Abstract: A hot extrusion die for a special-shaped square pipe includes a die cavity sleeve with a special-shaped cavity. A hot extrusion mandrel is arranged in the die cavity sleeve. An area between the die cavity sleeve and the hot extrusion mandrel forms a die cavity hole. A first extrusion diversion hole and a second extrusion diversion hole are arranged below the die cavity hole. An integral centroid of the die cavity hole is located at a circle center of a radial cross section of the die cavity sleeve. Further disclosed is a hot extrusion integral forming method for a special-shaped square pipe, including: heating and expanding a blank material; heating the blank material again after expanding; performing hot extrusion on the blank material; and cooling the formed special-shaped square pipe in air to a room temperature, and inspecting surface quality and mechanical properties of the special-shaped square pipe.

Abstract: The present disclosure provides an organic thin film and a method for preparing the same, a display device, and an optical device, in which the method includes: providing a base substrate; forming an isomerization generating layer on the base substrate, the isomerization generating layer including a first region and a second region; adding a precursor solution on a surface of the isomerization generating layer away from the base substrate, and allowing surface energy of the second region to be greater than surface energy of the first region, so as to form the organic thin film from the precursor solution, the precursor solution being at least partially located in the second region.

Abstract: The present disclosure provides a backlight module assembly, structural adjustment method thereof and display device. The backlight module assembly includes a plastic frame, a film and an adjustment sheet. The plastic frame is presented in a box shape with an opening on the top, and has side walls and a bottom wall, and a space enclosed by the side walls and the bottom wall being a mounting groove. The film is arranged on the bottom wall and received within the mounting groove. The adjustment sheet is arranged on an inner side of the side wall of the mounting groove.

Abstract: The present disclosure provides an organic thin film and a method for preparing the same, a display device, and an optical device, in which the method includes: providing a base substrate; forming an isomerization generating layer on the base substrate, the isomerization generating layer including a first region and a second region; adding a precursor solution on a surface of the isomerization generating layer away from the base substrate, and allowing surface energy of the second region to be greater than surface energy of the first region, so as to form the organic thin film from the precursor solution, the precursor solution being at least partially located in the second region.

Abstract: The invention provides a printed circuit board and a detection method for detecting a connection between the printed circuit board and a flexible circuit board, and a display panel. The printed circuit board, through a connector provided thereon, is connected to a flexible circuit board, the printed circuit board is provided thereon with at least one first detection structure for matching with at least one second detection structure provided on the flexible circuit board, and whether or not a connection between the printed circuit board and the flexible circuit board is correct is determined by detecting matching between the first detection structures and the second detection structures. Pins of the printed circuit board may be correctly connected to pins of the flexible circuit board, and a case that short circuit occurs and thus the signal lines are damaged and burned can be avoided.

Abstract: The present disclosure provides a backlight module assembly, structural adjustment method thereof and display device. The backlight module assembly includes a plastic frame, a film and an adjustment sheet. The plastic frame is presented in a box shape with an opening on the top, and has side walls and a bottom wall, and a space enclosed by the side walls and the bottom wall being a mounting groove. The film is arranged on the bottom wall and received within the mounting groove. The adjustment sheet is arranged on an inner side of the side wall of the mounting groove.

Abstract: An array substrate and a manufacturing method thereof, a display panel and a driving method thereof, and a display device are provided in the present disclosure, in the field of displays. The array substrate includes a plurality of gate lines, a plurality of data lines, and a plurality of pixel units defined by the gate lines and the data lines in cross arrangement. The plurality of pixel units are arranged in an array. Each of the pixel units includes a thin film transistor. Each row of pixel units are connected to one corresponding gate line. Each row of pixel units comprise a plurality of pixel unit groups. Each pixel unit group comprises two pixel units of adjacent columns that are connected to one data line. Thin film transistors of the two pixel units in the pixel unit group are transistors of different types. When the array substrate reduces the number of the date lines by a half, there is no need to design two gate lines for one row of pixel units.

Abstract: The present disclosure relates to the field of display technologies, and provides a display device and a method for providing haptic feedbacks using the same. The display device comprises: a display assembly, wherein the display assembly comprises a display face and a non-display face opposite to the display face; a transducer; and a haptic engine. Specifically, the transducer is arranged on the non-display face of the display assembly, and configured to output a current with corresponding amplitude according to its own deformation. Furthermore, the haptic engine is electrically coupled to the transducer, and configured to generate different degrees of haptic feedbacks based on the amplitude of the current output by the transducer.

Abstract: The present disclosure relates to a dielectrically isolated semiconductor device and a method for manufacturing the same. The dielectrically isolated semiconductor device includes a semiconductor substrate, a first semiconductor layer above the semiconductor substrate, a second semiconductor layer above the first semiconductor layer, a semiconductor island in the second semiconductor layer, and a first dielectric isolation layer surrounding a bottom and sidewalls of the semiconductor island. The first dielectric isolation layer includes a first portion which is formed from a portion of the first semiconductor layer and extending along the bottom of the semiconductor island, and a second portion which is formed from a portion of the second semiconductor layer and extending along the sidewalls of the semiconductor island. The dielectrically isolated semiconductor devices needs no an SOI wafer and reduces manufacturing cost.

Abstract: The present disclosure provides a backlight module assembly, structural adjustment method thereof and display device. The backlight module assembly includes a plastic frame, a film and an adjustment sheet. The plastic frame is presented in a box shape with an opening on the top, and has side walls and a bottom wall, and a space enclosed by the side walls and the bottom wall being a mounting groove. The film is arranged on the bottom wall and received within the mounting groove. The adjustment sheet is arranged on an inner side of the side wall of the mounting groove.

Abstract: The present disclosure relates to the field of display technologies, and provides a display device and a method for providing haptic feedbacks using the same. The display device comprises: a display assembly, wherein the display assembly comprises a display face and a non-display face opposite to the display face; a transducer; and a haptic engine. Specifically, the transducer is arranged on the non-display face of the display assembly, and configured to output a current with corresponding amplitude according to its own deformation. Furthermore, the haptic engine is electrically coupled to the transducer, and configured to generate different degrees of haptic feedbacks based on the amplitude of the current output by the transducer.

Abstract: The present disclosure discloses a method and a system for setting working frequency band of a touch detection system. A method for setting working frequency band of a touch detection system includes the following steps of: collecting noise frequency spectrogram in a touch detection system of a touch apparatus in a normal operation mode; and, determining a frequency band which is within whole frequency band supported by the touch detection system and in which amplitude of the noise is less than a first threshold, according to the noise frequency spectrogram collected; and setting the frequency band in which amplitude of the noise is less than the first threshold to be effective working frequency band of the touch detection system. Meanwhile, the present disclosure also discloses a method and a system for suppressing noise in a touch detection system.

Abstract: The present disclosure relates to a dielectrically isolated semiconductor device and a method for manufacturing the same. The dielectrically isolated semiconductor device includes a semiconductor substrate, a first semiconductor layer above the semiconductor substrate, a second semiconductor layer above the first semiconductor layer, a semiconductor island in the second semiconductor layer, and a first dielectric isolation layer surrounding a bottom and sidewalls of the semiconductor island. The first dielectric isolation layer includes a first portion which is formed from a portion of the first semiconductor layer and extending along the bottom of the semiconductor island, and a second portion which is formed from a portion of the second semiconductor layer and extending along the sidewalls of the semiconductor island. The dielectrically isolated semiconductor devices needs no an SOI wafer and reduces manufacturing cost.

Abstract: The invention provides a printed circuit board and a detection method for detecting a connection between the printed circuit board and a flexible circuit board, and a display panel. The printed circuit board, through a connector provided thereon, is connected to a flexible circuit board, the printed circuit board is provided thereon with at least one first detection structure for matching with at least one second detection structure provided on the flexible circuit board, and whether or not a connection between the printed circuit board and the flexible circuit board is correct is determined by detecting matching between the first detection structures and the second detection structures. Pins of the printed circuit board may be correctly connected to pins of the flexible circuit board, and a case that short circuit occurs and thus the signal lines are damaged and burned can be avoided.

Abstract: According to an example, port negotiation between FCFs is implemented through initiation of a negotiation to an opposite party corresponding to a VFC port on a FCF within a VLAN corresponding to each VSAN supported by the VFC port on the FCF. The port negotiation also includes a determination of an intersection of the VSAN and the VLAN supported by the VFC port and the VSAN and the VLAN supported by the opposite party corresponding to the VFC port on the FCF and performance of an ELP negotiation within the intersection of the VSAN and the VLAN.

Abstract: Embodiments of the present invention provide a method and device for optimizing performance of an optical module. The optical module includes: an optical receiver, configured to receive an optical signal from an optical network, convert the optical signal into a first electrical signal, and process the first electrical signal according to a set control parameter for performance optimization, so as to obtain a second electrical signal; a connector, configured to send the second electrical signal obtained by the optical receiver to a host connected to the optical module, so that the host obtains bit error information according to the second electrical signal, and configured to receive the bit error information delivered by the host; and a processor, configured to adjust, according to the bit error information of the connector, the control parameter for performance optimization of the optical receiver.

Abstract: Examples of the present disclosure provide a method and an apparatus for synchronization after restart of a FC switch. For example, when a FC switch which is restarted detects that a neighbor FC switch has already established an adjacency relationship with the restarted FC switch, the adjacency relationship between the restarted FC switch and the neighbor FC switch is maintained, and the neighbor FC switch is requested to perform LSR initial synchronization to the restarted FC switch under a circumstance that the adjacency relationship is kept.

Abstract: The present disclosure provides a method for backing up a link state advertisement (LSA) for use in a distributed device comprising a main control board and an interface board. The main control board comprises a primary board and a standby board. The method comprises: receiving by the standby board LSA related information sent by the primary board; and generating by the standby board an LSA according to the LSA related information.

Abstract: According to an example, a routing generation method and apparatus is applied in Fiber Channel over Ethernet (FCoE). Based on the additions to the TLV, which may be carried in the Hello packet and the LSP packet, the Hello packet of the ISIS protocol may be used to implement neighbor discovery of the FC protocol, and the LSP synchronization of the ISIS protocol may be used to implement the link information synchronization of the FC protocol. Thus, the FC routing may be generated without the FSPF. Therefore, FCoE may be implemented with a lower cost.