Patents by Inventor Chao-Chiang Kuo
Chao-Chiang Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107682Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.Type: ApplicationFiled: April 21, 2023Publication date: March 28, 2024Inventors: Chao-Wei Chiu, Chih-Chiang Tsao, Jen-Jui Yu, Hsuan-Ting Kuo, Hsiu-Jen Lin, Ching-Hua Hsieh
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Publication number: 20240071952Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.Type: ApplicationFiled: January 10, 2023Publication date: February 29, 2024Inventors: Chih-Chiang Tsao, Hsuan-Ting Kuo, Chao-Wei Chiu, Hsiu-Jen Lin, Ching-Hua Hsieh
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Patent number: 11038258Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.Type: GrantFiled: August 30, 2019Date of Patent: June 15, 2021Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Patent number: 10879591Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.Type: GrantFiled: February 1, 2019Date of Patent: December 29, 2020Assignee: HTC CorporationInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Patent number: 10833398Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: GrantFiled: October 22, 2019Date of Patent: November 10, 2020Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Publication number: 20200052386Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: ApplicationFiled: October 22, 2019Publication date: February 13, 2020Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Patent number: 10516202Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: GrantFiled: May 18, 2017Date of Patent: December 24, 2019Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Publication number: 20190386381Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.Type: ApplicationFiled: August 30, 2019Publication date: December 19, 2019Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Patent number: 10490883Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: GrantFiled: May 18, 2017Date of Patent: November 26, 2019Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Publication number: 20190165453Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.Type: ApplicationFiled: February 1, 2019Publication date: May 30, 2019Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Publication number: 20170256846Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: ApplicationFiled: May 18, 2017Publication date: September 7, 2017Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Publication number: 20170256845Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: ApplicationFiled: May 18, 2017Publication date: September 7, 2017Applicant: HTC CorporationInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Patent number: 9716307Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: GrantFiled: November 8, 2012Date of Patent: July 25, 2017Assignee: HTC CORPORATIONInventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
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Publication number: 20140125528Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.Type: ApplicationFiled: November 8, 2012Publication date: May 8, 2014Applicant: HTC CORPORATIONInventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Chao-Chiang KUO
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Patent number: 8294626Abstract: A multi-band antenna apparatus is provided. The multi-band antenna apparatus comprises a circuit board, a planar printed antenna with a feed-in point and a telescopic antenna. The planar printed antenna is printed on the circuit board. The telescopic antenna is coupled to the circuit board through the feed-in point. The planar printed antenna receives a first radio frequency signal, and then transmits the first radio frequency signal to the circuit board through the feed-in point. The telescopic antenna receives a second radio frequency signal and then transmits the second radio frequency to the circuit board.Type: GrantFiled: June 24, 2010Date of Patent: October 23, 2012Assignee: MSTAR Semiconductor, Inc.Inventor: Chao-Chiang Kuo
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Publication number: 20110050522Abstract: A multi-band antenna apparatus is provided. The multi-band antenna apparatus comprises a circuit board, a planar printed antenna with a feed-in point and a telescopic antenna. The planar printed antenna is printed on the circuit board. The telescopic antenna is coupled to the circuit board through the feed-in point. The planar printed antenna receives a first radio frequency signal, and then transmits the first radio frequency signal to the circuit board through the feed-in point. The telescopic antenna receives a second radio frequency signal and then transmits the second radio frequency to the circuit board.Type: ApplicationFiled: June 24, 2010Publication date: March 3, 2011Applicant: MStar Semiconductor, Inc.Inventor: CHAO-CHIANG KUO
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Publication number: 20090179803Abstract: An antenna includes first and second radiating elements and a grounding element. The first radiating element is operable in a first frequency range and has a feeding end. The second radiating element is operable in a second frequency range, is connected to the feeding end of the first radiating element, and cooperates with the first radiating element so as to define a slot therebetween such that the second radiating element is coupled to the first radiating element. The grounding element extends from the first radiating element.Type: ApplicationFiled: September 8, 2008Publication date: July 16, 2009Applicant: Quanta Computer Inc.Inventors: Tiao-Hsing Tsai, Chao-Chiang Kuo, Cheng-Hsiung Wu
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Publication number: 20090179801Abstract: An antenna includes a loop unit and an arm unit. The loop unit includes a grounding element that extends along a first plane, a feeding element that extends along a second plane, and a radiating element that interconnects the feeding element and the grounding element. The arm unit extends from the feeding element of the loop unit.Type: ApplicationFiled: July 21, 2008Publication date: July 16, 2009Applicant: Quanta Computer Inc.Inventors: Tiao-Hsing Tsai, Chao-Chiang Kuo, Tsung-Ming Kuo
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Publication number: 20070210964Abstract: An antenna includes loop and single-pole antenna members, and an inductor. The single-pole antenna member is spaced apart from the loop antenna member. The inductor has a first inductor terminal coupled to the loop antenna member, and a second inductor terminal coupled to the single pole antenna member. A desired resonance frequency of the antenna can be achieved by simply adjusting the inductance of the inductor.Type: ApplicationFiled: May 25, 2006Publication date: September 13, 2007Applicant: Quanta Computer Inc.Inventors: Tiao-Hsing Tsai, Chao-Chiang Kuo, Ying-Chih Wang
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Publication number: 20070120749Abstract: A portable electronic device includes a metallic casing, a circuit board, a feeding line, and a grounding line. The metallic casing confines an accommodating space, and is formed with a slot that is in spatial communication with the accommodating space and that is defined by a slot-defining wall. The circuit board is disposed in the accommodating space, and is provided with feeding and grounding ports. The feeding line serves to couple electrically the feeding port to the slot-defining wall. The grounding line serves to couple electrically the grounding port to the slot-defining wall.Type: ApplicationFiled: March 20, 2006Publication date: May 31, 2007Inventors: Tiao-Hsing Tsai, Chao-Chiang Kuo, Ying-Chih Wang