Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An ultrasonic vibration assisted machining device is applied to a cutting tool and includes a vibrating component and a spinning component. The vibrating component includes a main body including a first end surface, a second end surface and a central axis. The vibrating component is configured to receive electrical power and generate a vibration with a vibrating frequency in the central axis direction according to the electrical power. The spinning component includes a first surface connected to the second end surface of the vibrating component. The area of the first surface is greater than that of the second end surface. The spinning component generates a spinning motion centered on the central axis according to the vibration with the vibrating frequency generated by the vibrating component. Wherein, the spinning component transmits the vibration and the spinning motion to the cutting tool.

Abstract: A display device includes a display panel, a backlight module, a driving circuit and a control unit. The driving circuit is electrically connected to the backlight module and used for providing a driving voltage for the backlight module. The control unit is electrically connected to the display panel and the driving circuit. The control unit controls the driving voltage to vary within a predetermined ratio range periodically so as to make a backlight brightness of the backlight module vary periodically in response to the driving voltage within the predetermined ratio range and controls a display parameter of the display panel to vary periodically according to the backlight brightness of the backlight module so as to compensate the backlight brightness of the backlight module. Accordingly, the invention can reduce power consumption of the backlight module effectively so as to reduce power consumption of the display device.

Abstract: A showing system and a showing method for product materials are provided. In this showing method, a material module database is created and stored, which includes a number of three-dimensional material modules corresponding to a number of material information and a number of module class information corresponding to the material information. A preview database is created, which includes the material information, a number of preview modules and a number of preview class information corresponding to the material information. The preview modules and preview class information in the preview database are timingly adjusted according to the three-dimensional material modules and the class information in the material module database. A user interface receives the material information to display the corresponding preview modules and the preview class.

Abstract: The present invention discloses a MEMS scanning coordinate detection method and a touch panel thereof, wherein the touch panel comprises a light source module, a MEMS reflector, an image sensor, an image signal processor, and a coordinate calculator. When the laser light from the light source module is reflected by the MEMS reflector, the laser light is transformed into a scanning light beam. When the touch panel is touched by a pen or a finger, the scanning light beam is blocked and two inactive pixels are formed on the image sensor. The electronic signal is transmitted from the image signal processor and calculated by the coordinate calculator to determine the touch point position.

Abstract: The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency.

Abstract: The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency.

Abstract: The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency.

Abstract: The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency.