Patents by Inventor Chang-Kyu Ahn

Chang-Kyu Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and fabrication thereof
    Publication number: 20060216868
    Abstract: The fabrication and device of package structure with a plurality of conductive contacts are provided herein. At least one chip is attached among the conductive pads on the surface of a wafer. A number of conductive wires are attached on the conductive pads and encapsulated by a layer. The layer is removed from the top thereof until to expose the conductive contacts derived from the conductive wires.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Inventors: Jun-Young Yang, You-Ock Joo, Chang-Kyu Ahn, Jung-Tae Kim, Sung-Sig Kang