Abstract: Provided is a planar package structure and its manufacturing method. The planar package structure totally packages a die to make the die unexposed and to protect the die from impact or scratch. Further, at least one conductive pad of the die is electronically connected to an external electronic circuit through a plurality of wiring patterns and through holes filled with conductive materials. Then, the die may be connected to the external electronic circuit and may be protected from impact or scratch.

Abstract: The present invention provides a structure for integrating microfluidic devices and electrical biosensors, including: a substrate for carrying an electrical biosensor; a microfluidic channel layer for providing at least a fluid to flow; a cover member for the inflow and outflow of the at least a fluid, and an electrical biosensor, having a biosensing layer and mounted to the cover member in a flip-chip manner; wherein the fluid flows into an inlet, passes the electrical biosensor for sensing and flows out through a fluid outlet.

Abstract: The present invention provides a structure for integrating microfluidic devices and optical biosensors, including: a holder member for carrying and receiving an optical biosensor; microfluidic channel layer for providing at least a fluid to flow; and a cover member for the inflow and outflow of the at least a fluid, the at least a fluid flowing from an inlet, passing the optical biosensor by at least a fluid channel for sensing, and then flowing out through at least one fluid outlet. As such, the integrating structure of the present invention can detect the optical signal produced by the optical biosensor, transport fluid, and avoid leakage, and is applicable to the integration of various forms of optical biosensors and microfluidic devices.