Patents by Inventor Chao Huang
Chao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250148216Abstract: The disclosure discloses a method for training a large model, an apparatus for training a large model, an electronic device and a storage medium, and relates to a field of computer technologies, especially to a field of artificial intelligence technologies such as large model and deep learning.Type: ApplicationFiled: January 13, 2025Publication date: May 8, 2025Applicant: BAIDU INTERNATIONAL TECHNOLOGY (SHENZHEN) CO., LTD.Inventors: Chao Huang, Gang Qiao, Zhenpeng Zhan
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Publication number: 20250127829Abstract: The present disclosure provides a method for preventing and/or repairing ocular cell damage by using a Streptococcus thermophilus iHA318 strain and its metabolites.Type: ApplicationFiled: October 18, 2024Publication date: April 24, 2025Inventors: Meei-Yn Lin, Pin-Chao Huang, Pei-Cheng Lin, Yi-Wen Chen, Chin-Hsiu Yu, Shao-Yu Lee, Tsung-Han Lu
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Publication number: 20250101350Abstract: The present invention relates to endoproteases. More particularly, the present invention relates to the use of endoproteases for reduction or elimination of beer haze.Type: ApplicationFiled: December 6, 2024Publication date: March 27, 2025Inventors: Jacob Flyvholm Cramer, Xiaogang Gu, Chao Huang, Xinyue Tang
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Patent number: 12256100Abstract: A method and apparatus that derives a curve of a mesh sequence from a frame of a video bitstream, the curve comprising a plurality of vertices; subdivides the curve by adding a plurality of subdivided vertices; calculates one or more displacement vectors between each of the plurality of vertices on the curve and each of the plurality of subdivided vertices on the subdivided curve; transforms the one or more displacement vectors to output one or more original coefficients; tracks the current frame with a previous frame to obtain a one-to-one correspondence between the plurality of vertices of the current frame and a plurality of vertices of the previous frame; predicts one or more coefficients of each of the plurality of vertices in current frame based on the one-to-one correspondence; performs entropy coding on one or more prediction residues; and encodes the one or more prediction residues.Type: GrantFiled: May 10, 2023Date of Patent: March 18, 2025Assignee: TENCENT AMERICA LLCInventors: Chao Huang, Xiaozhong Xu, Jun Tian, Xiang Zhang, Shan Liu
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Patent number: 12243277Abstract: A method performed by encoder comprises partitioning a mesh into a first side and a second side; determining, for a first vertex located on the first side, whether a first perpendicular line extending from the first vertex intersects with two or more surfaces of the mesh on the second side, each intersection of the first perpendicular line corresponding to an intersected vertex on the second side; based on the determination the first perpendicular line intersects with two or more surfaces of the mesh on the second side, selecting one of the intersected vertices on the second side as a second vertex corresponding to the first vertex based on a shortest distance between each intersected vertex and a predicted vertex on the second side that is symmetric to the first vertex; and generating a new connection in the mesh.Type: GrantFiled: August 31, 2023Date of Patent: March 4, 2025Assignee: TENCENT AMERICA LLCInventors: Thuong Nguyen Canh, Chao Huang, Xiaozhong Xu, Shan Liu
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Publication number: 20250072008Abstract: Provided is a semiconductor device including: a substrate, a plurality of isolation structures, a plurality of channel layers, and a gate structure. The substrate includes a plurality of fins thereon. The plurality of isolation structures are respectively disposed between the plurality of fins. A top surface of the plurality of isolation structures is higher than a top surface of the plurality of fins to form a plurality of openings. The plurality of channel layers are respectively disposed in the plurality of openings. Each channel layer is in contact with a corresponding fin and extends to cover a lower sidewall of a corresponding isolation structure, thereby forming a U-shaped structure. The gate structure is filled in the plurality of openings and extends to cover the top surface of the plurality of isolation structures.Type: ApplicationFiled: November 7, 2024Publication date: February 27, 2025Applicant: Winbond Electronics Corp.Inventors: Chi-Ching Liu, Chih-Chao Huang, Ming-Che Lin, Frederick Chen, Han-Huei Hsu
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Publication number: 20250072295Abstract: A method of fabricating a semiconductor device includes the following steps. A plurality of doped regions are formed in a substrate. A first dielectric layer is formed on the substrate. A plurality of first contacts and second contacts are formed in the first dielectric layer to be connected to the plurality of doped regions. A memory element is formed on the first dielectric layer. The memory element is electrically connected to the second contact. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer surrounds the memory element. A conductive line is formed in the second dielectric layer. A top surface of the conductive line is at a same level as a top surface of the memory element, and the conductive line is electrically connected to the plurality of first contacts.Type: ApplicationFiled: November 13, 2024Publication date: February 27, 2025Applicant: Winbond Electronics Corp.Inventors: Wen-Chia Ou, Chih-Chao Huang, Min-Chih Wei, Yu-Ting Chen, Chi-Ching Liu
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Publication number: 20250069274Abstract: A method of mesh processing includes receiving coded information of a mesh, the coded information includes position connectivity of a plurality of 3D vertices of a mesh in a 3D space, and a correspondence of the plurality of 3D vertices to UV vertices in a UV space for the mesh. The method further includes generating a reconstructed mesh in the 3D space by the plurality of 3D vertices according to the position connectivity, and determining seam vertices from the plurality of 3D vertices. The method also includes performing a prediction of seam edges in the 3D space based on at least the seam vertices, at least an edge between two seam vertices is predicted to be a seam edge. The method can also include cutting the reconstructed mesh into patch components according to the seam edges and determining UV connectivity of the UV vertices according to the patch components.Type: ApplicationFiled: August 21, 2024Publication date: February 27, 2025Applicant: Tencent America LLCInventors: Chao HUANG, Thuong NGUYEN CANH, Xiaozhong XU, Shan LIU
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Publication number: 20250071327Abstract: A method of mesh processing includes receiving coded information of a mesh, the coded information including position connectivity of a plurality of 3D vertices of a mesh in a 3D space, and a correspondence of the plurality of 3D vertices to UV vertices in a UV space for the mesh; determining UV connectivity of the UV vertices; determining, based on the coded information, a first initial UV vertex in a first UV chart in the plurality of UV charts; determining first UV vertices in the first UV chart according to a traversing order of 3D vertices corresponding to the first UV vertices in the first UV chart, the traversing order starting from the first initial UV vertex and traversing each UV vertex in the first UV chart; decoding, from the coded information, prediction residuals of the first UV vertices; and determining first UV coordinates of the first UV vertices accordingly.Type: ApplicationFiled: August 21, 2024Publication date: February 27, 2025Applicant: Tencent America LLCInventors: Chao HUANG, Thuong NGUYEN CANH, Xiaozhong XU, Shan LIU
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Patent number: 12236650Abstract: In some examples, processing circuitry receives at least a first mesh frame associated with a first time instance and a second mesh frame associated with a second time instance. The first mesh frame includes a first two dimension (2D) map with first patches having three-dimension (3D) information mapped to 2D. The second mesh frame includes a second 2D map with second patches having 3D information mapped to 2D. The processing circuitry identifies that a first patch in the first patches is a reference matching patch for a second patch in the second patches. Further, the processing circuitry determines first re-map transform parameters for a temporal alignment of the second patch to the first patch, and generates a new second 2D map that includes a transformed second patch that is transformed from the second patch according to the first re-map transform parameters.Type: GrantFiled: September 23, 2022Date of Patent: February 25, 2025Assignee: Tencent America LLCInventors: Jun Tian, Xiang Zhang, Xiaozhong Xu, Chao Huang, Shan Liu
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Publication number: 20250063193Abstract: A method performed includes encoding a first vertex, a second vertex, and a third vertex of a first face of a polygon mesh; determining a set of adaptive weights that comprise a first weight, a second weight, and a third weight; and performing parallelogram prediction to predict a fourth vertex in a second face of the polygon mesh by applying the first weight to the first vertex, the second weight to the second vertex, and the third weigh to the third vertex, in which the first weight is less than 0.8 and greater than 0, in which the second weight is greater than ?0.8 and less than 0, and in which the third weight is less than 0.9 and greater than 0.Type: ApplicationFiled: August 9, 2024Publication date: February 20, 2025Applicant: TENCENT AMERICA LLCInventors: Thuong NGUYEN CANH, Xiaozhong XU, Chao HUANG, Shan LIU, Jun TIAN
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Patent number: 12226250Abstract: Systems and methods for determining body composition by combining dual-energy x-ray (DXA) technology with three-dimensional (3D) optical technology and/or bioimpedance technology. A multi-modality scanning system may include a dual-energy x-ray source and an x-ray detector mounted to opposing sides a c-arm and configured to scan a patient on a optically translucent table. The system may also include one or more 3D optical imaging devices to capture 3D optical images of the patient substantially concurrently with the emission of the dual energy x-rays. A bioimpedance machine may also be included in the multi-modality scanning system. Data based on the dual-energy x-rays may be combined with the data from the 3D optical images and/or the bioimpedance data to generate values of at least three compartments selected from: bone, fat tissue, lean tissue, dehydrated lean tissue, and water.Type: GrantFiled: March 22, 2018Date of Patent: February 18, 2025Assignees: Hologic, Inc., The Regents of the University of CaliforniaInventors: Kevin E. Wilson, John A. Shepherd, Bennett K. Ng, Mark Guetersloh, Chao Huang, Thomas L. Kelly, Wei Wang, Howard Weiss
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Patent number: 12224952Abstract: A packet processing method includes: a first device receives a packet from a second device; the first device determines a first queue buffer used to store the packet, and determines a first upper limit value of the first queue buffer based on an available value of a first port buffer and an available value of a global buffer, where the global buffer includes at least one port buffer, the first port buffer is one of the at least one port buffer, the first port buffer includes at least one queue buffer, and the first queue buffer is one of the at least one queue buffer. The first device processes the packet based on the first upper limit value of the first queue buffer, an occupation value of the first queue buffer, and a size of the packet.Type: GrantFiled: September 28, 2023Date of Patent: February 11, 2025Assignee: Huawei Technologies Co., Ltd.Inventors: Nan Li, Chao Huang, Lixia Xiong
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Publication number: 20250037320Abstract: A method and apparatus comprising computer code for mesh attribute coding using a dual degree encoder or decoder configured to cause a processor or processors to receive at least two sub-meshes and determine a pair of vertices with a minimum cost for prediction, wherein a first vertex of the pair of vertices is a part of the first sub-mesh, wherein a second vertex of the pair of vertices is a part of the second sub-mesh. The method may cause a processor or processors to set the first vertex of the pair of vertices as a predictor vertex to the second sub-mesh to be encoded. The method may cause a processor or processors to encode the second sub-mesh in a first encoding order, wherein the second vertex of the pair of vertices is encoded first in the second sub-mesh.Type: ApplicationFiled: July 23, 2024Publication date: January 30, 2025Applicant: TENCENT AMERICA LLCInventors: Thuong Nguyen Canh, Xiaozhong Xu, Chao Huang, Shan Liu
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Publication number: 20250024057Abstract: A method and apparatus comprising computer code configured to cause a processor or processors to obtain, from a bitstream, a mesh representing an encoded volumetric data of at least one three-dimensional (3D) visual content; partition a plurality of vertices of the mesh into a plurality of groups; and decode the encoded volumetric data by predicting the vertices in each group of the plurality of groups based on a plurality of traversal orders depending on an adaptive reference vertex of the vertices, and the plurality of traversal orders includes a first order from the adaptive reference vertex to a first alternative reference vertex of the vertices, and wherein the plurality of traversal orders includes a second order from the adaptive reference vertices to a second alternative reference vertex of the vertices.Type: ApplicationFiled: July 11, 2024Publication date: January 16, 2025Applicant: Tencent America LLCInventors: Thuong NGUYEN CANH, Chao HUANG, Xiaozhong XU, Shan LIU
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Patent number: 12199965Abstract: A quantum block-chained authentication solution with quantum authentication processes for data transmissions passing through a peer-to-peer (P2P) network including a plurality of agent nodes comprises a system that is capable of not only performing a smart contract on a block-chained virtual-machine mechanism for transmitting a data from an agent node to another agent node passing through a plurality of paths in a secure way implemented via proprietary quantum authentication processes, but also detecting and reacting to a malicious behavior within a transmission in time.Type: GrantFiled: November 23, 2022Date of Patent: January 14, 2025Assignee: AhP-Tech Inc.Inventor: Chao-Huang Chen
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Patent number: 12198351Abstract: A method, computer program, and computer system are provided for image segmentation. Image data, such as biological image data, is received. One or more objects associated with the received image data is detected. One or more regions of interest are determined within the receive image data corresponding to one or more segments based on the detected objects.Type: GrantFiled: January 25, 2023Date of Patent: January 14, 2025Assignee: TENCENT AMERICA LLCInventors: Hui Tang, Lianyi Han, Chao Huang, Shih-Yao Lin, Zhimin Huo, Wei Fan
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Patent number: 12192521Abstract: A method and apparatus comprising computer code configured to cause a processor or processors to obtain volumetric data of at least one three-dimensional (3D) visual content, derive a mesh from a frame of the volumetric data, the mesh including a plurality of base mesh vertices, determine a displacement of at least one vertex, that is not of the base mesh vertices, based on a series of projections from at least one of the plurality of base mesh vertices that is a neighboring one of the plurality of base mesh vertices to the at least one vertex, predicting the at least one vertex based at least on the determined displacement, and encode the volumetric data based on the predicted at least one vertex.Type: GrantFiled: May 10, 2023Date of Patent: January 7, 2025Assignee: TENCENT AMERICA LLCInventors: Thuong Nguyen Canh, Xiaozhong Xu, Chao Huang, Xiang Zhang, Shan Liu
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Patent number: 12193337Abstract: A method of fabricating a semiconductor device includes the following steps. A plurality of doped regions are formed in a substrate. A first dielectric layer is formed on the substrate. A plurality of first contacts and second contacts are formed in the first dielectric layer to be connected to the plurality of doped regions. A memory element is formed on the first dielectric layer. The memory element is electrically connected to the second contact. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer surrounds the memory element. A conductive line is formed in the second dielectric layer. A top surface of the conductive line is at a same level as a top surface of the memory element, and the conductive line is electrically connected to the plurality of first contacts.Type: GrantFiled: August 12, 2020Date of Patent: January 7, 2025Assignee: Winbond Electronics Corp.Inventors: Wen-Chia Ou, Chih-Chao Huang, Min-Chih Wei, Yu-Ting Chen, Chi-Ching Liu
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Publication number: 20250008157Abstract: This disclosure relates generally to coding and decoding of 3-dimensional (3D) mesh and specifically to efficient coding of a vertex degree and face degree of 3D polygon mesh. In some implementations, when encoding a face, a vertex of the face following a split vertex of the face may be linked rather than signaled. In some other example implementations, a context for entropy encoding/decoding a vertex in the vertex degree or a face in the face degree may be selected based on cross characteristics in the face degree or the vertex degree.Type: ApplicationFiled: June 27, 2024Publication date: January 2, 2025Inventors: Chao HUANG, Thuong NGUYEN CANH, Xiaozhong XU, Shan LIU