Abstract: An electronic device is provided and includes a substrate, a first contact pad, a second contact pad, an electronic element, and a third contact pad. The first contact pad and the second contact pad are disposed on the substrate. The electronic element is located above the substrate and electrically connected to the first contact pad and the second contact pad. The third contact pad is electrically connected to the first contact pad. A test method for an electronic device is also provided.

Abstract: An electronic device includes a display panel, a backlight source, an ambient light sensor, and a controller. The backlight source is disposed below the display panel and includes light-emitting units. The ambient light sensor detects the brightness of the ambient light. The controller judges the modes of the electronic device according to the detecting results of the ambient light sensor. When the electronic device is in a low-brightness mode, the brightness of a white frame of the display panel is greater than 0 nit and less than or equal to 50 nits, and in a general mode, the brightness of the white frame of the display panel is greater than 50 nits. The backlight source includes a local dimming function. When in the low-brightness mode, the local dimming function is in a first mode. When in the general mode, the local dimming function is in a second mode.

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a conductive electrode, and a first layer. The conductive electrode and the first layer are disposed on the base, the first layer surrounds the conductive electrode and overlaps an edge portion of the conductive electrode. In a cross-sectional view, the first layer is divided into a first part and a second part, the conductive electrode is located between the first part and the second part, and a width of the first part is different from a width of the second part.

Abstract: An electronic device includes: a substrate; a conductive layer disposed on the substrate, wherein the conductive layer includes a plurality of branch portions; a plurality of bonding pads respectively disposed on the plurality of branch portions of the conductive layer; and an insulating layer disposed between the conductive layer and the plurality of bonding pads.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units and a reflective structure. The plurality of light-emitting units are electrically connected to the driving substrate. The reflective structure is disposed adjacent to the plurality of light-emitting units. The reflective structure includes a first reflective element. The first reflective element has a first surface, and the first surface is adjacent to at least one of the plurality of light-emitting units. There is a first distance between an edge of the bottom of the first surface and an edge of the driving substrate. The first distance is greater than 0 mm and less than 10 mm.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a light-emitting unit, and a reflective structure. The driving substrate includes a contact. The light-emitting unit is disposed on the driving substrate and electrically connected to the contact. The reflective structure is disposed on the driving substrate. Wherein the reflective structure includes a first insulating layer, a metal layer, and a second insulating layer, and the metal layer is disposed between the first insulating layer and the second insulating layer.

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

Abstract: Disclosed are an electronic device and another electronic device. The electronic device includes a circuit substrate, a conductive adhesive, a driving element and a first protective layer. The circuit substrate includes a connection pad. The conductive adhesive covers the connection pad. The driving element is arranged on the connection pad, and is electrically connected to the circuit substrate through the conductive adhesive. Another electronic device includes a circuit substrate, a first electronic unit, a second electronic unit, and a first protective layer. The first electronic unit is arranged on the circuit substrate and has two side walls. The second electronic unit is arranged on the circuit substrate and has two side walls. The first protective layer at least surrounds a part of both side walls of the first electronic unit and a part of both side walls of the second electronic unit.

Abstract: An electronic device includes a substrate, a driving layer, an organic layer and a diode. The driving layer is disposed on the substrate, and the driving layer includes a thin film transistor. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The diode is disposed on the organic layer and overlapped with the through hole portion, the diode is electrically connected to the driving layer by a bonding pad overlapped with the through hole portion, and the diode is not overlapped with the thin film transistor.

Abstract: An electronic device includes a substrate; a first bonding pad and a second bonding pad disposed on the substrate; an electronic assembly on the substrate; a first conductive structure; and a second conductive structure. The electronic assembly includes a third bonding pad and a fourth bonding pad. The third bonding pad is electrically connected to the first bonding pad by the first conductive structure and the fourth bonding pad is electrically connected to the second bonding pad by the second conductive structure. The thickness of the first conductive structure and the thickness of the second conductive structure are greater than or equal to 10 ?m and less than or equal to 30 ?m.

Abstract: A method of manufacturing an electronic device is provided. The method includes the following steps: providing a substrate; forming a thin-film transistor layer on the substrate; forming a first passivation layer on the substrate; forming an organic layer on the substrate; patterning the organic layer to expose a first region; forming a second passivation layer on the substrate; patterning the first passivation layer to expose a second region; forming a bonding pad on the substrate, wherein the bonding pad corresponds to an overlapping area of the first region and the second region; and bonding an electronic component to the bonding pad. An electronic device manufactured by the method is also provided.

Abstract: A method for fabricating an electronic device is provided. The method includes the following steps. A substrate is provided. A solder and a flux are formed on the substrate. An electronic component is bonded on the solder. At least a portion of the flux is removed. An electronic device is also provided.

Abstract: A tiled display device is provided. The tiled display device includes a first substrate, a second substrate and a light-emitting unit. The first substrate includes a first main substrate and a first flexible substrate. The first flexible substrate is disposed on the first main substrate. The second substrate is disposed adjacent to the first substrate. The light-emitting unit is disposed on the first flexible substrate. In addition, a portion of the light-emitting unit protrudes from an edge of the first main substrate.

Abstract: An electronic substrate and an electronic device are provided. The electronic substrate includes a base, a protruding portion, and a bonding pad. The protruding portion and the bonding pad are disposed on the base. The bonding pad is not overlapped with a boundary of the protruding portion.

Abstract: An electronic device is provided in the present disclosure. The electronic device includes a substrate, a driving layer, an organic layer and a light emitting layer. The driving layer is disposed on the substrate. The organic layer is disposed on the driving layer, and the organic layer includes a through hole portion. The light emitting unit is disposed on the organic layer. The light emitting unit is electrically connected to the driving layer by a bonding pad. A ratio of an area of the through hole portion overlapped with the bonding pad to and area of the bonding pad is greater than or equal to 0.3 and less than or equal to 3 in a top view direction of the electronic device.

Abstract: A tiled display device is provided. The tiled display device includes a first substrate, a second substrate and a light-emitting unit. The first substrate includes a first main substrate and a first flexible substrate. The first flexible substrate is disposed on the first main substrate. The second substrate is disposed adjacent to the first substrate. The light-emitting unit is disposed on the first flexible substrate. In addition, a portion of the light-emitting unit protrudes from an edge of the first main substrate.

Abstract: A lighting device includes a tube, an insulating body, a first circuit substrate and a plurality of first light emitting diodes. At least one portion of the tube is light-permeable. The insulating body is disposed in the tube, and has a first surface and a second surface which is opposite to the first surface. The first circuit substrate is disposed on the first surface. The first light emitting diodes are disposed on and electrically connected with the first circuit substrate.

Abstract: A display device includes a TFT-OLED (thin-film transistor—organic light emitting diode) array formed on a substrate and a signal line directly coupled to the substrate and a power line separately coupled to a frame that is joined to the substrate. The signal line is formed on a surface of a circuit board that is joined to the surface of the substrate including the TFT-OLED array, through an anisotropic conductive film. The power line is an electrical cable joined to the frame. When the frame is coupled to the substrate to form the display device, the signal line is peripherally disposed from the OLED power line. The display device can advantageously include a TFT-OLED array of increased dimension because the separately connected OLED power line can accommodate high currents needed for large TFT-OLED arrays without damaging the signal line or the anisotropic conductive film.

Abstract: A display device includes a TFT-OLED (thin-film transistor—organic light emitting diode) array formed on a substrate and a signal line directly coupled to the substrate and a power line separately coupled to a frame that is joined to the substrate. The signal line is formed on a surface of a circuit board that is joined to the surface of the substrate including the TFT-OLED array, through an anisotropic conductive film. The power line is an electrical cable joined to the frame. When the frame is coupled to the substrate to form the display device, the signal line is peripherally disposed from the OLED power line. The display device can advantageously include a TFT-OLED array of increased dimension because the separately connected OLED power line can accommodate high currents needed for large TFT-OLED arrays without damaging the signal line or the anisotropic conductive film.

Abstract: A method for manufacturing an organic light-emitting device includes forming an anode over a substrate, at least one organic light-emitting layer over the anode, a buffer layer over the organic light emitting layer, and a cathode over the buffer layer. The cathode is formed of first, second and third cathode layers. The first cathode layer is formed of a conductive material. A second cathode layer of electron transport material is formed over the first cathode layer and a third cathode layer of conductive material is formed over the second cathode layer.