Abstract: A chip-on-film (COF) package structure includes a first COF and a second COF. The first COF includes a first flexible substrate having a first external terminal and a first internal terminal opposite to each other, first outer leads disposed at the first external terminal, first inner leads disposed at the first internal terminal, and a first chip disposed between the first external terminal and the first internal terminal. The second COF includes a second flexible substrate having a second external terminal and a second internal terminal opposite to each other, second outer leads disposed at the second external terminal, second inner leads disposed at the second internal terminal, and a second chip disposed between the second external terminal and the second internal terminal. The first COF is partially overlapped with the second COF. A display device having the COF package structure is also provided.

Abstract: A chip-on-film (COF) package structure includes a first COF and a second COF. The first COF includes a first flexible substrate having a first external terminal and a first internal terminal opposite to each other, first outer leads disposed at the first external terminal, first inner leads disposed at the first internal terminal, and a first chip disposed between the first external terminal and the first internal terminal. The second COF includes a second flexible substrate having a second external terminal and a second internal terminal opposite to each other, second outer leads disposed at the second external terminal, second inner leads disposed at the second internal terminal, and a second chip disposed between the second external terminal and the second internal terminal. The first COF is partially overlapped with the second COF. A display device having the COF package structure is also provided.

Abstract: A liquid crystal display includes a pixel array, a gate driver, a data driver, a common voltage source, and a current duplication module. The gate driver is used to turn on a plurality of rows of pixels in the pixel array in sequence. The data driver is used to provide a plurality of data voltages to the turned-on pixels in the pixel array. The common voltage source is used to provide a common voltage. The current duplication module is coupled to a first side and a second side of the pixel array and is used to input two substantially equal currents to the first side and the second side of the pixel array respectively to provide the common voltage to the first side and the second side of the pixel array.

Abstract: A liquid crystal display includes a pixel array, a gate driver, a data driver, a common voltage source, and a current duplication module. The gate driver is used to turn on a plurality of rows of pixels in the pixel array in sequence. The data driver is used to provide a plurality of data voltages to the turned-on pixels in the pixel array. The common voltage source is used to provide a common voltage. The current duplication module is coupled to a first side and a second side of the pixel array and is used to input two substantially equal currents to the first side and the second side of the pixel array respectively to provide the common voltage to the first side and the second side of the pixel array.

Abstract: A heat sink vacuum packaging procedure to rapidly complete the packaging of a heat sink without drilling, pipe welding, vacuum pumping, or other processes. Because the packaging procedure saves much time and labor, the manufacturing cost of the heat sink is relatively reduced. During packaging, no welding process is employed, therefore the invention prevents accidentally flowing of tin solder into the inside of the heat sink to affect the quality of the heat sink, and the quality of the heat sink is maintained.

Abstract: A heat sink vacuum packaging procedure to rapidly complete the packaging of a heat sink without drilling, pipe welding, vacuum pumping, or other processes. Because the packaging procedure saves much time and labor, the manufacturing cost of the heat sink is relatively reduced. During packaging, no welding process is employed, therefore the invention prevents accidentally flowing of tin solder into the inside of the heat sink to affect the quality of the heat sink, and the quality of the heat sink is maintained.