Patents by Inventor Chang-Ming Wang

Chang-Ming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974191
    Abstract: A method (50) of, a node device (100) and a computer program product arranged for alerting node devices in a network of operatively interconnected node devices by transmitting an alerting message comprising a geographic location address of an originator node device (21) transmitting the alerting message and a moving direction (12) of an object (11) receiving service from the originator node device (21). When a receiving node device (24, 25) determines, based on its geographic location address, the geographic location address of the originator node device (21) and the moving direction (12), that the object (11) is approaching the receiving node device (24, 25), it transmits the alerting message comprising the geographic location address of the originator node device (21) and the moving direction (12).
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: April 30, 2024
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Lei Feng, Chang Jie Wang, Gong Ming Wei
  • Patent number: 11711021
    Abstract: A switching circuit includes a power switch, an active clamping circuit, and an active clamping control unit. When the power switch is modulated between an ON state and an OFF with a predetermined frequency, the active clamping control unit is configured to activate the function of the active clamping circuit for absorbing the energy of voltage surges. When the power switch is operating in the ON state or the OFF state, the active clamping control unit is configured to deactivate the function of the active clamping circuit for preventing the counter EMF from damaging the power switch.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: July 25, 2023
    Assignee: LSC Ecosystem Corporation
    Inventor: Chang-Ming Wang
  • Publication number: 20220166326
    Abstract: A switching circuit includes a power switch, an active clamping circuit, and an active clamping control unit. When the power switch is modulated between an ON state and an OFF with a predetermined frequency, the active clamping control unit is configured to activate the function of the active clamping circuit for absorbing the energy of voltage surges. When the power switch is operating in the ON state or the OFF state, the active clamping control unit is configured to deactivate the function of the active clamping circuit for preventing the counter EMF from damaging the power switch.
    Type: Application
    Filed: November 23, 2021
    Publication date: May 26, 2022
    Applicant: LSC Ecosystem Corporation
    Inventor: Chang-Ming Wang
  • Publication number: 20210320649
    Abstract: A half-bridge bootstrap circuit includes a high-side switch, a low-side switch, and a boot capacitor. A dynamically controlled minimum duty cycle curve is adopted to guarantee the minimum turn-on time of the low-side switch so that the boot capacitor can be sufficiently charged for keeping the high-side switch in the turn-on state. Also, the value of the minimum duty cycle curve can be dynamically set according to different operational phases of a load, thereby increasing the maximum output power of the load.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 14, 2021
    Inventors: Chang-Ming Wang, Tsung-Tai Cheng, Hsiao-Wu Wang
  • Patent number: 9698721
    Abstract: AC motor driving system and driving method thereof are provided. The driving system and method are capable of increasing power factor, adjusting waveform of the DC ripple voltage for increasing driving efficiency. The driving system is basically constructed by connecting three circuits. The first circuit is a three-phase full wave rectifying circuit and is used to transfer commercial electricity to a first DC voltage. Then, the second circuit is used to transfer the first DC voltage to a second DC voltage that ripples voltage thereof having a semi-sinusoidal waveform. The third circuit is an AC driving circuit, and receives the second AC voltage for driving the AC motor. Thereby, the driving efficiency can be increased. The capacitance used in the present disclosure has low capacitance value, thus the power factor can be increased, and usage time of the AC motor driving apparatus can also be increased.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: July 4, 2017
    Assignee: RHYMEBUS CORPORATION
    Inventors: Ming-Shi Huang, Chang-Ming Wang, Kuan-Cheng Chen, Ming-Chang Chou
  • Publication number: 20160294316
    Abstract: AC motor driving system and driving method thereof are provided. The driving system and method are capable of increasing power factor, adjusting waveform of the DC ripple voltage for increasing driving efficiency. The driving system is basically constructed by connecting three circuits. The first circuit is a three-phase full wave rectifying circuit and is used to transfer commercial electricity to a first DC voltage. Then, the second circuit is used to transfer the first DC voltage to a second DC voltage that ripples voltage thereof having a semi-sinusoidal waveform. The third circuit is an AC driving circuit, and receives the second AC voltage for driving the AC motor. Thereby, the driving efficiency can be increased. The capacitance used in the present disclosure has low capacitance value, thus the power factor can be increased, and usage time of the AC motor driving apparatus can also be increased.
    Type: Application
    Filed: October 8, 2015
    Publication date: October 6, 2016
    Inventors: Ming-Shi HUANG, Chang-Ming WANG, Kuan-Cheng CHEN, Ming-Chang CHOU
  • Patent number: 6886735
    Abstract: A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 ? to 8200 ?. Therefore, this invention provides the thermosonic wire bonding process for improvement of efficiency and quality.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: May 3, 2005
    Assignee: National Chung Cheng University
    Inventors: Yeau-Ren Jeng, Chang-Ming Wang
  • Publication number: 20040108362
    Abstract: A method of thermosonic wire bonding process for copper connection in a chip comprises controllable time, controllable temperature, and controllable humidity in an artificial circumstance, which generates copper oxide film on a surface of copper chip. The thickness of the film is in the range of 8050 Å to 8200Å.
    Type: Application
    Filed: January 13, 2003
    Publication date: June 10, 2004
    Applicant: National Chung Cheng University
    Inventors: Yeau-Ren Jeng, Chang-Ming Wang
  • Patent number: 5309358
    Abstract: Conversion of a double-byte representation of a character in a first interchange code to a double-byte representation of the character in a second interchange code is taught. The double-byte representation is used to provide column and row indices into a conversion array. This occurs through comparison of the first and second bytes of the representation to first and second national language verification arrays, respectively. The first byte is compared against the first national language verification array to return a first value. The second byte is compared against the second national language verification array to return a second value. The first and second values are then evaluated against first and second range limits, respectively, which, if met, validate the returned values as indices into a national double-byte translation table.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: May 3, 1994
    Assignee: International Business Machines Corporation
    Inventors: Greg P. Andrews, Chang-Ming Wang