Abstract: A control circuit for a switch mode power supply (SMPS) includes a power switch for coupling to a primary winding of the power supply and a startup resistor coupled to an external input voltage and to a control terminal of the power switch. The control circuit also includes a controller. During startup, the controller is configured to cause the power switch to amplify a startup current from an external input voltage through the startup resistor and provide a startup power to the controller. During normal operation, the controller is configured to provide a power switch control signal to turn on and off the power switch for controlling a current flow in the primary winding and regulating an output of the power supply. The controller is configured to provide a current signal for driving an NPN power switch and to provide a voltage signal for driving an NMOS power switch.

Abstract: The present disclosure provides method, device and mobile terminal for webpage text parsing. The method includes: after a webpage element is parsed into a common JavaScript script, loading the common JavaScript script, and simultaneously constructing a DOM tree node corresponding to the common JavaScript script. The common JavaScript script is executed, after loading of the common JavaScript script is completed; and the next webpage element may then be parsed, after construction of the DOM tree node corresponding to the common JavaScript script is completed. While loading and executing the common JavaScript script, construction of the DOM tree node corresponding to the common JavaScript script and parsing of the next webpage element are still continued to accelerate webpage text processing. This reduces the time of parsing, loading, rendering, and displaying the whole webpage, and also allows the elements after the common JavaScript script element to be rendered and displayed in advance.

Abstract: Structures and formation methods of a chip package are provided. The method includes forming multiple conductive structures over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also includes disposing a mold over the carrier substrate. The method further includes forming a protection layer between the mold and the carrier substrate to surround the semiconductor die and the conductive structures. In addition, the method includes removing the mold.

Abstract: Disclosed is a system for managing and replacing batteries. In particular, a rapid field tester that pairs via Bluetooth with a smart device, such as a mobile phone. The smart device containing an APP that further interfaces with a remote server to provide management of the battery. A user can test their battery and receive a visual indication if the battery passes or fails predetermined conditions. If the battery fails the test, a replacement battery will be automatically sent to the user. All of the test data is logged through the server and provided to the user in order to facilitate effective battery management.

Abstract: The present invention provides a method of preventing pry for random access memory. A functional interface is designed between a computer program and a random access memory. When the computer program wants to store an original data into the random access memory, an encryption procedure is processed on the original data first, and then stoic into the random access memory for being an encrypted data. When the computer program ants to fetch related data float the random access memory, the functional interface is used to fetch the encrypted data for decryption, so that the original data is obtained for calculation.

Abstract: A method of making a micro electromechanical system (MEMS) package includes patterning a substrate to form a MEMS section. The method further includes bonding a carrier to a surface of the substrate. The carrier is free of active devices. The carrier includes a carrier bond pad on a surface of the carrier opposite the MEMS section. The carrier bond pad is electrically connected to the MEMS section. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad. The bonding of the wafer bond pad to the carrier bond pad includes re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.

Abstract: The present invention provides a monitor for dynamic displaying. K cameras are connected with the monitor in order to display images recorded by the k cameras on a screen of the monitor. An “abnormality detection algorithm” is used for detecting abnormalities of the images recorded by the k cameras. Those images having abnormalities are displayed continuously on the screen, other images having no abnormality are not displayed, so that a security service personnel can watch those images having abnormalities on the screen to enable appropriate action quickly.

Abstract: The present application discloses a light-emitting array, comprising a first light-emitting chip; a second light-emitting chip; and a conductive line electrically connected to the first light-emitting chip and the second light-emitting chip, wherein the conductive line includes a first segment and a second segment having a radius curvature different from that of the first segment.

Abstract: A dual band printed antenna that includes a substrate including a first and a second surfaces opposite to each other and conductive holes, a first and a second drivers, a first and a second reflectors and a transmission line is provided. The first driver is disposed on the first surface to generate a radiation pattern of a first frequency band. The first reflector is disposed on the first surface and apart from the first driver. The second driver is disposed on the second surface to generate a radiation pattern of a second frequency band and electrically coupled to the first driver through the conductive holes. The reflector is disposed on the second surface, corresponding to a position of the first driver and apart from the second driver. The transmission line is disposed on the first surface and coupled to a feeding point and a ground point of the first driver.

Abstract: This application discloses a data traffic management method and apparatus. The method includes: obtaining traffic control information of a first application and a data traffic value used by the first application, where the traffic control information includes at least an upper traffic threshold; and disconnecting a data connection of the first application when the data traffic value used by the first application is greater than or equal to the upper traffic threshold included in the traffic control information of the first application. In the foregoing solution, real-time traffic management on a single application is implemented, so that a user instantly modifies traffic control information according to a requirement, to manage data traffic in real time.

Abstract: An LED bracket includes a first metal sheet, a second metal sheet and a casing. The casing covers the first and second metal sheets and includes a receiving slot. The casing partially covers the first and second metal sheets. The first metal sheet has a first pin terminal and a first carrying end. The second metal sheet has a second pin terminal and a second carrying end. The non-bent first and second pin terminals are opposite to each other and extended outwardly from the casing. The first and second carrying ends are disposed in the receiving slot and respectively have at least one first support portion and at least one second support portion to enhance the strength of fixing the first and second metal sheets with the casing. The non-bent pins improve the degree of freedom of the design of the casing and the light emission efficiency of LEDs.

Abstract: An integrated circuit device having a substrate including a dielectric layer is patterned with a set of conductive line trenches. Each conductive line trench has parallel vertical sidewalls and a horizontal bottom. A first metal fills a first portion of the set of conductive line trenches, wherein the metal fill is created by an anneal and reflow process. A liner which is an alloy of the first metal and a selected element is formed at the interfaces of the metal layer and a surface of the dielectric and is created simultaneously with the metal fill by the anneal and reflow process. A second metal layer fills a remainder portion of the set of conductive line trenches.

Abstract: A method for providing electrical stimulation to a user as a user performs a set of tasks during a time window, the method comprising: providing an electrical stimulation treatment, characterized by a stimulation parameter and a set of portions, to a brain region of the user in association with the time window; for each task of the set of tasks: receiving a signal stream characterizing a neurological state of the user; from the signal stream, identifying a neurological signature characterizing the neurological state associated with the task; and modulating the electrical stimulation treatment provided to the brain region of the user based upon the neurological signature, wherein modulating comprises delivering a portion of the set of portions of the electrical stimulation treatment to the brain region of the user, while maintaining an aggregate amount of the stimulation parameter of the treatment provided during the time window below a maximum limit.

Abstract: The present invention discloses an IC Carrier of a semiconductor package and its manufacturing method. The IC Carrier of the semiconductor package includes a dielectric layer and a patterned conductor layer. The dielectric layer has at least one opening groove. The patterned conductor layer is embedded in the dielectric layer, wherein a part of the patterned conductor layer is as a conductive pillar, which has two exposed ends, and a part of the patterned conductor layer is as a conductive wire, which only has one exposed end.

Abstract: A biometrics data recognition apparatus includes a computer device and a biometrics data recognition device, which includes a biometrics data sensor, a control processor and a storage. The biometrics data sensor captures to-be-recognized biometrics data of an organism. The storage stores template biometrics data and website login data corresponding to each other. The control processor receives and judges whether the to-be-recognized biometrics data matches with the template biometrics data and outputs the website login data to the computer device if a match occurs. The computer device communicates with a cloud server and extracts login format data from the cloud server according to the website login data, and combines the website login data with the login format data to make the computer device log in a website corresponding to the website login data. A biometrics data recognition method and a non-transitory tangible computer readable medium are also disclosed.

Abstract: An ultra-weak light multispectral imaging method and an ultra-weak light multispectral imaging system, which can realize multispectral two-dimensional imaging of an ultra-weak light object by constituting a linear array from single-photon detectors of all response wavelengths and combining it with light-splitting technology. The ultra-weak light multispectral two-dimensional imaging system realizes high-resolution optical modulation by adopting the compressive sensing (CS) theory and the digital light processing (DLP) technology and using a linear array single-photon detector as a detection element; the ultra-weak light multispectral two-dimensional imaging system comprises a light filter, a first lens (1), a DMD control system, a second lens, a spectrophotometer, a linear array single-photon detector consisting of a plurality of single-photon detectors with different response wavelengths, and a central processing unit; and the sensitivity of the system can reach the single-photon level.

Abstract: Various embodiments of the present technology provide systems and methods for mounting and dismounting a computing component (e.g., a HDD) of a server system. The server system contains one or more drawers, each of which can host a plurality of computing components. A computing component can have a side surface attached to a lever via a hinge. When the computing component is placed into a designated location of a drawer, pressing a first end of the lever in one direction can cause a second end of the lever to interact with at least one portion of the drawer and further cause the computing component to move into a close position or out of the close position.

Abstract: A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a fin structure disposed over the substrate. The fin structure includes one or more fins. The semiconductor device further includes an insulation material disposed on the substrate. The semiconductor device further includes a gate structure disposed on a portion of the fin structure and on a portion of the insulation material. The gate structure traverses each fin of the fin structure. The semiconductor device further includes a source and drain feature formed from a material having a continuous and uninterrupted surface area. The source and drain feature includes a surface in a plane that is in direct contact with a surface in a parallel plane of the insulation material, each of the one or more fins of the fin structure, and the gate structure.

Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.

Abstract: The disclosure is related to a scan driving circuit for an oxide semiconductor thin film transistor and the NOR gate logic operation circuit thereof. The NOR gate logic operation circuit includes a first invertor and a second invertor applied in the pull down holding circuit of the GOA circuit, and a plurality of transistors. The combination of the NTFT and the invertor displaces the original function of the PMOS element to realize a characteristic similar to an original COMS NOR operation circuit, thereby solving a design problem of the logic operation circuit using a IGZO TFT single element, such that a larger scale digital integrated circuit is further suitably integrated into the liquid crystal display.