Abstract: A method includes fabricating a semiconductor device, wherein the method includes depositing a coating layer on a first region and a second region under a loading condition such that a height of the coating layer in the first region is greater than a height of the coating layer in the second region. The method also includes applying processing gas to the coating layer to remove an upper portion of the coating layer such that a height of the coating layer in the first region is a same as a height of the coating layer in the second region.

Abstract: A method for manufacturing a semiconductor structure is provided. A substrate including a fin structure is received, provided or formed. A sacrificial gate layer is formed over the fin structure and a source/drain structure is formed adjacent to the sacrificial gate layer, wherein the sacrificial gate layer is surrounded by a dielectric structure. The sacrificial gate layer is removed, wherein a recess is defined by the dielectric structure. A work function layer is formed in the recess, wherein the work function layer includes an overhang portion at an opening of the recess. A thickness of the work function layer is reduced. A glue layer is formed over the work function layer. A semiconductor structure thereof is also provided.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A touch device includes a substrate, multiple first electrodes, multiple second electrodes, multiple third electrodes, and a control circuit. The control circuit senses a touch position based on a first signal from the first electrodes. The control circuit transmits a second signal to the second electrodes based on the touch position, such that the second electrodes provide a first haptic feedback which is parallel to a top surface of the substrate. The control circuit also transmits a third signal to the third electrodes based on the touch position, such that the third electrodes provide a second haptic feedback along with a normal vector of the top surface of the substrate.

Abstract: A heat-insulating transparent PVC sheet is formed from a PVC substrate having a thickness of 0.02-2.0 mm and contains heat-insulation pastes evenly distributed over the PVC substrate, since the heat-insulation paste contains an essential component of wolfram cesium powder (WCs) with a chemical formula of CsXNYWO3-ZClC and having a particle size of 0.005-2 ?m, the heat-insulating transparent PVC sheet has an excellent weatherability, and particularly before and after tested in 300-hour service life in line with ASTM G-154 specification, has a physical property of weatherability decay rate (%) small than 4%.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: A heat-insulating transparent PVC sheet is formed from a PVC substrate having a thickness of 0.02-2.0 mm and contains heat-insulation pastes evenly distributed over the PVC substrate, since the heat-insulation paste contains an essential component of wolfram cesium powder (WCs) with a chemical formula of CsXNYWO3-ZClC and having a particle size of 0.005-2 ?m, the heat-insulating transparent PVC sheet has an excellent weatherability, and particularly before and after tested in 300-hour service life in line with ASTM G-154 specification, has a physical property of weatherability decay rate (%) small than 4%.

Abstract: A method for lithium aluminum film packaging materials, with water, high temperature and corrosion resistance, the substrate layer, and then layer, aluminum foil layer, anti-corrosion layer, adhesive layer and the inner layer together constitute from the outermost to innermost layer laminate structure in which one side of the aluminum foil layer, or both side surface of the conductive coating material to said coating and curing anticorrosive layer, and the use of fluorine-containing polyurethane resin constituting the laminated rubber layer and the inner layer of corrosion between the adhesive layer, used lithium batteries as plastic film packaging applications, it can promote lithium battery with Merit water resistance, high temperature resistance and corrosion resistance, and enhance the use of lithium batteries in years.

Abstract: The present invention provides a light-emitting diode (LED) chip. The LED chip includes a LED structure and an electrostatic discharge (ESD) protection structure. The ESD protection structure is in a corner of the LED chip and connects with the LED structure in anti-parallel. An interface between the LED structure and the ESD protection structure is a straight line from a top view.

Abstract: A vacuum deposition composite target includes a plurality of target blocks each including a target body, an insulating layer and a high-resistance-conductive layer. The target body has a top surface, a bottom surface and a peripheral surface connected between the top and bottom surfaces. The insulating layer is formed on the peripheral surface. The high-resistance-conductive layer is formed on the bottom surface of the target body and has a resistance higher than that of the target body. The target blocks are juxtaposed to each other. Each of the target blocks has a modulated resistance. A modulated resistance difference between any two adjacent ones of the target blocks is not greater than 5%.

Abstract: A semiconductor light-emitting structure and a semiconductor package structure thereof are provided. The semiconductor light-emitting structure includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a metal layer and a distributed Bragg reflector. The active layer is disposed on the first-type semiconductor layer. The second-type semiconductor layer is disposed on the active layer. The metal layer is disposed on the second-type semiconductor layer as a first reflective structure, wherein the metal layer has an opening portion. The distributed Bragg reflector is disposed on the metal layer and interposed into the opening portion as a second reflective structure. The first reflective structure and the second reflective structure form a reflective surface on the second-type semiconductor layer.

Abstract: A heat-insulating transparent PVC sheet is formed from a PVC substrate having a thickness of 0.02-2.0 mm and contains heat-insulation pastes evenly distributed over the PVC substrate, since the heat-insulation paste contains an essential component of wolfram cesium powder (WCs) with a chemical formula of CsXNYWO3-ZClC and having a particle size of 0.005-2 ?m, the heat-insulating transparent PVC sheet has an excellent weatherability, and particularly before and after tested in 300-hour service life in line with ASTM G-154 specification, has a physical property of weatherability decay rate (%) small than 4%.

Abstract: An aluminum plastic film packaging material for lithium batteries to prolong service life, at least comprising an inner layer and an aluminum foil layer, is performed an anti-corrosion treatment between the inner layer and the aluminum foil layer by one of the following ways: 1) a chromium-containing anti-corrosion layer is formed from an aqueous modified resin containing trivalent chromium; and 2) an adhesive layer with non-chromium material is formed from an aqueous modified resin, an epoxy curing agent, a silane coupling agent and a nano-sized metal oxide particle.

Abstract: The present invention provides a light-emitting diode (LED) chip. The LED chip includes a LED structure and an electrostatic discharge (ESD) protection structure. The ESD protection structure is in a corner of the LED chip and connects with the LED structure in anti-parallel. An interface between the LED structure and the ESD protection structure is a straight line from a top view.

Abstract: A semiconductor light-emitting structure and a semiconductor package structure thereof are provided. The semiconductor light-emitting structure includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a metal layer and a distributed Bragg reflector. The active layer is disposed on the first-type semiconductor layer. The second-type semiconductor layer is disposed on the active layer. The metal layer is disposed on the second-type semiconductor layer as a first reflective structure, wherein the metal layer has an opening portion. The distributed Bragg reflector is disposed on the metal layer and interposed into the opening portion as a second reflective structure. The first reflective structure and the second reflective structure form a reflective surface on the second-type semiconductor layer.

Abstract: A semiconductor light emitting structure and a manufacturing method thereof are provided. The semiconductor light emitting structure includes a substrate, an epitaxial layer and a stepped electrode. The substrate has a first surface and a second surface opposite to the first surface. The epitaxial layer is formed by a first semiconductor layer, an active layer and a second semiconductor layer which are stacked on the first surface in sequence. The stepped electrode is formed within the epitaxial layer, and includes a main body portion, a step level and a reflection electrode portion extended towards the first surface from the step level. The main body portion at least passes through the second semiconductor layer and the active layer. The reflection electrode portion is extended into the first semiconductor layer from the main body portion.

Abstract: A weather-resistant crosslinked polyolefin composition is a novel formula containing a comprehensive mixture constituted by crosslinking agent, antistatic agent, TiO2 sized in nanometer and TiO2 sized in micrometer and essential components including polyolefin composition resin, lubricant auxiliary crosslinking agent, antioxidant, UV absorber and filler etc; this novel formula is particularly suited to produce a weather-resistant crosslinked polyolefin sheet with a calender machine instead of an extruder conventionally used, and the polyolefin sheets produced thereof are excellent in both heat-resistant and weather-resistant as well as in a high-quality sheet surface and capably made at a high yield rate through the calender machine.