Abstract: A photo-coupler is provided. The photo-coupler comprises a plurality of photo-coupling modules, a third package, a power lead and a ground lead. Each of the photo-coupling modules includes a light emitting component, a photosensitive component, a first transparent package and a second transparent package. In each of the photo-coupler modules, the photosensitive component is disposed opposite the light emitting component for receiving the light emitted by the light emitting component. In addition, the first transparent package encloses the light emitting component, while the second transparent package encloses the light emitting component and the first transparent package. The third package encloses both of the second transparent packages to block light from the outside. The photosensitive components electrically connect to the common power lead respectively and electrically connect to the common ground lead respectively inside the third package.

Abstract: A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess.

Abstract: A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess.

Abstract: A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip.