Abstract: The present invention relates to a nucleic acid detection chip, the method and detection equipment using the same. The test sample injects into the first injection hole on the slip plate into the groove on the substrate through the first guide hole. The test sample is heated to the first temperature and then cooled down. Displacing the top plate to align the second injection hole and the hole of the substrate. Injecting the light conversion material into the hole of the substrate to generate a detection sample. Displacing the plate again to move the detection sample to the substrate's top of the detection hole. Exposing the detection sample with the first light to generate the second light by the light conversion material in the detection sample. By absorbing the second light to generate a current that is closely dependent on the concentration of light conversion material in the detection sample.

Abstract: A semiconductor device includes a gate stack overlying a substrate. The semiconductor device further includes a spacer on sidewalls of the gate stack, where a top surface of the spacer is above a top surface of the gate stack. Additionally, the semiconductor device includes a protection layer overlying the gate stack and filling at least a portion of a space surrounded by the spacer above the top surface of the gate stack. Furthermore, the semiconductor device includes a contact hole over the spacer, where the contact hole extends over the gate stack, and where a sidewall of the contact hole has a step-wise shape.

Abstract: A stator structure for an electric motor unit, includes a main body; an insulated member mounted on the main body; a plastic body disposed on the insulated member; a copper circuit path disposed on the plastic body; a plurality of first and second windings, each being wound on the main body, consisting of a metal wire and a coated sheath enclosing the metal wire and includes first and second leading ends extending through the insulated member so as to be soldered on the copper circuit path; and several power conducting wires, each having a distal section soldered with the corresponding second leading end of a respective one of the second windings.

Abstract: A semiconductor device includes a gate stack overlying a substrate. The semiconductor device further includes a spacer on sidewalls of the gate stack, where a top surface of the spacer is above a top surface of the gate stack. Additionally, the semiconductor device includes a protection layer overlying the gate stack and filling at least a portion of a space surrounded by the spacer above the top surface of the gate stack. Furthermore, the semiconductor device includes a contact hole over the spacer, where the contact hole extends over the gate stack, and where a sidewall of the contact hole has a step-wise shape.

Abstract: A semiconductor device includes a semiconductor substrate; a gate stack overlying the substrate, a spacer formed on sidewalls of the gate stack, and a protection layer overlying the gate stack for filling at least a portion of a space surrounded by the spacer and the top surface of the gate stack. A top surface of the spacer is higher than a top surface of the gate stack.

Abstract: A method for manufacturing metal lines in a semiconductor device is provided. The method includes steps of: providing a substrate; forming a first barrier layer on the substrate; forming a sacrificial layer on the first barrier layer; forming an opening penetrating through the sacrificial layer to expose a portion of the first barrier layer; depositing a metal material on the exposed first barrier layer to form a metal line in the opening; removing the sacrificial layer and forming a second barrier layer over the resulting structure; etching the second barrier layer and the first barrier layer while remaining a barrier spacer on a sidewall of the metal line; and forming an insulating layer on the substrate and the barrier spacer. A semiconductor device having the metal lines produced by the method is also provided.

Abstract: A metal line fabricating method includes the following steps. Firstly, a substrate is provided. Then, a first barrier layer is formed over the substrate. A first dielectric layer is formed over the first barrier layer. An opening is formed in the first dielectric layer, wherein the opening runs through the first dielectric layer, so that the first barrier layer is exposed to the opening. A metal deposition process is performed to form a metal line over the exposed first barrier layer at a bottom of the opening. The first dielectric layer and the first barrier layer underlying the first dielectric layer are removed, but the metal line and the first barrier layer underlying the metal line are remained. Afterwards, a second dielectric layer is formed over the substrate which is provided with the metal line and the first barrier layer.

Abstract: An integrated circuit structure includes a semiconductor substrate; a gate stack overlying the semiconductor substrate; a gate spacer on a sidewall of the gate stack; a first contact plug having an inner edge contacting a sidewall of the gate spacer, and a top surface level with a top surface of the gate stack; and a second contact plug over and contacting the first contact plug. The second contact plug has a cross-sectional area smaller than a cross-sectional area of the first contact plug.

Abstract: A semiconductor structure includes a transistor over a substrate, the transistor comprising a gate and a contact region, which is adjacent to the gate and within the substrate. A first dielectric layer is over the contact region. A contact structure is within the first dielectric layer and over the contact region. A first electrode and a second electrode are within the first dielectric layer, wherein at least one of the first electrode and the second electrode is over the contact structure. The first electrode and second electrodes may be laterally or vertically separated. A phase change structure is disposed between the first electrode and the second electrode. The phase change structure includes at least one spacer within the first dielectric layer and a phase change material (PCM) layer over the spacer.

Abstract: An angle adjusting mechanism for a streetlamp includes a housing connected with a lamp, and an angle positioning board and a lamppost sleeve installed in the housing. The angle positioning board has a first positioning hole and a plurality of second positioning holes. The lamppost sleeve has a first positioning tube and a second positioning tube. Through pre-arranging corresponding angles of the angle positioning board and the lamppost sleeve, the illumination angle of the lamp is capable of being adjusted. Moreover, the lamppost sleeve and the angle positioning board are fastened by screws, so the illumination angle of the lamp and the housing can be rapidly adjusted through loosening or fastening the screws.

Abstract: A semiconductor device includes a semiconductor substrate; a gate stack overlying the substrate, a spacer formed on sidewalls of the gate stack, and a protection layer overlying the gate stack for filling at least a portion of a space surrounded by the spacer and the top surface of the gate stack. A top surface of the spacer is higher than a top surface of the gate stack.

Abstract: A light guide illumination device is provided. The light guide illumination device includes a light guide shade configured with a spherical shape. The light guide shade includes a light inputting aperture and a light outputting aperture. The light inputting aperture is adapted for receiving a light emitting unit therein. The light emitting unit is adapted for emitting a light therefrom. The light guide shade has an inner spherical surface serving as a light reflecting surface. The light reflecting surface is adapted for reflecting the light for one or more times and outputting the reflected light out from the light outputting aperture. The outputted light is then projected from the light outputting aperture to the ambient space.

Abstract: A gain structure for improving a luminance of a road lamp is disclosed. The gain structure includes a plurality of lamps and a plurality of reflecting shades. The lamps are secured to an end surface of a body of the road lamp. The lamps arranged at an outer side are arranged with an oblique angle toward the lamp arranged at a middle side of the lamps, so that the illumination range can be enlarged. Each of the reflecting shades is provided for accommodating a plurality of light emitting units therein for improving the efficiency of each of the light emitting units. In such a way, the present invention is adapted for providing a solution for the problems of the conventional technology, and is further adapted for improving the entire light emitting efficiency and lowering the glare.

Abstract: An integrated circuit structure includes a semiconductor substrate; a gate stack overlying the semiconductor substrate; a gate spacer on a sidewall of the gate stack; a first contact plug having an inner edge contacting a sidewall of the gate spacer, and a top surface level with a top surface of the gate stack; and a second contact plug over and contacting the first contact plug. The second contact plug has a cross-sectional area smaller than a cross-sectional area of the first contact plug.

Abstract: A semiconductor structure includes a first conductive layer coupled to a transistor. A first dielectric layer is over the first conductive layer. A second conductive layer is within the first dielectric layer, contacting a portion of a top surface of the first conductive layer. The second conductive layer includes a cap portion extending above a top surface of the first dielectric layer. A first dielectric spacer is between the first dielectric layer and the second conductive layer. A phase change material layer is above a top surface of the second conductive layer. A third conductive layer is over the phase change material layer. A second dielectric layer is over the first dielectric layer. A second dielectric spacer is on a sidewall of the cap portion, wherein a thermal conductivity of the second dielectric spacer is less than that of the first dielectric layer or that of the second dielectric layer.

Abstract: A method of fabricating a layer with a tiny structure and a thin film transistor comprising the same is disclosed. The method of fabricating the layer with a tiny structure comprises providing a substrate, coating a coating composition on the substrate to form a coating layer, wherein the coating composition comprises nano conductive particles or nano semiconductor particles having functional groups bonded on a surface thereof uniformly dispersed in a solvent, and irradiating the coating layer by an additional energy to break the functional groups, resulting in aggregation of nano conductive particles or nano semiconductor particles to form a tiny structure.

Abstract: A semiconductor structure includes a transistor over a substrate, the transistor comprising a gate and a contact region, which is adjacent to the gate and within the substrate. A first dielectric layer is over the contact region. A contact structure is within the first dielectric layer and over the contact region. A first electrode and a second electrode are within the first dielectric layer, wherein at least one of the first electrode and the second electrode is over the contact structure. The first electrode and second electrodes may be laterally or vertically separated. A phase change structure is disposed between the first electrode and the second electrode. The phase change structure includes at least one spacer within the first dielectric layer and a phase change material (PCM) layer over the spacer.