Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.

Abstract: The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.

Abstract: A metal housing or casing for a thermal fuse (i.e., a thermal cut-off device) that has a multilayer metal construction including a copper-based layer, a first nickel layer disposed on a first side of the copper-based layer and including an outer surface of the casing, a second nickel layer disposed on a second side of the copper-based layer opposite to the first side of the copper-based layer, and a single silver layer disposed only on the second nickel layer and comprising the inner surface of the casing.

Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.

Abstract: Provided is a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound have low ionization potential, such as dibenzosuberenone. The solid pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 160° C. greater than the Tf. The aging performance is further enhanced. Further, methods of enhanced processing and pelletizing are provided.

Abstract: The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50° C. greater than the Tf. In certain variations, maximum dielectric capability temperature (Tcap) is greater than or equal to about 380° C.

Abstract: The present disclosure provides a pellet composition having enhanced thermal stability for use in a thermally-actuated, current cutoff device. Certain inorganic stability additive particles, such as silica, talc, and siloxane, can be mixed with one or more organic compounds to form a thermal pellet composition. A solid thermal pellet maintains its structural rigidity up to a transition temperature (Tf), but further has improved overshoot temperature ranges. Therefore, the improved thermal pellets have a maximum dielectric capability temperature (Tcap), above which the pellet composition may lose substantial dielectric properties and conducts current that is at least 50° C. greater than the Tf. In certain variations, maximum dielectric capability temperature (Tcap) is greater than or equal to about 380° C.