photographing a moving picture performed by a digital photographing apparatus, the method including: executing a moving picture shooting mode; generating an operation control signal; operating the digital photographing apparatus according to the operation control signal; extracting an offset sound corresponding to the operation control signal; and combining a noise generated by the operation of the digital photographing apparatus and the offset sound.

Abstract: A lens barrel assembly and a camera including the lens barrel assembly are provided. The lens barrel assembly includes a barrel case accommodating at least one optical lens, and a flexible printed circuit board (FPCB) configured to transmit signals between an area inside of the barrel case and an area outside of the barrel case. The barrel case comprises an outlet slit formed in the barrel case. The outlet slip being configured for extending the flexible printed circuit board to the area outside of the barrel case. Accordingly, the lens barrel assembly has an improved extension structure for extending the flexible printed circuit board which is configured to transmit signals between the inside and the outside of the lens barrel assembly.