Patents by Inventor Changting Wang

Changting Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100312494
    Abstract: A method for testing a component using an eddy current array probe is provided. The method includes calibrating the eddy current array probe, collecting data from the eddy current array probe for analysis, and processing the collected data to at least one of compensate for response variations due to a detected orientation of a detected imperfection and to facilitate minimizing noise.
    Type: Application
    Filed: December 28, 2007
    Publication date: December 9, 2010
    Inventors: Sanghamithra Korukonda, Sandeep Dewangan, William Stewart McKnight, Gigi Gambrell, Changting Wang, Ui Suh
  • Patent number: 7817845
    Abstract: A method for detecting small cracks and other anomalies on parts having complex geometries is disclosed. The method includes eddy current inspection incorporating collection of data from multi-frequency eddy current signals. Phase analysis is used to combine the multi-frequency data to enhance the signal to noise ratio of the raw inspection image. The image is then reprocessed using a spatiotemporal filter to correlate with the frequency components of the eddy current flaw signal to separate signals associated with cracks and other flaws at edges that would ordinarily be hidden by edge effect signals.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: October 19, 2010
    Assignee: General Electric Company
    Inventors: Ui Won Suh, Gigi Olive Gambrell, William Stewart McKnight, Preeti Pisupati, Peyush Kumar Mishra, Sandeep Kumar Dewangan, Changting Wang
  • Publication number: 20100207619
    Abstract: A method for integrating a measurement device for use in measuring a machine component includes providing a coordinate measuring machine (CMM) and combining eddy current (EC) capabilities and CMM capabilities to form an inspection probe. The method further includes installing the inspection probe on the CMM so that the inspection probe measures external boundaries of the machine component with the CMM capabilities and substantially simultaneously measures at least one of internal boundaries, internal defects, surface defects, and material properties of the machine component with the EC capabilities, which are directly linked to actual component dimensional information provided by CMM. The inspection data can be simultaneously linked to and/or displayed with a CAD model to enable a direct comparison between the inspection data and the nominal requirements specified on the CAD model.
    Type: Application
    Filed: February 18, 2009
    Publication date: August 19, 2010
    Inventors: Yanyan Wu, Thomas James Batzinger, Nicholas Joseph Kray, Changting Wang, Haiyan Sun, Francis Howard Little, David Paul Lappas, David Michael Dombrowski
  • Publication number: 20100134098
    Abstract: The invention provides composite systems, articles comprising the composite system, methods for the in-situ, non-destructive testing of the articles and/or composite systems, as well as array probes useful in the methods. The composite systems comprise a curable resin and at least one plurality of detectable particles.
    Type: Application
    Filed: November 29, 2008
    Publication date: June 3, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Waseem Ibrahim Faidi, Changting Wang, Stephane Renou, Shu Ching Quek, Nilesh Tralshawala, Aparna Chakrapani Sheila-Vadde, Peter J. Fritz
  • Publication number: 20100127699
    Abstract: An inspection system for inspecting a part is provided. The inspection system includes a multi-dimensional array of eddy current sensors that conforms to a contour of a three dimensional shape of the part. The inspection system also includes a controller coupled to the multi-dimensional array, wherein the controller is configured to electronically scan the part via an electrical connection of the eddy current sensors to an eddy current instrument. The inspection system further includes a processor coupled to the eddy current instrument, wherein the processor is configured to analyze output from the eddy current instrument and the controller to accomplish inspection of the part.
    Type: Application
    Filed: November 25, 2008
    Publication date: May 27, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Changting Wang, Yury Alexeyevich Plotnikov, Ui Won Suh, William Stewart McKnight
  • Publication number: 20100085045
    Abstract: Omnidirectional eddy current array probes for detecting flaws in a conductive test object generally includes semi-circular wave shaped continuous drive lines in two rows disposed in two layers that are multiplexed for omnidirectional inspection without blind spots. The semicircular wave shaped continuous drive lines are superimposed to form pseudo-circular drive lines, wherein each row of drive lines is offset laterally by a distance preferably equal to a quarter wavelength of the wave pattern. For only parallel and perpendicular flaws, the drive multiplexing is not needed and each row will have only one set of drive lines. In alternate embodiments, there can be square-shaped, oval shaped, rectangular-shaped or other shaped wave patterns as well. Also disclosed are methods for sensing surface flaws and compensating their response.
    Type: Application
    Filed: October 7, 2008
    Publication date: April 8, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Aparna Chakrapani Sheila-Vadde, Ui Won Suh, Changting Wang
  • Publication number: 20090115411
    Abstract: A method of assembling an eddy current probe for use in nondestructive testing of a sample is described. The method includes positioning at least one substantially planar spiral drive coil within the eddy current probe, such that the drive coil is at least one of adjacent to and at least partially within a flexible material. The method further includes coupling at least one unpackaged solid-state magnetic field sensor to the at least one drive coil.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 7, 2009
    Inventors: Haiyan Sun, Yuri Plotnikov, Changting Wang, William Stewart McKnight, Ui Suh
  • Publication number: 20090115410
    Abstract: A method of assembling an eddy current array probe to facilitate nondestructive testing of a sample is provided. The method includes positioning a plurality of differential side mount coils at least partially within a flexible material. The method also includes coupling the flexible material within a tip portion of the eddy current array probe, such that the flexible material has a contour that substantially conforms to a portion of a surface of the sample to be tested.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 7, 2009
    Inventors: William Stewart McKnight, Ui Suh, Yuri Plotnikov, Changting Wang, Ralph Gerald Isaacs
  • Patent number: 7518359
    Abstract: A non-planar part has a non-planar surface such as an edge, and may contain an anomaly such as a crack. The non-planar part is inspected using an eddy current technique. The method includes providing the non-planar part having the non-planar surface thereon, driving an eddy current probe at two or more frequencies, measuring an eddy current response signal of the non-planar part at each frequency, and performing a multifrequency phase analysis on the eddy current response signals.
    Type: Grant
    Filed: January 12, 2006
    Date of Patent: April 14, 2009
    Assignee: General Electric Company
    Inventors: Changting Wang, Ui Suh
  • Publication number: 20090072822
    Abstract: An inspection system for detecting a flaw in a part is provided. The inspection system includes a generally C-shaped core having an opening for receiving the part. The system also includes a driver coil wrapped around the core for creating a magnetic field in the opening. The system further includes at least one single element or multiple element eddy current sensor disposed in the opening.
    Type: Application
    Filed: September 14, 2007
    Publication date: March 19, 2009
    Applicant: General Electric Company
    Inventors: Haiyan Sun, Changting Wang, William Stewart McKnight
  • Publication number: 20080278151
    Abstract: A method for inspecting an internal cavity in a part is provided. The method includes inserting a probe into the internal cavity. The method also includes controlling movement of the probe using a defined scan path to scan the probe over a region of interest in the internal cavity. The method also includes applying multiple multifrequency excitation signals to the probe to generate a number of multifrequency response signals. The multifrequency excitation signals are applied at multiple positions within the internal cavity. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect the internal cavity.
    Type: Application
    Filed: May 7, 2007
    Publication date: November 13, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Changting Wang, Shridhar Champaknath Nath, Weston Blaine Griffin, Michael Wayne Fields, Darren Lee Hallman, Abdul Rahman Abdallah Al-Khalidy
  • Patent number: 7402999
    Abstract: A pulsed eddy current pipeline inspection device is provided. The pulsed eddy current pipeline inspection device comprises a plurality of stages longitudinally spaced apart from each other and adapted to move between a contracted position and an expanded position, and a plurality of sensors disposed around at least a portion of a circumference of each of the plurality of stages in the contracted position with at least one gap between sensors in each of the plurality of stages in the expanded position, the plurality of sensors being arranged such that the at least one gap in a first one of the plurality of stages is aligned with a portion of a second one of the plurality of stages that has sensors disposed thereon.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: July 22, 2008
    Assignee: General Electric Company
    Inventors: Yuri Plotnikov, Andrew May, Shridhar Nath, Changting Wang
  • Publication number: 20080159619
    Abstract: A method for detecting small cracks and other anomalies on parts having complex geometries is disclosed. The method includes eddy current inspection incorporating collection of data from multi-frequency eddy current signals. Phase analysis is used to combine the multi-frequency data to enhance the signal to noise ratio of the raw inspection image. The image is then reprocessed using a spatiotemporal filter to correlate with the frequency components of the eddy current flaw signal to separate signals associated with cracks and other flaws at edges that would ordinarily be hidden by edge effect signals.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Ui Won SUH, Gigi Olive GAMBRELL, William Stewart MCKNIGHT, Preeti PISUPATI, Peyush Kumar MISHRA, Sandeep Kumar DEWANGAN, Changting WANG
  • Publication number: 20070222439
    Abstract: Several eddy current array probes (ECAP) with enhanced drive coil configurations are described. In one arrangement, an ECAP includes a number of EC channels and a number of drive coils. Each of the drive coils is provided for a respective one of the EC channels. The drive coils have alternating polarity with respect to neighboring drive coils. In another arrangement, an ECAP for detecting flaws in a number of scanning and orientation configurations includes at least one substrate, a number of sense coils arranged on the substrate(s), and a drive coil encompassing all of the sense coils. In another arrangement, an ECAP includes substrate, sense coils arranged in at least two rows, and at least one drive line. One drive line is provided for each pair of rows and disposed between the rows.
    Type: Application
    Filed: June 7, 2007
    Publication date: September 27, 2007
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Changting Wang, Yuri Plotnikov, William McKnight, Shridhar Nath, Gigi Gambrell, Mottito Togo, William Hennessy, John Ertel, Shyamsunder Mandayam
  • Publication number: 20070120559
    Abstract: A pulsed eddy current pipeline inspection device is provided. The pulsed eddy current pipeline inspection device comprises a plurality of stages longitudinally spaced apart from each other and adapted to move between a contracted position and an expanded position, and a plurality of sensors disposed around at least a portion of a circumference of each of the plurality of stages in the contracted position with at least one gap between sensors in each of the plurality of stages in the expanded position, the plurality of sensors being arranged such that the at least one gap in a first one of the plurality of stages is aligned with a portion of a second one of the plurality of stages that has sensors disposed thereon.
    Type: Application
    Filed: November 30, 2005
    Publication date: May 31, 2007
    Inventors: Yuri Plotnikov, Andrew May, Shridhar Nath, Changting Wang
  • Patent number: 7206706
    Abstract: A method for inspecting a part is provided. The method includes applying a number of multifrequency excitation signals to a probe to generate a number of multifrequency response signals for the part being inspected. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect a subsurface of the part. An inspection system is provided and includes an eddy current (EC) probe configured to induce eddy currents in a part. The system further includes an eddy current instrument coupled to the EC probe and configured to apply multifrequency excitation signals to the EC probe to generate multifrequency response signals. The system further includes a processor configured to analyze the multifrequency response signals from the EC instrument by performing a multifrequency phase analysis, to inspect a subsurface of the part.
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: April 17, 2007
    Assignee: General Electric Company
    Inventors: Changting Wang, William Stewart McKnight, Ui Suh, Serkan Ertekin
  • Patent number: 7154265
    Abstract: An eddy current (EC) probe for inspecting a component is provided. The EC probe includes a tangential drive coil configured to generate a probing field for inducing eddy currents in the component, where a portion of the eddy currents are aligned parallel to an edge of the component. An axis of the tangential drive coil is aligned parallel to a surface of the component. The EC probe further includes a pair of sense coils, where an axis of the sense coils is aligned perpendicular to the surface of the component. The sense coils are configured to sense the portion of the eddy currents aligned parallel to the edge of the component.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: December 26, 2006
    Assignee: General Electric Company
    Inventors: Mottito Togo, Changting Wang, Yuri Alexeyevich Plotnikov, Shyamsunder Tondanur Mandayam, William Stewart McKnight, Walter Joseph Bantz, Ui Won Suh
  • Publication number: 20060217908
    Abstract: A method for inspecting a part is provided. The method includes applying a number of multifrequency excitation signals to a probe to generate a number of multifrequency response signals for the part being inspected. The method further includes performing a multifrequency phase analysis on the multifrequency response signals to inspect a subsurface of the part. An inspection system is provided and includes an eddy current (EC) probe configured to induce eddy currents in a part. The system further includes an eddy current instrument coupled to the EC probe and configured to apply multifrequency excitation signals to the EC probe to generate multifrequency response signals. The system further includes a processor configured to analyze the multifrequency response signals from the EC instrument by performing a multifrequency phase analysis, to inspect a subsurface of the part.
    Type: Application
    Filed: August 22, 2005
    Publication date: September 28, 2006
    Inventors: Changting Wang, William Mcknight, Ui Suh, Serkan Ertekin
  • Publication number: 20060202687
    Abstract: A non-planar part has a non-planar surface such as an edge, and may contain an anomaly such as a crack. The non-planar part is inspected using an eddy current technique. The method includes providing the non-planar part having the non-planar surface thereon, driving an eddy current probe at two or more frequencies, measuring an eddy current response signal of the non-planar part at each frequency, and performing a multifrequency phase analysis on the eddy current response signals.
    Type: Application
    Filed: January 12, 2006
    Publication date: September 14, 2006
    Applicant: General Electric Company
    Inventors: Changting Wang, Ui Suh
  • Publication number: 20060132123
    Abstract: Several eddy current array probes (ECAP) with enhanced drive coil configurations are described. In one arrangement, an ECAP includes a number of EC channels and a number of drive coils. Each of the drive coils is provided for a respective one of the EC channels. The drive coils have alternating polarity with respect to neighboring drive coils. In another arrangement, an ECAP for detecting flaws in a number of scanning and orientation configurations includes at least one substrate, a number of sense coils arranged on the substrate(s), and a drive coil encompassing all of the sense coils. In another arrangement, an ECAP includes substrate, sense coils arranged in at least two rows, and at least one drive line. One drive line is provided for each pair of rows and disposed between the rows.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 22, 2006
    Inventors: Changting Wang, Yuri Plotnikov, William McKnight, Shridhar Nath, Gigi Gambrell, Mottito Togo, William Hennessy, John Ertel, Shyamsunder Mandayam