Abstract: A memory device is provided. The memory device includes a write pass-gate transistor, a read pass-gate transistor, a write word line, and a read word line. The write pass-gate transistor is disposed in a first layer. The read pass-gate transistor is disposed in a second layer above the first layer. The write word line is disposed in a metallization layer above the first layer and electrically coupled to the write pass-gate transistor through a write path. The read word line is disposed in the metallization layer and electrically coupled to the read pass-gate transistor through a read path. The write path is different from the read path.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate and a gate structure. The substrate includes a fin. The fin includes a source region and a drain region spaced apart from the source region. The gate structure is located between the source region and the drain region. The gate structure includes a work function layer. The work function layer includes a compound of a metal material and a Group VIA material.

Abstract: The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.

Abstract: A micro jet gas film generation apparatus aims to eject a gas to a work object which is desired for cooling or insulating from heat. The micro jet gas film generation apparatus has a spout formed at a diameter of 5-100 ?m to generate a gas film on the work object. As the diameter of the spout of the micro jet gas film generation apparatus is small, the micro jet gas film generated from the spout cannot produce a large eddy due to the lack of sufficient energy, hence can maintain a thin film after a long distance ejection to improve cooling and heat insulation performance. Moreover, due to the small diameter of the spout, it also consumes less gas and can reduce the amount of gas required.

Abstract: A micro jet gas film generation apparatus aims to eject a gas to a work object which is desired for cooling or insulating from heat. The micro jet gas film generation apparatus has a spout formed at a diameter of 5-100 ?m to generate a gas film on the work object. As the diameter of the spout of the micro jet gas film generation apparatus is small, the micro jet gas film generated from the spout cannot produce a large eddy due to the lack of sufficient energy, hence can maintain a thin film after a long distance ejection to improve cooling and heat insulation performance. Moreover, due to the small diameter of the spout, it also consumes less amount of gas and can reduce the amount of gas required.

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract: A damper power-generating system includes a damper, a driving apparatus, and a generator. The driving apparatus simply consumes energy to do work for generation of electric power. That is, the work is done by utilizing the displacement due to the strong up-and-down vibration within a damper, wherein the displacement due to the up-and-down vibration drives a set of gear racks, which, in turns, drives gears having a one-way driving apparatus, so that rotation can be achieved in one direction, and, further, buffering springs and accelerative gears are used, so that speedy and uniform rotation can be achieved.

Abstract: A dual-ported AND-type match-line circuit includes at least one dual-ported dynamic AND gate. The dual-ported dynamic AND gate includes a group of CAM cells and a dual-ported dynamic circuit. A group of CAM cells connected to a dual-ported dynamic circuit and to the GND. The dual-ported dynamic circuit is connected to a group of CAM cells. The dual-ported dynamic circuit includes a setting circuit, a first directing circuit, a second directing circuit, a first AND dynamic output circuit and a second AND dynamic output circuit.

Abstract: A dual-ported AND-type match-line circuit includes at least one dual-ported dynamic AND gate. The dual-ported dynamic AND gate includes a group of CAM cells and a dual-ported dynamic circuit. A group of CAM cells connected to a dual-ported dynamic circuit and to the GND. The dual-ported dynamic circuit is connected to a group of CAM cells. The dual-ported dynamic circuit includes a setting circuit, a first directing circuit, a second directing circuit, a first AND dynamic output circuit and a second AND dynamic output circuit.

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract: A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.

Abstract: A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.