Patents by Inventor Chao Hao
Chao Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11708368Abstract: The present invention provides a crystalline form of a benzodiazepine derivative hydrochloride of Formula I or its ethanolate, wherein R is methyl or ethyl. The present invention also provides a method of preparing the crystal form of the compound of Formula I and a pharmaceutical composition comprising the crystal form.Type: GrantFiled: February 13, 2019Date of Patent: July 25, 2023Assignee: JIANGSU NHWALUOKANG PHARMACEUTICAL RESEARCH AND DEVELOPMENT CO., LTD.Inventors: Qingeng Li, Chen Duan, Tao Wang, Jian Liao, Changwen Li, Chao Hao
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Publication number: 20220024905Abstract: The present invention relates to crystal form A of a propionamide derivative and a preparation method therefor. The crystal form A of the compound of formula (1) obtained in the present invention has good crystalline stability and chemical stability, and can be better used in clinical treatment.Type: ApplicationFiled: December 9, 2019Publication date: January 27, 2022Inventor: Chao HAO
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Benzodiazepine Derivative Hydrochloride and Crystal Form, Preparation Method and Application thereof
Publication number: 20210002283Abstract: The present invention provides a crystalline form of a benzodiazepine derivative hydrochloride of Formula I or its ethanolate, wherein R is methyl or ethyl. The present invention also provides a method of preparing the crystal form of the compound of Formula I and a pharmaceutical composition comprising the crystal form.Type: ApplicationFiled: February 13, 2019Publication date: January 7, 2021Inventors: Qingeng Li, Chen Duan, Tao Wang, Jian Liao, Changwen LI, Chao Hao -
Publication number: 20190170446Abstract: A multi-tube parallel heat spreader has at least three conduits disposed in parallel; a first connector fitted onto the first end of each conduit, with one side of the first connector configured with a first connecting plughole for the first end of each conduit to be inserted into, and a first connecting passage inside the first connector that is communicated to each first connecting plughole; a second connector fitted onto the second end of each conduit, with one side configured with a second connecting plughole for the second end of each conduit to be inserted into, and a second connecting passage inside the second connector that is communicated to each second connecting plughole; a working fluid contained in the vacuum interior of each conduit and the first and second connector; a heat conduction base abutting and combined with the conduits, including a heat conductive surface and a supporting surface.Type: ApplicationFiled: December 6, 2017Publication date: June 6, 2019Inventors: Sin-Wei HE, Chao-Hao Yeh, Wei-Han Huang, Yong-Da Peng
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Publication number: 20180320997Abstract: A temperature-uniforming plate with supporting effect includes a base plate and a cover plate mounted onto the base plate, wherein a frame is sandwiched between the base plate and the cover plate to define a vacuum chamber among the base plate, the cover plate and the frame. The frame has two arms inwardly extending therefrom and extending to a heat conducting area formed on the base plate. A passage is defined between the two arms. The two arms are clamped between a top surface of the base plane and a bottom surface of the cover plate. The temperature-uniforming plate has a thinning and simplified structure for easily formed, reducing manufacturing cost and providing a supporting effect.Type: ApplicationFiled: May 5, 2017Publication date: November 8, 2018Applicant: FORCECON TECHNOLOGY CO., LTD.Inventors: Sin-Wei HE, Chih-Ren HUANG, Chao-Hao YEH
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Patent number: 8459341Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.Type: GrantFiled: November 4, 2010Date of Patent: June 11, 2013Assignee: Foxconn Technology Co., Ltd.Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
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Publication number: 20110236877Abstract: The present invention discloses a biosensor and a method using the same to perform a biotest. The biosensor of the present invention integrates a SAW (Surface Acoustic Wave) device and a test polymer to detect an analyte in a liquid specimen. The test polymer reacts with the analyte. After reaction, the substantial weight decrease of the test polymer causes the variation of the SAW characteristics. The attributes and content of the analyte is detected and determined according to the variation of the SAW characteristics.Type: ApplicationFiled: March 26, 2010Publication date: September 29, 2011Inventors: Da-Jeng YAO, Hsu-Chao Hao
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Publication number: 20110048683Abstract: An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.Type: ApplicationFiled: November 4, 2010Publication date: March 3, 2011Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHANG-SHEN CHANG, JUEI-KHAI LIU, CHAO-HAO WANG, HSIEN-SHENG PEI
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Patent number: 7859419Abstract: A smoke detecting method and device are provided. The smoke detecting method and device capture a plurality of images; determine one of the plurality of images as an analyzable image when the one of the plurality of images is identified to have a moving object; analyze a chrominance variation of the analyzable image; analyze at least one of an edge blur and a flickering frequency of the analyzable image; compare at least one of analyzed results from the analyzing steps with a corresponding predetermined feature; and determine the moving object is a smoke when at least one of the analyzed results conforms to the corresponding predetermined feature.Type: GrantFiled: April 9, 2008Date of Patent: December 28, 2010Assignee: Industrial Technology Research InstituteInventors: Chang Shen-Kuen, Lu Chung-Hsien, Chao Hao-Ting, Chang Shih-Hua, Hsu Yu-Ren, Huang Kun-Lin, Wang Cheng-Wei
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Patent number: 7845394Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.Type: GrantFiled: December 18, 2007Date of Patent: December 7, 2010Assignee: Foxconn Technology Co., Ltd.Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
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Publication number: 20100288014Abstract: A gas sensor comprises a first surface-acoustic-wave device, at least one further surface-acoustic-wave device, and a control device. The first surface-acoustic-wave device includes a piezoelectric substrate, a pair of transducers and an external circuit. The pair of transducers consists of a first transducer and a second transducer, and they are formed on two sides of the piezoelectric substrate. The first transducer is utilized to generate a surface acoustic wave on the piezoelectric substrate. The external circuit electrically connects to the pair of transducers. At least one further surface-acoustic-wave device includes at least one first surface-acoustic-device and a sensing porous thin film of which two sides are formed on the pair of the transducers. The control device is utilized to control only one external circuit to become activated at one time.Type: ApplicationFiled: August 11, 2009Publication date: November 18, 2010Applicant: National Tsing Hua UniversityInventors: Da-Jeng Yao, Chia-Min Yang, Kea-Tiong Tang, Hsu-Chao Hao, Je-Shih Chao, Pei-Hsin Ku, Cheng-Han Li
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Patent number: 7609520Abstract: A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.Type: GrantFiled: May 23, 2007Date of Patent: October 27, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
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Patent number: 7547124Abstract: An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.Type: GrantFiled: March 9, 2007Date of Patent: June 16, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
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Patent number: 7543960Abstract: A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.Type: GrantFiled: January 26, 2007Date of Patent: June 9, 2009Assignee: Foxconn Technology Co., Ltd.Inventors: Chang-Shen Chang, Juei-Khai Liu, Chao-Hao Wang, Hsien-Sheng Pei
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Publication number: 20090084526Abstract: A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.Type: ApplicationFiled: December 18, 2007Publication date: April 2, 2009Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHANG-SHEN CHANG, JUEI-KHAI LIU, CHAO-HAO WANG, HSIEN-SHENG PEI
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Publication number: 20090020268Abstract: A heat pipe (10) includes a casing (11) and a composite wick structure (14). The casing includes an evaporator section (15) and a condenser section (16). The wick structure includes a plurality of grooves (142, 143) and an artery mesh (145). The grooves at the evaporator section each have a smaller groove width and a smaller apex angle (A1) than those of each of the grooves at the condenser section. A method for manufacturing the heat pipe includes: providing a casing with a plurality of grooves axially defined therein; shrinking a diameter of one portion of the casing to obtain an evaporator section of the heat pipe; placing an artery mesh to contact with an inner wall of the casing; vacuuming the casing and placing a working fluid in the casing; sealing the casing to obtain the heat pipe.Type: ApplicationFiled: September 18, 2007Publication date: January 22, 2009Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHANG-SHEN CHANG, CHAO-HAO WANG, JUEI-KHAI LIU, HSIEN-SHENG PEI
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Publication number: 20090020269Abstract: A heat pipe (10) includes a metal casing (12) having an evaporator section (121) and a condenser section (122). A major wick structure (14) is disposed on an inner wall of the casing. At least one assistant wick structure (16) is disposed in and contacts with the major wick structure, and working medium fills in the casing and saturates the major wick structure and the at least one assistant wick structure. An average pore size of the major wick structure corresponding to the evaporator section is smaller than that of the major wick structure corresponding to the condenser section. A diameter of a cross section of the at least one assistant wick structure is smaller than a diameter of a cross section of the major wick structure, and thus the at least one assistant wick structure has a linear contact with the major wick structure.Type: ApplicationFiled: September 19, 2007Publication date: January 22, 2009Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHANG-SHEN CHANG, CHAO-HAO WANG, JUEI-KHAI LIU, HSIEN-SHENG PEI
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Publication number: 20080283222Abstract: A heat dissipation apparatus includes a heat sink (30) and a heat spreader (10). The heat spreader includes a heating area (11) and a cooling area (13), and defines a vapor chamber (16) therein. A plurality of artery meshes (151) are arranged in the vapor chamber and extend from the heating area towards the cooling area. A working medium is contained in the artery meshes. The artery meshes are located between wick structures (15a, 15b) attached to a top cover (14) and a base plate (12) of the heat spreader, respectively, and contact therewith.Type: ApplicationFiled: June 14, 2007Publication date: November 20, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHANG-SHEN CHANG, CHAO-HAO WANG, JUEI-KHAI LIU, HSIEN-SHENG PEI
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Publication number: 20080186191Abstract: A smoke detecting method and device are provided. The smoke detecting method and device capture a plurality of images; determine one of the plurality of images as an analyzable image when the one of the plurality of images is identified to have a moving object; analyze a chrominance variation of the analyzable image; analyze at least one of an edge blur and a flickering frequency of the analyzable image; compare at least one of analyzed results from the analyzing steps with a corresponding predetermined feature; and determine the moving object is a smoke when at least one of the analyzed results conforms to the corresponding predetermined feature.Type: ApplicationFiled: April 9, 2008Publication date: August 7, 2008Inventors: Chang Shen-Kuen, Lu Chung-Hsien, Chao Hao-Ting, Chang Shih-Hua, Hsu Yu-Ren, Huang Kun-Lin, Wang Cheng-Wei
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Patent number: D616362Type: GrantFiled: December 4, 2009Date of Patent: May 25, 2010Assignee: Compal Electronics, Inc.Inventors: Chao-Hao Chang, Chia-Ying Chen