Patents by Inventor Chao Hsiang Chen
Chao Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147658Abstract: A fan module and computing device with the fan module are disclosed. The fan module includes a handle configured to actuate between an operation state and a release state. The handle in the release state allows a user to vertically remove the fan module from its respective fan module slot and away from the bottom panel.Type: ApplicationFiled: January 11, 2023Publication date: May 2, 2024Inventors: Chao-Jung CHEN, Chih-Hsiang LEE, Wei-Pin CHEN, Jyue HOU, Cheng-Chieh WENG
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Patent number: 11971824Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.Type: GrantFiled: September 9, 2020Date of Patent: April 30, 2024Assignee: AETHERAI IP HOLDING LLCInventors: Chi-Chung Chen, Wei-Hsiang Yu, Chao-Yuan Yeh
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Publication number: 20240113429Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.Type: ApplicationFiled: August 16, 2023Publication date: April 4, 2024Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chia-Hung Chen, Chih-Wei Liao, Hau Yuen Tan, Hao-Hsiang Yang, Shih-Keng Huang
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Publication number: 20240102207Abstract: A temperature-sensing and humidity-controlling fiber includes a hydrophilic material and a temperature-sensing material. The temperature-sensing material has a lower critical solution temperature (LCST) between 31.2° C. and 32.5° C. when a light transmittance thereof is in a range from 3% to 80%, in which a wavelength of the light is between 450 nm and 550 nm.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Wen-Jung CHEN, Wei-Hsiang LIN, Chao-Huei LIU
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Publication number: 20240103377Abstract: A composition and method for removing a metal-containing layer or portion of a layer of a pellicle of an EUV mask are provided. The composition includes water; one or more oxidizing agents; and one or more acids. The method includes forming one or more layers over a silicon substrate with at least one of those layers includes a metal containing layer and removing the metal containing layer by contacting the metal containing layer with the composition of the disclosed and claimed subject matter.Type: ApplicationFiled: October 15, 2020Publication date: March 28, 2024Applicant: Versum Materials US, LLCInventors: CHAO-HSIANG CHEN, CHUNG-YI CHANG, YI-CHIA LEE, WEN DAR LIU
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Publication number: 20240104019Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.Type: ApplicationFiled: September 9, 2020Publication date: March 28, 2024Applicant: AETHERAI IP HOLDING LLCInventors: Chi-Chung CHEN, Wei-Hsiang YU, Chao-Yuan YEH
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Publication number: 20240094600Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly and a first driving assembly. The movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The optical element driving mechanism further includes a first opening, and an external light beam travels along a first axis to pass through the first opening.Type: ApplicationFiled: September 15, 2023Publication date: March 21, 2024Inventors: Tso-Hsiang WU, Chao-Chang HU, Yung-Yun CHEN, Ya-Hsiu WU
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Publication number: 20240087967Abstract: An integrated circuit component includes a semiconductor substrate, conductive pads, a passivation layer and conductive vias. The semiconductor substrate has an active surface. The conductive pads are located on the active surface of the semiconductor substrate and electrically connected to the semiconductor substrate, and the conductive pads each have a contact region and a testing region, where in each of the conductive pads, an edge of the contact region is in contact with an edge of the testing region. The passivation layer is located on the semiconductor substrate, where the conductive pads are located between the semiconductor substrate and the passivation layer, and the testing regions and the contact regions of the conductive pads are exposed by the passivation layer. The conductive vias are respectively located on the contact regions of the conductive pads.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen
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Publication number: 20240089103Abstract: A device-verification system is configured to verify the authenticity of an electronic device using a digital signature of the electronic device verified by a certificate authority. In some examples, the electronic device includes a NFC tag storing device hardware information, device public and private keys, and a device digital signature ciphertext. A user may utilize a personal device to read the information from the NFC tag and the personal device may include a software application configured to communicate the information to a cloud-based certificate authority. The certificate authority may include a distributed system (e.g., a blockchain ledger) utilized to verify, store, and subsequently retrieve data corresponding to the electronic device. The certificate authority is configured to utilize the device digital signature to verify the authenticity of the device.Type: ApplicationFiled: September 12, 2023Publication date: March 14, 2024Inventors: Chao-Ying CHEN, Chiu-Hsiang HSU, Jian-Yin YE, Jack GUINCHARD, Lee GUINCHARD
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Patent number: 11927940Abstract: A management method for a cutting tool of a machine tool is provided. A user host imports a graphical data of a workpiece and a cutting tool database into CAM, and a user may select cutting tools to establish a complete machining process. T codes are replaced with electronic tags. Before executing a machine code comprising the electronic tags, the machine tool re-scans the cutting tools assembled at a tool turret and updates cutting tool arrangement information to ensure that the tool turret is equipped with the cutting tools used in the machining process. When the machine tool stores the electronic tags, a ready message is displayed for reminding an operator. When the electronic tags are not stored, the current storage location of a cutting tool lacked in the machining process or a warning message is displayed at the operation interface for reminding the operator.Type: GrantFiled: March 31, 2023Date of Patent: March 12, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chao-Chuang Mai, Chin-Hui Chen, Chi-Hsiang Lin, Zi-Chiao Lin
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240010915Abstract: Etching composition suitable for etching titanium nitride and molybdenum from a microelectronic device, which includes, consists essentially of, or consists of, in effective amounts: water; HNO3; optionally, at least one chloride ion source selected from the group of NH4Cl and HCl; a base selected from the group of an alkanolamine, NH4OH, a quaternary ammonium hydroxide, and mixtures thereof; optionally, at least one fluoride ion source; optionally, at least one heteroaromatic compound; and optionally, at least one water-miscible solvent selected from the group of diethylene glycol butyl ether, sulfolane, and propylene carbonate.Type: ApplicationFiled: March 2, 2021Publication date: January 11, 2024Applicant: Versum Materials US, LLCInventors: CHAO-HSIANG CHEN, JHIH KUEI GE, YI-CHIA LEE, WEN DAR LIU
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Patent number: 11017995Abstract: Composition, method and system for TiN hard mask removal from electronic circuitry devices, such as advanced pattern wafers have been disclosed. The cleaning compositions preferably comprise an etchant agent (also referred to as a base), an oxidizing agent, an oxidizing stabilizer (also referred to as a chelating agent), an ammonium salt, a corrosion inhibitor, and a solvent. Other optional additives could be provided. It is preferable that the pH of the cleaning composition be greater than 5.5. The cleaning composition is preferably free from dimethyl sulfoxide and tetramethylammonium hydroxide.Type: GrantFiled: July 19, 2019Date of Patent: May 25, 2021Assignee: Versum Materials US, LLCInventors: Chao-Hsiang Chen, Yi-Chia Lee, Wen Dar Liu, Chung-Yi Chang
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Publication number: 20200035485Abstract: Composition, method and system for TiN hard mask removal from electronic circuitry devices, such as advanced pattern wafers have been disclosed. The cleaning compositions preferably comprise an etchant agent (also referred to as a base), an oxidizing agent, an oxidizing stabilizer (also referred to as a chelating agent), an ammonium salt, a corrosion inhibitor, and a solvent. Other optional additives could be provided. It is preferable that the pH of the cleaning composition be greater than 5.5. The cleaning composition is preferably free from dimethyl sulfoxide and tetramethylammonium hydroxide.Type: ApplicationFiled: July 19, 2019Publication date: January 30, 2020Applicant: Versum Materials US, LLCInventors: Chao-Hsiang Chen, Yi-Chia Lee, Wen Dar Liu, Chung-Yi Chang
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Publication number: 20110166217Abstract: A pharmaceutical composition for preventing and/or treating bone loss is disclosed. The pharmaceutical composition includes an effective amount of a licorice, black bean, Cnidi Fructus, and buckhorn.Type: ApplicationFiled: March 14, 2011Publication date: July 7, 2011Inventors: Chao Hsiang CHEN, Mei Yin CHIEN, Wen Mei FU, Jin-Ming CHANG
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Publication number: 20110160298Abstract: A pharmaceutical composition for preventing and/or treating bone loss is disclosed. The pharmaceutical composition includes an effective amount of a licorice, black bean, Cnidi Fructus, and buckhorn.Type: ApplicationFiled: March 14, 2011Publication date: June 30, 2011Inventors: Chao Hsiang CHEN, Mei Yin Chien, Wen Mei Hu, Jin-Ming Chang
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Patent number: 7914821Abstract: A pharmaceutical composition for preventing and/or treating bone loss is disclosed. The pharmaceutical composition includes an effective amount of a licorice, black bean, Cnidi Fructus, and buckhorn.Type: GrantFiled: March 7, 2008Date of Patent: March 29, 2011Assignee: KO DA Pharmaceuticals Co., Ltd.Inventors: Chao Hsiang Chen, Mei-Yin Chien, Wen-Mei Fu, Jin-Ming Chang
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Publication number: 20110039898Abstract: A method for scavenging free radicals and inhibiting tyrosinase and melanin is provided. The method includes administering to a subject of effective amounts in a pharmaceutical composition comprising a compound of Formula (I) or (II) and a pharmaceutical acceptable salt, metal salt or solvent. In Formula (II), R is C1-6 alkyl, vitamin C or sugar. X is chlorine, bromine or iodine. The subject is a human. The pharmaceutical composition is for external and internal use.Type: ApplicationFiled: October 30, 2009Publication date: February 17, 2011Inventors: Chao-Hsiang CHEN, Mei-Yin Chien, Wen-Chi Hou, Yin-Hsiu Lin
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Publication number: 20090226551Abstract: A pharmaceutical composition for preventing and/or treating bone loss is disclosed. The pharmaceutical composition includes an effective amount of a licorice, black bean, Cnidi Fructus, and buckhorn.Type: ApplicationFiled: March 7, 2008Publication date: September 10, 2009Inventors: Chao Hsiang CHEN, Mei-Yin Chien, Wen-Mei Fu, Jin-Ming Chang