Patents by Inventor Chao-Cheng Lan

Chao-Cheng Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11407225
    Abstract: An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: August 9, 2022
    Assignee: International United Technology Co., Ltd.
    Inventors: Yuan-Liang Lan, Chih-Shun Chuang, Chao-Cheng Lan
  • Publication number: 20210221132
    Abstract: An inkjet chip including a substrate, a plurality of control elements, an insulating layer, a plurality of first conductive patterns, a plurality of second conductive patterns and a plurality of heaters is provided. The insulating layer is disposed on the control element and has a plurality of openings. The openings each have a first length in a first direction. Each first conductive pattern has a first sidewall overlapping one of the openings and is electrically connected between one of the control elements and one of the heaters. Each second conductive pattern has a second sidewall overlapping the one of the openings and is electrically connected to one of the heaters. A distance in the first direction is included between the first sidewall and the second sidewall opposing to each other. The distance is less than the first length. A thermal bubble inkjet printhead adopting the inkjet chip is also provided.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Applicant: International United Technology Co., Ltd.
    Inventors: Yuan-Liang Lan, Chih-Shun Chuang, Chao-Cheng Lan
  • Publication number: 20210221135
    Abstract: A thermal bubble inkjet printhead including a substrate, a plurality of control elements, a plurality of heaters, an ink barrier and a nozzle plate is provided. The control elements are disposed on the substrate. The heaters are electrically connected to the control elements. The material of the heaters is a transparent conductive material. The ink barrier is disposed on the heater and has a plurality of ink chambers. Each of the ink chambers overlaps one of the heaters. The nozzle plate is disposed on the ink barrier and has a plurality of nozzles. Each nozzle overlaps one of the ink chambers.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 22, 2021
    Applicant: International United Technology Co., Ltd.
    Inventors: Yuan-Liang Lan, Chih-Shun Chuang, Chao-Cheng Lan