Patents by Inventor Changsong Ding

Changsong Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TITANIUM-BASED THERMAL GROUND PLANE
    Publication number: 20200025462
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Application
    Filed: April 18, 2019
    Publication date: January 23, 2020
    Applicant: The Regents of the University of California
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • Titanium-based thermal ground plane
    Patent number: 10309728
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 4, 2019
    Assignee: The Regents of the University of California
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • TITANIUM-BASED THERMAL GROUND PLANE
    Publication number: 20140332187
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 13, 2014
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • Titanium-based thermal ground plane
    Patent number: 8807203
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: August 19, 2014
    Assignee: The Regents of the University of California
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek
  • TITANIUM-BASED THERMAL GROUND PLANE
    Publication number: 20110120674
    Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
    Type: Application
    Filed: July 21, 2009
    Publication date: May 26, 2011
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Noel C. MacDonald, Carl D. Meinhart, Changsong Ding, Payam Bozorgi, Gaurav Soni, Brian D. Piorek