Abstract: A printed circuit board includes an insulating layer, and a conductive post disposed on the insulating layer. The conductive post includes a barrier layer, a seed layer disposed on the barrier layer, and a plating layer disposed on the seed layer.

Abstract: A printed circuit board includes an insulating layer, a first pad disposed on the insulating layer, and a protective layer disposed on the insulating layer. The protective layer includes a base portion having an opening exposing a portion of the first pad, a dam portion disposed on the base portion, the dam portion having a width less than that of the base portion, and a connection portion between the base portion and the dam portion. The connection portion has a width greater than that of the dam portion and less than that of the base portion. The base portion, the dam portion, and the connection portion are integrally formed.

Abstract: A printed circuit board includes an insulating layer, a conductive pad buried in an upper side of the insulating layer, the conductive pad having an upper surface having at least a portion exposed from an upper surface of the insulating layer, a first conductive bump disposed on the upper surface of the conductive pad, a passivation layer disposed on the upper surface of the insulating layer, the passivation layer covering a portion of the upper surface of the conductive pad and a portion of a side surface of the first conductive bump, and a second conductive bump disposed on an upper surface of the passivation layer, the second conductive bump covering another portion of the side surface of the first conductive bump and an upper surface of the first conductive bump.

Abstract: A printed circuit board includes an insulating layer, a conductive pad disposed on the insulating layer, a conductive bump disposed to cover at least a portion of the conductive pad and spaced apart from the insulating layer, and a solder resist layer disposed on the insulating layer and covering at least a portion of both the conductive pad and the conductive bump. The conductive bump has a maximum width greater than that of the conductive pad. A method of manufacturing the printed circuit board is also disclosed.

Abstract: A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: A printed circuit board includes a first insulating layer, a metal pad including a first metal portion disposed on the first insulating layer, and a second metal portion disposed on the first metal portion and integrated with the first metal portion without a boundary therebetween, the second metal portion having a width narrower than a width of the first metal portion on a cross section, a second insulating layer disposed on the first insulating layer and covering at least a portion of a side surface of the first metal portion, and a surface metal layer disposed on the metal pad and covering at least a portion of each of an upper surface and a side surface of the second metal portion.

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: A printed circuit board includes an insulating layer; and an external connection pad embedded in the insulating layer and having one surface exposed. The external connection pad may include a base pad portion having a first pattern portion in contact with a side surface of the insulating layer and having a first width, and a second pattern portion protruding from the first pattern portion and having a second width smaller than the first width, the second pattern portion having a gap with the side surface of the insulating layer, and a surface treatment layer disposed in the gap between the second pattern portion and the insulating layer and extending on an upper surface of the second pattern portion.

Abstract: A printed circuit board includes a substrate including an external connection pad; and a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad. The metal post may include a first post portion, elongated while having a substantially constant width, a second post portion extending to the outside of the substrate in the thickness direction of the substrate while having a narrow width, and a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion while having substantially the same width as the first post portion. The third post portion may forma lower end portion of the metal post.

Abstract: A camera module is provided. The camera module includes: a housing; a lens barrel disposed in the housing; a cover screen disposed over the lens barrel; a blade pivotably coupled to the cover screen and configured to have at least a portion in contact with a surface of the cover screen; and a rotation member disposed on the blade and configured to pivot the blade with respect to the cover screen.

Abstract: A printed circuit board including: a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer, and including a first wiring portion and a second wiring portion; and a second insulating layer disposed on the upper surface of the first insulating layer, having a cavity exposing an upper surface of the second wiring portion, and including a first insulating portion covering the first wiring portion and a second insulating portion whose upper surface is exposed from the cavity, wherein one or more gaps are provided between the second wiring portion and the second insulating portion.

Abstract: A camera module is provided. The camera module includes: a housing; a lens barrel disposed in the housing; a cover screen disposed over the lens barrel; a blade pivotably coupled to the cover screen and configured to have at least a portion in contact with a surface of the cover screen; and a rotation member disposed on the blade and configured to pivot the blade with respect to the cover screen.

Abstract: A printed circuit board includes a substrate including an external connection pad; and a metal post extending to the outside of the substrate in a thickness direction of the substrate from the external connection pad. The metal post may include a first post portion, elongated while having a substantially constant width, a second post portion extending to the outside of the substrate in the thickness direction of the substrate while having a narrow width, and a third post portion extending to the outside of the substrate in the thickness direction of the substrate from the second post portion while having substantially the same width as the first post portion. The third post portion may forma lower end portion of the metal post.

Abstract: A printed circuit board includes an insulating layer; and an external connection pad embedded in the insulating layer and having one surface exposed. The external connection pad may include a base pad portion having a first pattern portion in contact with a side surface of the insulating layer and having a first width, and a second pattern portion protruding from the first pattern portion and having a second width smaller than the first width, the second pattern portion having a gap with the side surface of the insulating layer, and a surface treatment layer disposed in the gap between the second pattern portion and the insulating layer and extending on an upper surface of the second pattern portion.

Abstract: A printed circuit board includes a first insulating layer; a pad disposed on the insulating layer and having a protrusion; and a protective layer disposed on the insulating layer and having an opening exposing at least a portion of the pad. The protrusion protrudes from one surface of the pad and is buried in at least one of the insulating layer and the protective layer.

Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device through via traversing the integrated circuit and the device interconnect attached to the device through via; attaching a conductive support over the substrate with the conductive support adjacent to the integrated circuit; providing a pre-formed interposer, having an interposer through via and a pre-attached interconnect, with the pre-attached interconnect attached to the interposer through via; mounting the pre-formed interposer over the integrated circuit and the conductive support with the pre-attached interconnect over the device through via; and forming an encapsulation over the substrate covering the integrated circuit, the conductive support, and partially covering the pre-formed interposer.

Abstract: A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity.

Abstract: A method of manufacturing of an integrated circuit packaging system includes: providing a bottom package in a cavity in a central region of the bottom package having inter-package interconnects in the cavity; forming a vent on an inter-package connection side of the bottom package from an exterior of the bottom package to the cavity; mounting a top package on the inter-package interconnects; and applying an underfill through the vent and into the cavity.

Abstract: An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module cantilevered over the substrate by an electrical interconnect connected to the substrate, the electrical interconnect forming a gap between the inner stacking module and the structure controlled by the size of the electrical interconnect; and encapsulating the structure and inner stacking module with an encapsulation.