Abstract: A semiconductor component manufacturing method includes preparing a thin device layer having a first semiconductor component element formed on one surface thereof, placing the device layer on a front-side support substrate such that the one surface of the device layer is in direct contact with the front-side support substrate, forming a second semiconductor component element on an opposite surface of the device layer facing away from the one surface, and separating the device layer from the front-side support substrate, wherein, in placing the device layer on the front-side support substrate, the device layer is fixed to the front-side support substrate by a van der Waals force acting between the device layer and the front-side support substrate.

Abstract: An adhesive gripper for pick-and-place maneuvers comprises one or more legs, where each leg terminates in a foot rotatably connected to the respective leg. Each foot includes a SMP dry adhesive comprising a shape memory polymer, and a rigid backing layer attached to a back side of the SMP dry adhesive, such that a front side of the SMP dry adhesive is available for attachment and release of objects. The adhesive gripper further includes a handle portion connected to the one or more legs, a release mechanism comprising a release ring within the handle portion, and one or more releasing rods integrated with the one or more legs for release of an object onto a substrate.

Abstract: A dry adhesive for attachment to a flexible adherend comprises a shape memory polymer having a glass transition temperature (Tg) above 25° C. and a compliant backing layer attached to the shape memory polymer. The shape memory polymer is configured to form a conformal and/or hermetic contact with a flexible adherend at temperatures at or above the Tg and to retain the conformal and/or hermetic contact during flexing of the flexible adherend at temperatures below the Tg.

Abstract: A dry adhesive for attachment to a flexible adherend comprises a shape memory polymer having a glass transition temperature (Tg) above 25° C. and a compliant backing layer attached to the shape memory polymer.

Abstract: An adhesive gripper for pick-and-place maneuvers comprises one or more legs, where each leg terminates in a foot rotatably connected to the respective leg. Each foot includes a SMP dry adhesive comprising a shape memory polymer, and a rigid backing layer attached to a back side of the SMP dry adhesive, such that a front side of the SMP dry adhesive is available for attachment and release of objects. The adhesive gripper further includes a handle portion connected to the one or more legs, a release mechanism comprising a release ring within the handle portion, and one or more releasing rods integrated with the one or more legs for release of an object onto a substrate.