Patents by Inventor Chao-Chun Lin

Chao-Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100246940
    Abstract: A method of generating a high dynamic range image and an electronic device using the same are described. The method includes loading a brightness adjustment model created by a neural network algorithm; obtaining an original image; acquiring a pixel characteristic value, a first characteristic value in a first direction, and a second characteristic value in a second direction of the original image; and generating an HDR image through the brightness adjustment model according to the pixel characteristic value, the first characteristic value, and the second characteristic value of the original image. The electronic device includes a brightness adjustment model, a characteristic value acquisition unit, and a brightness adjustment procedure.
    Type: Application
    Filed: August 28, 2009
    Publication date: September 30, 2010
    Applicant: MICRO-STAR INTERNATIONA'L CO., LTD.
    Inventor: Chao-Chun Lin
  • Publication number: 20090091888
    Abstract: The present invention discloses an EMI shielding and heat dissipating structure for dissipating heat generated by a chip inside a portable electronic device. The EMI shielding and heat dissipating structure includes an EMI shielding housing for shielding the chip. A first opening is formed on the EMI shielding housing. The EMI shielding and heat dissipating structure further includes a thermal pad disposed on the chip, and an EMI shielding gasket installed on the EMI shielding housing. A second opening is formed on the EMI shielding gasket and located in a position corresponding to the first opening. The EMI shielding and heat dissipating structure further includes a heat-dissipating component installed on the EMI shielding gasket and connected to the thermal pad for dissipating the heat transmitted from the thermal pad.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 9, 2009
    Inventors: Chao-Chun Lin, Shih-Hong Chen, Cheng-Hsiung Hsu, Tsung-Ying Chung