Patents by Inventor Channarayapatna N. Thimmappaiah

Channarayapatna N. Thimmappaiah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin bonded abrasive tool and method of making the tool
    Patent number: 5912216
    Abstract: A resin bonded abrasive tool consists of abrasive grain and an organic bond comprising a thermosetting resin, such as epoxy resin, phenolic resin or rubber or blends thereof and a precursor filler system capable of forming in situ an active filler system by reacting under the heat generated during grinding. The organic bond optionally further comprises a filler system. A method of making the resin bonded abrasive tool consists of mixing the abrasive grain and the organic bond with the precursor filler system, pressing the resulting mixture into shape, and curing the abrasive tool at about 150 to 200.degree. C.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: June 15, 1999
    Assignees: Norton Company, Grindwell Norton Limited
    Inventors: Channarayapatna N. Thimmappaiah, Murugesan K. Kurubaran, Gerald W. Meyer