Abstract: A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.

Abstract: Disclosed are a novel method of screening for insulin secretion-potentiating agents as well as means for performing such screening. The means include a DNA encoding fluorescent-labeled Epac2 comprising two different DNAs encoding two different fluorescent proteins which emit fluorescent light with wavelength differing from each other and a DNA encoding Epac2 which are fused together in-frame, and the cells transformed with the DNA. Also disclosed is a method of screening insulin secretion-potentiating agents comprising bringing a candidate compound into contact with cells transformed with the said DNA, and detecting whether the compound binds to Epac2.

Abstract: A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection.