Abstract: An enclosure for an implantable device is provided. The enclosure includes a cup defining a cavity, the cup including a non-metallic body, and a weld ring coupled to the non-metallic body, and a lid, wherein the lid is weldable to the weld ring to couple the cup to the lid and hermetically seal the enclosure.

Abstract: The disclosure is directed to implantable electrical connector assemblies and methods of fabrication of the implantable electrical connector assemblies. An implantable electrical connector includes a male electrical connector and a female electrical connector. The male electrical connector includes annular electrical contacts mounted to and spaced apart along an elongated support member. The female electrical connector includes female contact assemblies. Each of the female contact assemblies includes a circular coil spring disposed within an annular conductive member. The circular coil spring is retained within the annular conductive member between a first-side non-conductive retention member and the second-side non-conductive retention member.

Abstract: Implantable electrical connectors employ a conductive circular coil spring contact retained with in a non-conductive housing and a conductive lead attached to the conductive circular coil spring contact. An implantable electrical connector assembly includes a male connector and a female connector. The male connector includes an electrical contact mounted to an elongated electrical contact support member. The female electrical connector includes a connector body and a female contact assembly disposed within the connector body. The female contact assembly includes a conductive circular coil spring, a conductive lead, and a non-conductive housing. The conductive lead is connected to the conductive circular coil spring. The conductive circular coil spring is disposed within and retained by the non-conductive housing. The conductive lead extends from within the non-conductive housing to outside of the non-conductive housing.

Abstract: Described herein is an implantable medical device including a housing, a header coupled to the housing, and a receptacle connector stack disposed in the header. The receptacle connector stack includes a plurality of electrical contacts and a plurality of wiper seals. Each electrical contact of the plurality of electrical contacts is separated by a corresponding wiper seal. A first sealing element is disposed at a proximal end of the receptacle connector stack and a second sealing element is disposed at a distal end of the receptacle connector stack. The sealing elements are mounted on respective seal housings. A third sealing element is disposed adjacent to the first sealing element and further proximal of the connector stack to restrict a bounce back effect caused by one or more of the plurality of wiper seals during insertion of a lead.

Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

Abstract: A method of manufacturing a print head includes forming a jet stack, the jet stack including a nozzle plate having an array of nozzles, attaching an array of transducers to the jet stack, wherein the array of transducers has a transducer corresponding to each nozzle, adhering an adhesive layer to the array of transducers, forming opening in the adhesive layer, each opening adjacent a transducer in the array of transducers, partially removing the adhesive layer in regions adjacent the openings, such that the adhesive layer is less thick in the regions adjacent the openings than in other regions, and filling the openings with a conductive material, such that when the conductive material is applied, any air in the openings moves into the regions of the adhesive layer with less thickness adjacent the openings.

Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

Abstract: An apparatus has a first structure, an adhesive layer having a first height adhered to the first structure, the adhesive layer having an array of openings, the adhesive layer having a region adjacent each opening having a height less than a first height. A print head has a stack of plates forming a jet stack, the jet stack having a nozzle plate with an array of nozzles, an array of transducers in contact with the jet stack opposite the nozzle plate, an adhesive layer having a first height adhered to the array of transducers, the adhesive layer having openings adjacent the transducers and regions adjacent the openings having a height less than the first height, and a conductive material in the openings of the adhesive layer in contact with the transducers.

Abstract: A process where there is deposited on a supporting substrate at least one first polymer layer and optionally at least one second polymer layer followed by treating the resulting formed layers or laminate with a laser.

Abstract: A process where there is deposited on a supporting substrate at least one first polymer layer and optionally at least one second polymer layer followed by treating the resulting formed layers or laminate with a laser.