Abstract: Provided is an electronic package, in which a heat dissipating body is formed on an electronic device and is combined with a heat sink so that the electronic device, the heat dissipating body and the heat sink form a receiving space, and a heat dissipating material is formed in the receiving space and in contact with the heat sink and the electronic device, where a fluid regulating space is formed between the heat dissipating material and the heat dissipating body and is used as a volume regulating space for the heat dissipating material during thermal expansion and contraction.

Abstract: Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled with a filling material to prevent solder material from permeating along surfaces of the insulating protection layer and the electric contact pads, thereby eliminating the phenomenon of solder extrusion. Thus, bridging in the substrate structure can be eliminated even when the bump pitch between two adjacent electrical contact pads is small. As a result, short circuits can be prevented, and production yield can be increased.

Abstract: The present invention discloses a cup cover covering a cup that includes a thin film to seal a top opening of the cup. The cup cover includes an advertisement printed thereon. In a preferred embodiment, the advertisement printed on the thin film sealing the top opening of the cup further includes a special color commonly associated with a name brand for highlighting the advertisement for the name brand. In another preferred embodiment, the thin film for sealing the top opening of the cup further comprising a small breakable area for inserting a straw therein. In another preferred embodiment, the thin film for sealing the top opening of the cup further includes a pull up tap for pulling up the thin film for opening the top opening. In another preferred embodiment, the thin film for sealing the top opening of the cup further includes a pull up tap for pulling up a portion of the thin film to function as a drinking opening on the thin film.