Abstract: An electronic device is provided. The electronic device includes a first support member partially including a thermally conductive material, a printed circuit board arranged to face the first support member, an integrated circuit chip arranged between the first support member and the printed circuit board, arranged on one surface of the printed circuit board, a solid-state thermal interface material (TIM) with compressibility, of which a portion of one surface is in contact with the integrated circuit chip and a portion of the other surface is in contact with the first support member, to transfer heat between the integrated circuit chip and the first support member, and a shielding film which is arranged between the TIM and the first support member and partially attached to the TIM and provides a first opening allowing a portion of the other surface of the TIM to be attached to the first support member.

Abstract: An electronic device according to one embodiment may comprise a printed circuit board, a processor on the printed circuit board, a vapor chamber which is spaced apart from the printed circuit board, and of which at least a portion is disposed on the processor, and a metal plate on the printed circuit board, including a seating groove accommodating at least a portion of the vapor chamber. The vapor chamber can include a plurality of pillars having flat ends. The plurality of pillars can include a first set of pillars having a first pattern included in a portion of the vapor chamber, and a second set of pillars having a second pattern included in a different portion of the vapor chamber, the second pattern being different from the first pattern.

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

Abstract: According to one embodiment of the present invention, an electronic apparatus can comprises: at least one antenna; a first circuit for wirelessly receiving or transmitting power by using at least one part of the at least one antenna; a second circuit for performing at least one communication by using at least one part of the at least one antenna; a first electrical path for connecting the at least one antenna to the first circuit; a second electrical path for connecting the at least one antenna to the second circuit; a third electrical path for connecting a point on the first electrical path to a point on the second electrical path; and at least one passive element or active element connected to at least one of the first electrical path, the second electrical path, and the third electrical path.

Abstract: According to one embodiment of the present invention, an electronic apparatus can comprises: at least one antenna; a first circuit for wirelessly receiving or transmitting power by using at least one part of the at least one antenna; a second circuit for performing at least one communication by using at least one part of the at least one antenna; a first electrical path for connecting the at least one antenna to the first circuit; a second electrical path for connecting the at least one antenna to the second circuit; a third electrical path for connecting a point on the first electrical path to a point on the second electrical path; and at least one passive element or active element connected to at least one of the first electrical path, the second electrical path, and the third electrical path.