Patents by Inventor Chao-Hsiang LIU

Chao-Hsiang LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for wafer pod alignment
    Patent number: 11978653
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chao-Hsiang Liu
  • SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT
    Publication number: 20220384232
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Inventor: Chao-Hsiang LIU
  • Systems and methods for wafer pod alignment
    Patent number: 11469128
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: October 11, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chao-Hsiang Liu
  • SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT
    Publication number: 20200373181
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventor: Chao-Hsiang LIU
  • Systems and methods for wafer pod alignment
    Patent number: 10741433
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 11, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chao-Hsiang Liu
  • Systems and methods for wafer pod calibration
    Patent number: 10541162
    Abstract: In an embodiment, a system includes: a wafer pod defining a cavity configured to store a wafer at a wafer position; calibration sensors within the cavity, each calibration sensor configured to produce calibration data indicating that the wafer is at a respective part of the cavity; and a processor configured to determine whether the wafer is positioned at the wafer position within the cavity based on the calibration data.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: January 21, 2020
    Assignee: Taiwan Semiconductor Manfacturing Co., Ltd.
    Inventor: Chao-Hsiang Liu
  • SYSTEMS AND METHODS FOR WAFER POD CALIBRATION
    Publication number: 20190164790
    Abstract: In an embodiment, a system includes: a wafer pod defining a cavity configured to store a wafer at a wafer position; calibration sensors within the cavity, each calibration sensor configured to produce calibration data indicating that the wafer is at a respective part of the cavity; and a processor configured to determine whether the wafer is positioned at the wafer position within the cavity based on the calibration data.
    Type: Application
    Filed: January 29, 2018
    Publication date: May 30, 2019
    Inventor: Chao-Hsiang LIU
  • SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT
    Publication number: 20190164799
    Abstract: In an embodiment, a wafer pod includes: a cavity configured to receive and store a wafer; an alignment fiducial within the cavity, wherein: the alignment fiducial comprises two lines orthogonal to each other, and the alignment fiducial is configured to be detected by a robotic arm alignment sensor disposed on a robotic arm, wherein the alignment fiducial defines an alignment orientation for a robotic arm gripper hand to enter into the cavity.
    Type: Application
    Filed: January 30, 2018
    Publication date: May 30, 2019
    Inventor: Chao-Hsiang LIU