Patents by Inventor Changxing Sun

Changxing Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230007773
    Abstract: A cable assembly, a signal transmission structure, and an electronic device are provided. The signal transmission structure includes a circuit board (2), a chip (1), and a cable assembly (3). The chip (1) is assembled on one side of the circuit board (2), and the cable assembly (3) is assembled on the other side of the circuit board (2). The cable assembly (3) includes a cable (31), and the circuit board (2) includes a plurality of conductive holes (22). The chip (1) is electrically connected to the cable (31) of the cable assembly (3) by using the conductive hole (22), to transmit a signal of the chip (1) by using the cable (31). In this technical solution, wires do not need to be disposed in a large area inside the circuit board (2).
    Type: Application
    Filed: September 12, 2022
    Publication date: January 5, 2023
    Inventors: Guodong Zhang, Chong Chen, Jian Zhang, Shaoyong Xiang, Zhijun Qu, Changxing Sun
  • Patent number: 11387226
    Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: July 12, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yadong Bai, Zhijun Qu, Changxing Sun, Haitao Han
  • Publication number: 20210143141
    Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.
    Type: Application
    Filed: November 5, 2020
    Publication date: May 13, 2021
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yadong Bai, Zhijun Qu, Changxing Sun, Haitao Han