Abstract: An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.

Abstract: A probe pin cleaning pad including a foam layer, a cleaning layer, and a polishing layer is provided. The cleaning layer is disposed between the foam layer and the polishing layer. A cleaning method for a probe pin is also provided.

Abstract: An external electromagnetic shielding device is provided. The external electromagnetic shielding device includes a bottom shield, a conductive cover being in a grid-like shape and arranged above the bottom shield, and a rolling module. The conductive cover includes a top shield spaced apart from the bottom shield, a lateral shield connected to the top shield, and a plurality of supports that are fixed to the lateral shield. The supports include a bottom support in an annular arrangement, and any two of the supports are spaced apart from each other. The rolling module includes a rolling unit and a linkage unit that is connected to the rolling unit and the bottom support. When the linkage unit is coiled on or released from the rolling unit, the bottom support can be moved to allow the lateral shield to fold or unfold between the bottom shield and the top shield.

Abstract: An external electromagnetic shielding device is provided. The external electromagnetic shielding device includes a bottom shield, a conductive cover being in a grid-like shape and arranged above the bottom shield, and a rolling module. The conductive cover includes a top shield spaced apart from the bottom shield, a lateral shield connected to the top shield, and a plurality of supports that are fixed to the lateral shield. The supports include a bottom support in an annular arrangement, and any two of the supports are spaced apart from each other. The rolling module includes a rolling unit and a linkage unit that is connected to the rolling unit and the bottom support. When the linkage unit is coiled on or released from the rolling unit, the bottom support can be moved to allow the lateral shield to fold or unfold between the bottom shield and the top shield.