Patents by Inventor Changnian XU

Changnian XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11924004
    Abstract: This application disclose a link configuration method, to configure a DSVPN tunnel interface parameter. A controller obtains a first link profile for a first site and a second link profile for a second site from a link profile library, where the link profile library includes a plurality of link profiles. The controller obtains preconfigured global configuration information, where the global configuration information includes an address pool. The controller generates a first link configuration parameter of the first site and a second link configuration parameter of the second site based on the address pool, the first link profile, and the second link profile and according to a preset link configuration rule. The controller sends the first link configuration parameter to the first site and sends the second link configuration parameter to the second site.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 5, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jiantao Chen, Changnian Xu, Weiquan Feng
  • Patent number: 11901609
    Abstract: An electronic device comprises a housing having a first side and a second side, a dielectric cover (602) on said second side, and an electrically conductive peripheral structure along edges of said first and second sides. An antenna feed (601) is coupled to a portion (603) of said peripheral structure for using said portion (603) as a radiating antenna element. A conductive member (604, 804) is located on or underneath said dielectric cover (602). The purpose of the conductive member is to enlarge the surface area where the electric field is distributed on to increase the antenna aperture for radiation.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 13, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne Ilvonen, Ruiyuan Tian, Li Dong, Changnian Xu, Dong Liu, Hongting Luo, Dongxing Tu
  • Patent number: 11855350
    Abstract: A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: December 26, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jari Kristian Van Wonterghem, Alexander Khripkov, Dong Liu, Janne Ilvonen, Jian Ou, Ruiyuan Tian, Changnian Xu, Wei Huang, Zlatoljub Milosavljevic
  • Publication number: 20220255237
    Abstract: A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 11, 2022
    Inventors: Jari Kristian Van Wonterghem, Alexander Khripkov, Dong Liu, Janne Ilvonen, Jian Ou, Ruiyuan Tian, Changnian Xu, Wei Huang, Zlatoljub Milosavljevic
  • Publication number: 20220216593
    Abstract: An electronic device comprises a housing having a first side and a second side, a dielectric cover (602) on said second side, and an electrically conductive peripheral structure along edges of said first and second sides. An antenna feed (601) is coupled to a portion (603) of said peripheral structure for using said portion (603) as a radiating antenna element. A conductive member (604, 804) is located on or underneath said dielectric cover (602). The purpose of the conductive member is to enlarge the surface area where the electric field is distributed on to increase the antenna aperture for radiation.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne ILVONEN, Ruiyuan TIAN, Li DONG, Changnian XU, Dong LIU, Hongting LUO, Dongxing TU
  • Patent number: 11335993
    Abstract: An electronic device includes a housing having a first side and a second side, a dielectric cover on the second side, and an electrically conductive peripheral structure along edges of the first and second sides. An antenna feed is coupled to a portion of the peripheral structure for using the portion as a radiating antenna element. A conductive member is located on or underneath the dielectric cover. A purpose of the conductive member is to enlarge the surface area where the electric field is distributed on to increase the antenna aperture for radiation.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: May 17, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne Ilvonen, Ruiyuan Tian, Li Dong, Changnian Xu, Dong Liu, Hongting Luo, Dongxing Tu
  • Patent number: 11296422
    Abstract: A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: April 5, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jari Kristian Van Wonterghem, Alexander Khripkov, Dong Liu, Janne Ilvonen, Jian Ou, Ruiyuan Tian, Changnian Xu, Wei Huang, Zlatoljub Milosavljevic
  • Patent number: 11228094
    Abstract: An antenna arrangement for a user equipment is disclosed. The antenna arrangement comprises a first antenna element configured to operate at frequencies above a limit frequency, a second antenna element configured to operate at frequencies below the limit frequency, and a wave trap configured to resonate within a frequency band above the limit frequency. The wave trap is connected to the second antenna element.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: January 18, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne Ilvonen, Ruiyuan Tian, Changnian Xu, Li Dong
  • Publication number: 20210249783
    Abstract: A millimeter-wave (mmWave) assembly (1) comprising a first mmWave module (2), a second mmWave module (3), and a connector (4) configured to releasably interconnect the first mmWave module (2) and the second mmWave module (3). The connector (4) comprises a first connector element (5) associated with the first mmWave module (2). The first mmWave module (2) comprises a first substrate (7) and an mmWave radio frequency integrated circuit (RFIC) (8), and the second mmWave module (3) comprises a second substrate (9) and an mmWave antenna array (10). The connector (4) is configured to transmit at least one signal between the mmWave RFIC (8) and the mmWave antenna array (10) when the first mmWave module (2) and the second mmWave module (3) are interconnected.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 12, 2021
    Inventors: Jari Kristian Van Wonterghem, Alexander Khripkov, Dong Liu, Janne Ilvonen, Jian Ou, Ruiyuan Tian, Changnian Xu, Wei Huang, Zlatoljub Milosavljevic
  • Publication number: 20210021445
    Abstract: This application disclose a link configuration method, to configure a DSVPN tunnel interface parameter. A controller obtains a first link profile for a first site and a second link profile for a second site from a link profile library, where the link profile library includes a plurality of link profiles. The controller obtains preconfigured global configuration information, where the global configuration information includes an address pool. The controller generates a first link configuration parameter of the first site and a second link configuration parameter of the second site based on the address pool, the first link profile, and the second link profile and according to a preset link configuration rule. The controller sends the first link configuration parameter to the first site and sends the second link configuration parameter to the second site.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 21, 2021
    Inventors: Jiantao CHEN, Changnian XU, Weiquan FENG
  • Publication number: 20200411952
    Abstract: An electronic device includes a housing having a first side and a second side, a dielectric cover on the second side, and an electrically conductive peripheral structure along edges of the first and second sides. An antenna feed is coupled to a portion of the peripheral structure for using the portion as a radiating antenna element. A conductive member is located on or underneath the dielectric cover. A purpose of the conductive member is to enlarge the surface area where the electric field is distributed on to increase the antenna aperture for radiation.
    Type: Application
    Filed: March 20, 2018
    Publication date: December 31, 2020
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Janne ILVONEN, Ruiyuan TIAN, Li DONG, Changnian XU, Dong LIU, Hongting LUO, Dongxing TU
  • Publication number: 20200403296
    Abstract: An antenna arrangement for a user equipment is disclosed. The antenna arrangement comprises a first antenna element configured to operate at frequencies above a limit frequency, a second antenna element configured to operate at frequencies below the limit frequency, and a wave trap configured to resonate within a frequency band above the limit frequency. The wave trap is connected to the second antenna element.
    Type: Application
    Filed: April 5, 2018
    Publication date: December 24, 2020
    Inventors: Janne ILVONEN, Ruiyuan TIAN, Changnian XU, Li DONG