Patents by Inventor Changchao ZHANG

Changchao ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136535
    Abstract: An electrochemical device includes a negative electrode sheet. The negative electrode sheet includes a current collector, a first coating layer, and a second coating layer. The first coating layer is located between the current collector and the second coating layer. The second coating layer includes a negative active material. The first coating layer includes a conductive carbon material. The conductive carbon material includes at least one of carbon nanotubes or graphene. Based on a mass of the first coating layer, a mass percent of the conductive carbon material is 20% to 60%. The main material of the first coating layer is at least one of carbon nanotubes or graphene.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 25, 2024
    Applicant: Ningde Amperex Technology Limited
    Inventors: Changchao DU, Kefei WANG, Feng ZHOU, Qingwen ZHANG
  • Patent number: 11456409
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 27, 2022
    Assignee: JILIN UNIVERSITY
    Inventors: Zhiwu Han, Kejun Wang, Honglie Song, Junqiu Zhang, Daobing Chen, Linpeng Liu, Binjie Zhang, Tao Sun, Dakai Wang, Changchao Zhang
  • Publication number: 20220227098
    Abstract: A bionic nested structure fiber composite material includes a first fiber resin layer and a second fiber resin layer which are arranged in parallel, the first fiber resin layer and the second fiber resin layer are formed by a fiber bundle infiltrated with resin, and a bonded fiber unit is arranged between the first fiber resin layer and the second fiber resin layer, the bonded fiber unit are evenly distributed in a radial direction and a weft direction, the bonded fiber unit includes an inner core layer bonded fiber bundle, a middle core layer bonded fiber bundle and an outer core layer bonded fiber bundle, and the bonded fiber unit is performed 3D integrated layer-by-layer inner and outer nesting-and-weaving to form bionic nested structure.
    Type: Application
    Filed: January 19, 2022
    Publication date: July 21, 2022
    Inventors: Zhiwu HAN, Yujiao LI, Shichao NIU, Binjie ZHANG, Qigang HAN, Zhiyan ZHANG, Yufei WANG, Wenda SONG, Xiaojing QIN, Zhibin JIAO, Hao XUE, Changchao ZHANG, Xiancun MENG, Tao SUN
  • Publication number: 20210175411
    Abstract: A micro-vibration sensor and preparation method thereof. The method includes a metal sheet is coated with first curing material, and first curing material is cured into first cured layer; piezoelectric thin film element is attached to edge of first cured layer; one side, attached with piezoelectric thin film element, of first cured layer is vertically placed into second curing material, and second curing material is cured into second cured layer; and metal sheet is removed to obtain micro-vibration sensor. Due to fact that piezoelectric thin film element is arranged at a crack tip, during micro-vibration, stress in stress field of crack tip is rapidly increased due to crack stress deformation, and stress signal is efficiently converted into electric signal; and micro-vibration sensor has characteristics of being low in detection limit and high in accuracy.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 10, 2021
    Applicant: JILIN UNIVERSITY
    Inventors: Zhiwu HAN, Kejun WANG, Honglie SONG, Junqiu ZHANG, Daobing CHEN, Linpeng LIU, Binjie ZHANG, Tao SUN, Dakai WANG, Changchao ZHANG