Patents by Inventor Chan-Hwa Chung

Chan-Hwa Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9676034
    Abstract: A method of manufacturing a powder having a high surface area is provided. According to the method of manufacturing a powder having a high surface area, a metal electrolyte in which metal ions of different kinds of first metals are dissociated is prepared. Subsequently, a metal alloy powder formed of the first metals is formed by soaking a second metal having a higher reducing power than the first metals in the metal electrolyte to induce a first spontaneous substitution reaction. Therefore, it is possible to form a powder having an improved specific surface area.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: June 13, 2017
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Chan-Hwa Chung, Myung Gi Jeong
  • Publication number: 20140283650
    Abstract: A method of manufacturing a powder having a high surface area is provided. According to the method of manufacturing a powder having a high surface area, a metal electrolyte in which metal ions of different kinds of first metals are dissociated is prepared. Subsequently, a metal alloy powder formed of the first metals is formed by soaking a second metal having a higher reducing power than the first metals in the metal electrolyte to induce a first spontaneous substitution reaction. Therefore, it is possible to form a powder having an improved specific surface area.
    Type: Application
    Filed: October 23, 2012
    Publication date: September 25, 2014
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Chan-Hwa Chung, Myung Gi Jeong
  • Publication number: 20140076618
    Abstract: There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-copper (Pd—Cu) mixture; and forming a first gold thin film by immersing the palladium-copper mixture plating layer in a gold (Au) galvanic electrolytic liquid to replace a portion of copper (Cu) particles in the palladium-copper mixture plating layer with gold particles through a replacement reaction.
    Type: Application
    Filed: December 3, 2012
    Publication date: March 20, 2014
    Applicants: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seong Min CHO, Chan Hwa CHUNG, Chang Yong AN, Chang Sup RYU, Hyo Seung NAM
  • Patent number: 7588853
    Abstract: The present invention relates to a direct methanol fuel cell having reduced methanol crossover. The fuel cell includes a layer of material for controlling the diffusion rate of fuel.
    Type: Grant
    Filed: March 31, 2006
    Date of Patent: September 15, 2009
    Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Chan-Hwa Chung, Woo-Jae Kim, Hoo-Gon Choi, Young-Kwan Lee, Sung-Min Cho, Jae-Do Nam
  • Publication number: 20090022900
    Abstract: A method of manufacturing a wire grid device is provided. The method includes: forming SAM (self assembly monomer) nano patterns on a substrate; and forming a wire grid between neighboring SAM nano patterns on the substrate on which the SAM nano patterns are formed by using an electroless plating technique or forming the wire grid on the SAM nano patterns on the SAM nano patterns by using the SAM nano patterns as a seed layer by using the electroless plating technique.
    Type: Application
    Filed: March 10, 2008
    Publication date: January 22, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Su-mi Lee, Chan-hwa Chung, Moon-gyu Lee, Jung-woo Lee
  • Publication number: 20070154367
    Abstract: The invention relates to a reforming apparatus made of LTCC and a manufacturing method therefor. The reforming apparatus includes an upper cover made of ceramic material, having a fuel inlet at one side thereof, and an evaporator made of ceramic layers formed integrally with the upper cover, having a flow path to gasify fuel introduced through the upper cover. In the reforming apparatus, a reformer made of ceramic layers is formed at one side of the evaporator, having a catalyst in a flow path thereof to reform fuel gas entering from the evaporator into hydrogen. A CO remover made of ceramic layers is formed integrally with the reformer, having a catalyst to remove CO from reformed gas entering from the reformer. A lower cover is formed integrally at one side of the CO remover, having a reformed gas outlet to emit the reformed gas to the outside.
    Type: Application
    Filed: September 22, 2006
    Publication date: July 5, 2007
    Inventors: Jae Hyuk Jang, Woo Jae Kim, Jeong Hoon Oh, Chan Hwa Chung, Young Soo Oh, Jae Hyoung Gil
  • Publication number: 20070026286
    Abstract: The present invention relates to a direct methanol fuel cell having reduced methanol crossover, which comprises a layer of material for controlling the diffusion rate of fuel. More particularly, it relates to a direct methanol fuel cell in which the material for controlling the diffusion rate of fuel is interposed between an anode and a fuel reservoir or positioned within the fuel reservoir, and thus, the diffusion rate of methanol is reduced even when using high concentration methanol fuel, such that the injected methanol is completely reacted in a catalyst layer so as to fundamentally reduce unreacted methanol, thereby suppressing the methanol crossover phenomenon and exhibiting high power density. In the inventive direct methanol fuel cell, the diffusion rate of fuel is controlled using the fuel diffusion rate-controlling material so as to suppress the methanol crossover phenomenon, thereby increasing energy density and output density.
    Type: Application
    Filed: March 31, 2006
    Publication date: February 1, 2007
    Inventors: Chan-Hwa Chung, Woo-Jae Kim, Hoo-Gon Choi, Young-Kwan Lee, Sung-Min Cho, Jae-Do Nam