Abstract: An embodiment roof reinforcement structure for a vehicle includes side body structures disposed on both sides of a vehicle body along a front to rear direction of the vehicle body, each of the side body structures including front and rear quarter completements at a front and a rear of the vehicle body, respectively, and a roof side inner member and a roof side panel connecting the front and rear quarter completements, a roof side inner bracket connected to the roof side inner member, a roof side outer assembly connected to the roof side inner bracket, and a roof side outer reinforcement member connected to the roof side inner bracket, the roof side outer assembly, and at least one of the front or the rear quarter completement on one of the sides of the vehicle body.

Abstract: An embodiment roof structure for a vehicle includes a plurality of roof rail assemblies disposed along a vehicle width direction of a vehicle body and connected to a pair of side structures that are disposed on each side of the vehicle body along a front to rear direction of the vehicle body and a roof module connected to the plurality of roof rail assemblies.

Abstract: A rear vehicle body structure of a vehicle including an underbody and an upper body coupled to the underbody is provided. The rear vehicle body structure includes a rear floor panel provided in a rear part of the upper body and coupled to the rear part of the underbody, the rear floor panel including forming parts extending in a vertical direction from both sides of the vehicle, respectively.

Abstract: A method and structure for reducing the size of semiconductor package is disclosed. In one example embodiment, a method for stacking dies of a semiconductor package includes forming a set of insulated bonding wires between respective bonding pads of a first semiconductor integrated circuit die and a conductive layer electrically detached from the respective bonding pads, applying an adhesive material on a top surface of the first semiconductor integrated circuit die, and securing a second semiconductor integrated circuit die one the top surface of the first semiconductor integrated circuit die with the adhesive material.

Abstract: A method and structure for reducing the size of semiconductor package is disclosed. In one example embodiment, a method for stacking dies of a semiconductor package includes forming a set of insulated bonding wires between respective bonding pads of a first semiconductor integrated circuit die and a conductive layer electrically detached from the respective bonding pads, applying an adhesive material on a top surface of the first semiconductor integrated circuit die, and securing a second semiconductor integrated circuit die one the top surface of the first semiconductor integrated circuit die with the adhesive material.