Patents by Inventor Chao-Hua Lu

Chao-Hua Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088124
    Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: HSIANG-TAI LU, SHUO-MAO CHEN, MILL-JER WANG, FENG-CHENG HSU, CHAO-HSIANG YANG, SHIN-PUU JENG, CHENG-YI HONG, CHIH-HSIEN LIN, DAI-JANG CHEN, CHEN-HUA LIN
  • Patent number: 11917955
    Abstract: Apparatus, systems and methods for irrigating lands are disclosed. In one example, an irrigation system is disclosed. The irrigation system includes a gate and a microcontroller unit (MCU). The gate is configured for adjusting a water flow for irrigating a piece of land. The MCU is configured for controlling the gate to adjust the water flow based on environmental information related to the piece of land.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Cheng Huang, Tai-Hua Yu, Shui-Ting Yang, Chao-Te Lee, Ching Rong Lu
  • Patent number: 8416145
    Abstract: The present invention discloses a multi-band printed antenna, comprising: a grounding plane; and an antenna part, including a shorted arm electrically connected to the grounding plane, a folded arm connected to the shorted arm, and a feeding arm connected to the folded arm, feeding arm being for providing signals to the folded arm and shorted arm; wherein the folded arm includes at least one turning corner and provides at least two resonant frequencies according to the turning corner and the total length of the folded arm.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: April 9, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Han-Jung Shih, Chao-Hua Lu
  • Publication number: 20100177004
    Abstract: The present invention discloses a multi-band printed antenna, comprising: a grounding plane; and an antenna part, including a shorted arm electrically connected to the grounding plane, a folded arm connected to the shorted arm, and a feeding arm connected to the folded arm, feeding arm being for providing signals to the folded arm and shorted arm; wherein the folded arm includes at least one turning corner and provides at least two resonant frequencies according to the turning corner and the total length of the folded arm.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 15, 2010
    Inventors: Han-Jung Shih, Chao-Hua Lu