Patents by Inventor Chao-Hao YEH

Chao-Hao YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190170446
    Abstract: A multi-tube parallel heat spreader has at least three conduits disposed in parallel; a first connector fitted onto the first end of each conduit, with one side of the first connector configured with a first connecting plughole for the first end of each conduit to be inserted into, and a first connecting passage inside the first connector that is communicated to each first connecting plughole; a second connector fitted onto the second end of each conduit, with one side configured with a second connecting plughole for the second end of each conduit to be inserted into, and a second connecting passage inside the second connector that is communicated to each second connecting plughole; a working fluid contained in the vacuum interior of each conduit and the first and second connector; a heat conduction base abutting and combined with the conduits, including a heat conductive surface and a supporting surface.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 6, 2019
    Inventors: Sin-Wei HE, Chao-Hao Yeh, Wei-Han Huang, Yong-Da Peng
  • Publication number: 20180320997
    Abstract: A temperature-uniforming plate with supporting effect includes a base plate and a cover plate mounted onto the base plate, wherein a frame is sandwiched between the base plate and the cover plate to define a vacuum chamber among the base plate, the cover plate and the frame. The frame has two arms inwardly extending therefrom and extending to a heat conducting area formed on the base plate. A passage is defined between the two arms. The two arms are clamped between a top surface of the base plane and a bottom surface of the cover plate. The temperature-uniforming plate has a thinning and simplified structure for easily formed, reducing manufacturing cost and providing a supporting effect.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 8, 2018
    Applicant: FORCECON TECHNOLOGY CO., LTD.
    Inventors: Sin-Wei HE, Chih-Ren HUANG, Chao-Hao YEH