Abstract: A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.

Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.

Abstract: An opening and closing device for a curtain mounted on a guiding part, the guiding part is provided with the curtain; the opening and closing device is used for driving automatically the opening and closing of the curtain; the opening and closing device includes a mainframe and a connecting mechanism. The mainframe includes a shell, a driver, and a driving wheel; the driving wheel and the driver are mounted in the shell, the driver drives the driving wheel to rotate. The connecting mechanism includes a hanging piece and a bracket; a first end of the bracket is inserted into the shell, the hanging piece is movably connected with a second end of the bracket and hung on the guiding part; the hanging piece can be moved vertically relative to the bracket so that the driving wheel is attached closely to the outer wall of the guiding part.

Abstract: Various aspects of the disclosure relate to rate matching techniques for block encoding. In some aspects, a decision regarding whether to use repetition-based rate matching or puncture-based rate matching is made based on a block size of information being encoded. In some aspects, repetition-based rate matching uses a bit-reversal permutation technique.

Abstract: This application provides data transmission methods, devices, and systems. In one implementation, a method comprises: receiving, by a central device of a wireless network, at least one first data packet sent by a remote device of the wireless network, wherein each of the at least one first data packet comprises a sequence number indicating a relative location of a payload of the corresponding first data packet in a second data packet; reordering, by the central device, the at least one first data packet, based on the sequence number of each of the at least one first data packet, to obtain the second data packet; and sending, by the central device, the second data packet.

Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.

Abstract: Aspects of the disclosure relate to rate-matching a stream of bits encoded using polar codes. An exemplary method generally includes determining a mother code size (N) for transmitting an encoded stream of bits based, at least in part, on a minimum supported code rate for transmitting the encoded stream of bits (Rmin), a control information size of the encoded stream of bits (K), a number of coded bits for transmission (E), and a maximum mother code size (Nmax), encoding a stream of bits using a polar code of size (N, K) and storing the encoded stream of bits in a circular buffer, and performing rate-matching on the stored encoded stream of bits based, at least in part, on a comparison among the mother code size (N), the control information size of the encoded stream of bits (K), and the number of coded bits for transmission (E).

Abstract: The present application provides a display device and a mobile terminal. The display device includes a display panel and a backlight module arranged on one side of the display panel. The display panel includes a first display area, a second display area arranged on one side of the first display area, and a third display area arranged within the second display area. The backlight module includes a via area, and the via area is arranged corresponding to the third display area. The backlight module includes a first light source arranged corresponding to the first display area and a second light source arranged corresponding to the second display area.

Abstract: A method of controlling movement of an autonomous mobile apparatus including a driving module, a processor, and a positioning module includes steps of: the processor moving the autonomous mobile apparatus at a default speed from a first location toward a second location along a straight path; the positioning module obtaining data related to a current location; when the processor determines that a distance between the current location and the second location is greater than a predetermined distance, the processor obtaining a deviating direction and a minimum distance of the current location relative to the straight path; the processor setting a movement speed and an angular velocity based on the deviating direction, a tolerant distance, the minimum distance, and the default speed; and the processor controlling the driving apparatus to move the autonomous mobile apparatus at the movement speed and turning the autonomous mobile apparatus at the angular velocity.

Abstract: An in-game virtual object control method including: providing, by a first terminal, a virtual object residence area on a graphical user interface of the first terminal, where a plurality of virtual objects to be selected are displayed in the virtual object resident area according to a trigger instruction; in response to a selection instruction for the plurality of virtual objects to be selected, selecting a target number of target virtual objects from the plurality of virtual objects to be selected, and adding the target number of target virtual objects into a virtual city; generating a demand task associated with at least one unselected virtual object to be selected, and displaying, on the graphical user interface, task information corresponding to the demand task; and completing the demand task, increasing the a preset duration for the virtual object to be selected to leave the virtual object residence area corresponding to the demand task.

Abstract: There is provided a display substrate, including: a base; light-emitting units on a side of the base; a flat light-shielding functional layer, including a black matrix and a first planarization layer, on a side of the light-emitting units away from the base, light outgoing openings being provided in the black matrix and being in one-to-one correspondence with the light-emitting units, and the first planarization layer at least filling the light outgoing openings; and a color filter layer, including color filter patterns in one-to-one correspondence with the light outgoing openings, on a side of the flat light-shielding functional layer away from the base, an orthographic projection of each color filter pattern on the base covering an orthographic projection of the light outgoing opening corresponding to the color filter pattern on the base. A method for manufacturing a display substrate, a display panel and a display apparatus are further provided.

Abstract: In an embodiment, a magnetic assembly includes: an inner permeance annulus; and an outer permeance annulus connected to the inner permeance annulus via magnets, wherein the outer permeance annulus comprises a peak region with a thickness greater than other regions of the outer permeance annulus.

Abstract: A method and apparatus for forming tungsten features in semiconductor devices is provided. The method includes exposing a top opening of a feature formed in a substrate to a physical vapor deposition (PVD) process to deposit a tungsten liner layer within the feature. The PVD process is performed in a first processing region of a first processing chamber and the tungsten liner layer forms an overhang portion, which partially obstructs the top opening of the feature. The substrate is transferred from the first processing region of the first processing chamber to a second processing region of a second processing chamber without breaking vacuum. The overhang portion is exposed to nitrogen-containing radicals in the second processing region to inhibit subsequent growth of tungsten along the overhang portion. The feature is exposed to a tungsten-containing precursor gas to form a tungsten fill layer over the tungsten liner layer within the feature.

Abstract: A curved display apparatus is provided, including one or more bending portions where the curved display apparatus is bent. At least the one or more bending portions of the curved display apparatus including a stacked structure, which includes a support layer; a display panel on the support layer; and N number of pressure sensitive adhesive layers and M number of flexible base layers between the support layer and the display panel, N is an integer equal to or greater than 3, M is an integer equal to or greater than 2. A first one of the N number of pressure sensitive adhesive layers adheres the support layer and a first one of the M number of flexible base layers together. A last one of the N number of pressure sensitive adhesive layers adheres the display panel and a last one of the M number of flexible base layers together.

Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.

Abstract: A power supply box includes a box body, and a box cover is fitted on the box body. The box body is internally provided with a first inner cavity and a second inner cavity. The first inner cavity is internally provided with a potentiometer. An adjuster of the potentiometer passes through a cavity wall and is located in the second inner cavity. The first inner cavity and the second inner cavity are separated by a vertical partition plate. The second inner cavity is partitioned into a first storage cavity and a second storage cavity through a transverse partition plate. The two ends of the vertical partition plate are provided with a first open slot and a second open slot, respectively. The first inner cavity communicates with the first storage cavity through the first open slot. The first inner cavity communicates with the second storage cavity through the second open slot.

Abstract: Composite dielectric structures for semiconductor die assemblies, and associated systems and methods are disclosed. In some embodiments, the composite dielectric structure includes a flexible dielectric layer configured to conform to irregularities (e.g., particles, defects) at a bonding interface of directly bonded semiconductor dies (or wafers). The flexible dielectric layer may include a polymer material configured to deform in response to localized pressure generated by the irregularities during bonding process steps. The composite dielectric structure includes additional dielectric layers sandwiching the flexible dielectric layer such that the composite dielectric structure can provide robust bonding strength to other dielectric layers through the additional dielectric layers. In some embodiments, a chemical vapor deposition process may be used to form the composite dielectric structure utilizing siloxane derivatives as a precursor.

Abstract: A power supply box includes a box body, and a box cover is fitted on the box body. The box boy is internally provided with a first inner cavity and a second inner cavity. The first inner cavity is internally provided with a potentiometer. An adjuster of the potentiometer passes through a cavity wall and is located in the second inner cavity. The first inner cavity and the second inner cavity are separated by a vertical partition plate. The second inner cavity is partitioned into a first storage cavity and a second storage cavity through a transverse partition plate. The two ends of the vertical partition plate are provided with a first open slot and a second open slot, respectively. The first inner cavity communicates with the first storage cavity through the first open slot. The first inner cavity communicates with the second storage cavity through the second open slot.

Abstract: This application provides data transmission methods, devices, and systems. In one implementation, a method comprises: receiving, by a central device of a wireless network, at least one first data packet sent by a remote device of the wireless network, wherein each of the at least one first data packet comprises a sequence number indicating a relative location of a payload of the corresponding first data packet in a second data packet; reordering, by the central device, the at least one first data packet, based on the sequence number of each of the at least one first data packet, to obtain the second data packet; and sending, by the central device, the second data packet.

Abstract: The invention discloses a machining method of welding an ear plate on a barrel of a central cylinder of a horizontal preheater.