Abstract: An electronic package module and a method for fabrication of the same are provided. The method includes providing an electronic component assembly and a circuit substrate. The electronic component assembly includes two electronic components and a conductive structure. The electronic components are connected to each other through a conductive adhesive material, while the electronic components are connected to the conductive structure through another conductive adhesive material. A soldering material is formed on the circuit substrate, and the electronic component assembly is disposed on the soldering material. The melting points of the conductive adhesive materials are higher than the melting point of the soldering material. As a result, the conductive adhesive materials are prevented from failure during the soldering process, and thus the process yield is improved.

Abstract: An electronic package module and the method for fabrication of the same are provided. The method for fabricating the electronic package module includes providing a circuit substrate. An interposer frame and a first electronic component are disposed on the circuit substrate, and a shielding material with an opening overlapping the electronic component is disposed on the interposer frame. Subsequently, with the shielding material being as a mask, the molding material is filled into through the opening, thereby forming the molding layer encapsulating the electronic component. After forming the molding layer, the shielding material is removed, so that an interface of the interposer frame is exposed. Therefore, the solder ball can be disposed on the interface of the interposer frame without further machining of the molding layer.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a circuit, a mold sealing layer, a conductive metal board, and a conductive layer. The circuit board includes a substrate and a first electronic element disposed on the substrate. The mold sealing layer is disposed on the substrate and covers the first electronic element. The mold sealing layer has a top surface, a bottom surface corresponding to the top surface, and a side surface connected between the top surface and the bottom surface. The conductive metal board is disposed on the top surface and adjacent to the first electronic element. The conductive layer is disposed on the side surface and electrically connected to the conductive metal board. The conductive metal board and the conductive layer are each an independent component.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit board, a barrier structure and a molding layer. The circuit board includes a substrate and a component disposed on the substrate. The substrate includes a molding area and a non-molding area, and the component is disposed on the molding area. The barrier structure is disposed on the substrate and located between the molding area and the non-molding area. The barrier structure has a first predetermined height. The molding layer is disposed on the molding area and covers the component. The molding layer has a second predetermined height. The first predetermined height of the barrier structure is less than or equal to the second predetermined height of the molding layer.