Patents by Inventor Chao-Chyun An

Chao-Chyun An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8736083
    Abstract: A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
    Type: Grant
    Filed: April 29, 2009
    Date of Patent: May 27, 2014
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corporation, Hannstar Display Corporation, Chimei Innolux Corporation, Industrial Technology Research Institute
    Inventors: Sheng-Shu Yang, Hsiao-Ting Lee, Chao-Chyun An
  • Publication number: 20110230044
    Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.
    Type: Application
    Filed: June 1, 2011
    Publication date: September 22, 2011
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORP., QUANTA DISPLAY INC., HANNSTAR DISPLAY CORP., CHI MEI OPTOELECTRONICS CORP., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TOPOLY OPTOELECTRONICS CORP.
    Inventors: Shyh-Ming Chang, Sheng-Shu Yang, Chao-Chyun An
  • Patent number: 7977788
    Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: July 12, 2011
    Assignees: Taiwan TFT LCD Association, Chunghwa Picture Tubes, Ltd., Au Optronics Corp., Quanta Display Inc., Hannstar Display Corp., Chi Mei Optoelectronics Corp., Industrial Technology Research Institute, Toppoly Optoelectronics Corp.
    Inventors: Shyh-Ming Chang, Sheng-Shu Yang, Chao-Chyun An
  • Publication number: 20100163869
    Abstract: A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
    Type: Application
    Filed: April 29, 2009
    Publication date: July 1, 2010
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORPORATION, HANNSTAR DISPLAY CORPORATION, CHI MEI OPTOELECTRONICS CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Shu Yang, Hsiao-Ting Lee, Chao-Chyun An
  • Publication number: 20080023830
    Abstract: A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.
    Type: Application
    Filed: November 24, 2006
    Publication date: January 31, 2008
    Applicants: TAIWAN TFT LCD ASSOCIATION, CHUNGHWA PICTURE TUBES, LTD., AU OPTRONICS CORP., QUANTA DISPLAY INC., HANNSTAR DISPLAY CORP., CHI MEI OPTOELECTRONICS CORP., INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, TOPPOLY OPTOELECTRONICS CORP.
    Inventors: Shyh-Ming Chang, Sheng-Shu Yang, Chao-Chyun An
  • Publication number: 20070039954
    Abstract: A connection device for use with a blast-resistant container comprises a frame with a recess, and a connecting member. An arcuate surface is formed on the outside of the opening of the recess. The connecting member is connected to the frame at one end with a head engaged in the recess and connected to a side panel at the other end. Thus, this connection device can transmit strong membrane force between each two panels of a container and meet the connection requirement of a blast-resistant container. When there is a blast, the connection device is able to confine the blast within the container in that the maximum strain of the plastic hinge in the connecting member can be controlled by the curvature of that arcuate surface formed on the frame.
    Type: Application
    Filed: May 8, 2006
    Publication date: February 22, 2007
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Jong Wang, Chao-Chyun An, Buh-Shiuh Teng, Chuang-Chieh Hsu, Feng-Ho Wang
  • Patent number: 6918501
    Abstract: An strengthened door for an blast-resistant cargo container includes a door panel horizontally slidably mounted on the cargo container. The door panel has an upper side, a lower side, a first vertical side and a second vertical side each hooked on the cargo container to provide overlapping joints to effectively limit blast damage to the inside of the cargo container and prevent an aircraft from being damaged.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: July 19, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Jong Wang, Feng-Ho Wang, Chao-Chyun An, Buh-Shiuh Teng
  • Publication number: 20040011789
    Abstract: An strengthened door for an blast-resistant cargo container includes a door panel horizontally slidably mounted on the cargo container. The door panel has an upper side, a lower side, a first vertical side and a second vertical side each hooked on the cargo container to provide overlapping joints to effectively limit blast damage to the inside of the cargo container and prevent an aircraft from being damaged.
    Type: Application
    Filed: March 28, 2003
    Publication date: January 22, 2004
    Inventors: Ming-Jong Wang, Feng-Ho Wang, Chao-Chyun An, Buh-Shiuh Teng
  • Publication number: 20030230589
    Abstract: A connection device for use with a blast-resistant container includes a frame with a recess, and a connecting member. An arcuate surface is formed on the outside of the opening of the recess. The connecting member is connected to the frame at one end with a head engaged in the recess and connected to a side panel at the other end. Thus, this connection device can transmit strong membrane force between each two panels of a container and meet the connection requirement of a blast-resistant container. When there is a blast, the connection device is able to confine the blast within the container for that the maximum strain of the plastic hinge in the connecting member can be controlled by the curvature of that arcuate surface formed on the frame.
    Type: Application
    Filed: May 23, 2003
    Publication date: December 18, 2003
    Inventors: Ming-Jong Wang, Chao-Chyun An, Buh-Shiuh Teng, Chuang-Chieh Hsu, Feng-Ho Wang
  • Patent number: 5876092
    Abstract: A modular foldaway table is disclosed to be installed behind a backrest of a seat. It includes: (a) a pair of spaced table legs, each table leg having a top bent portion and a bottom bent portion; (b) the top bent portion having a spindle aperture and a curved groove spaced from the spindle aperture; (c) a front board having two lateral sides and a spindle and a pin on each of the two lateral sides, wherein the pin is spaced from the spindle, the spindle is pivotedly screwed to the spindle aperture of the top bent portion of the table leg, the pin is movably engaged with the curved groove for limiting the swinging angle of the front board about the spindle; and a rear board pivotedly engaged with the front board via a pair of spaced hinges. The bottom bent portion has an opening with a slit for snap-installation to the seat and a protrusive ankle spaced from the opening for substantially conforming the bottom bent portion of the table leg against the seat.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: March 2, 1999
    Assignee: Industrial Technology Research Institute
    Inventor: Chao-Chyun An