Abstract: An electronic device, e.g., a printed transistor device, comprises a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The substrate has a first platform and a second platform embossing on the surface thereof, and the first and second platforms are separated by a gap whose width is equivalent to the channel length of the transistor. The first and second conductive layers serving as the source and the drain, respectively, of the transistor device are formed on surfaces of the first and second platforms. The semiconductor layer is formed on the surface of the substrate in the gap.

Abstract: An electronic device, e.g., a printed transistor device, comprises a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The substrate has a first platform and a second platform embossing on the surface thereof, and the first and second platforms are separated by a gap whose width is equivalent to the channel length of the transistor. The first and second conductive layers serving as the source and the drain, respectively, of the transistor device are formed on surfaces of the first and second platforms. The semiconductor layer is formed on the surface of the substrate in the gap.

Abstract: An electronic device, e.g., a printed transistor device, comprises a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The substrate has a first platform and a second platform embossing on the surface thereof, and the first and second platforms are separated by a gap whose width is equivalent to the channel length of the transistor. The first and second conductive layers serving as the source and the drain, respectively, of the transistor device are formed on surfaces of the first and second platforms. The semiconductor layer is formed on the surface of the substrate in the gap.

Abstract: An electronic device, e.g., a printed transistor device, comprises a substrate, a first conductive layer, a second conductive layer and a semiconductor layer. The substrate has a first platform and a second platform embossing on the surface thereof, and the first and second platforms are separated by a gap whose width is equivalent to the channel length of the transistor. The first and second conductive layers serving as the source and the drain, respectively, of the transistor device are formed on surfaces of the first and second platforms. The semiconductor layer is formed on the surface of the substrate in the gap.