Abstract: A busbar structure with less stray inductance for a power module includes a radiator, a copper-clad ceramic substrate, a wafer, a plastic case, a positive busbar, a negative busbar and a potting compound. The copper-clad ceramic substrate is welded on the radiator. The wafer is welded on the copper-clad ceramic substrate. The plastic case is fixed on the radiator. The positive and negative busbars are packaged in the plastic case, and fixed on the copper-clad ceramic substrate by ultrasonic bonding. An electrical clearance between wafers as well as an electrical clearance between the positive and negative busbars are ensured by potting. A part of the positive busbar covers a part of the negative busbar. The part of the positive busbar and the part of the negative busbar extend from the inside of the plastic case to the outside of the plastic case.

Abstract: Organic intermediate synthesis, and provides a method for light-promoted oxidation of a compound containing a saturated carbon-hydrogen bond, comprising mixing a compound containing a saturated carbon-hydrogen bond with a catalyst, and oxidizing the compound containing a saturated carbon-hydrogen bond in an oxygen or air atmosphere at a temperature of 20° C. to 100° C. under light irradiation to generate an oxidation product. A method for the light-promoted direct oxidation of a compound containing a saturated carbon-hydrogen bond, which only requires a relatively low temperature to be carried out, has good compatibility with functional groups, short reaction time, high reaction efficiency, low reaction costs, high added value, simple operation and good safety, and is a mild, green and environmentally friendly oxidation method.

Abstract: A heat dissipation structure of a cooling plate for a power semiconductor module includes a power chip, a first solder layer, a copper-clad ceramic substrate, a second solder layer and a cooling plate body. The power chip, the first solder layer, the copper-clad ceramic substrate, the second solder layer and the cooling plate body arranged sequentially from top to bottom. The heat dissipation structure further includes a straight rib mechanism arranged on a bottom surface of the cooling plate body, and a pin rib mechanism arranged on a surface of the straight rib mechanism.

Abstract: A busbar structure with less stray inductance for a power module includes a radiator, a copper-clad ceramic substrate, a wafer, a plastic case, a positive busbar, a negative busbar and a potting compound. The copper-clad ceramic substrate is welded on the radiator. The wafer is welded on the copper-clad ceramic substrate. The plastic case is fixed on the radiator. The positive and negative busbars are packaged in the plastic case, and fixed on the copper-clad ceramic substrate by ultrasonic bonding. An electrical clearance between wafers as well as an electrical clearance between the positive and negative busbars are ensured by potting. A part of the positive busbar covers a part of the negative busbar. The part of the positive busbar and the part of the negative busbar extend from the inside of the plastic case to the outside of the plastic case.