Abstract: A handheld communication device and a thin heat dissipating structure are provided. The thin heat dissipating structure includes: a heat conducting plate, having a top surface, a bottom surface and a penetrated slot, wherein an inner annular wall is formed in the penetrated slot, and convex pieces are oppositely extended from the inner annular wall and the bottom surface; and a heat pipe, received in the penetrated slot and latched and positioned by the convex pieces; a flat surface is defined by the heat pipe, the convex pieces and the bottom surface; the top surface is formed with at least one pair of punching recesses at two sides of the penetrated slot, so that two sides of the inner annular wall and the top surface are squeezed and deformed so as to form protrusions where the heat pipe is latched and positioned.

Abstract: An electrical connector includes a frame member having a front end portion that is formed with a front recess, a terminal module including two pin sets that are respectively disposed at opposite lateral sides of the frame member, two clamp members clamping the frame member therebetween, and a support seat surrounding and being fixedly connected to the frame member, the terminal module, and the clamp members. Each of the clamp members is formed with a plurality of securing holes. The support seat has an inner seat body which fills a gap between a rear end portion of the terminal module and a rear end portion of the frame member such that a front end portion of the pin sets is exposed to the external environment, and which fills the securing holes.

Abstract: A damping element for a heat dissipating fan is made of a silica gel and includes a body member and a foot column extended from a first side surface of the body member. The foot column has a base portion extended from the body member, a column portion extended from the base portion and a head portion disposed at a free end of the foot column. A diameter of the base portion is larger than that of the column portion and a diameter of the head portion is larger than that of the column portion. The first side surface may include bumps. The damping element connects with the heat dissipating fan and the foot column is inserted into a hole of a computer casing. The bumps are contacted with the casing for absorbing the vibration of the fan and eliminating noise.

Abstract: A writing-preventive device against computer viruses is electrically connected with a BIOS memory chip, a real time clock chip, and a CMOS chip respectively so as to prevent any data-writing action to any of the mentioned chips when the writing-preventive device is enabled. Besides, the writing-preventive device is mounted on a computer housing at a proper position for a user to reach and enable it easily.