Abstract: A method includes fabricating a semiconductor device, wherein the method includes depositing a coating layer on a first region and a second region under a loading condition such that a height of the coating layer in the first region is greater than a height of the coating layer in the second region. The method also includes applying processing gas to the coating layer to remove an upper portion of the coating layer such that a height of the coating layer in the first region is a same as a height of the coating layer in the second region.

Abstract: A management method for a cutting tool of a machine tool is provided. A user host imports a graphical data of a workpiece and a cutting tool database into CAM, and a user may select cutting tools to establish a complete machining process. T codes are replaced with electronic tags. Before executing a machine code comprising the electronic tags, the machine tool re-scans the cutting tools assembled at a tool turret and updates cutting tool arrangement information to ensure that the tool turret is equipped with the cutting tools used in the machining process. When the machine tool stores the electronic tags, a ready message is displayed for reminding an operator. When the electronic tags are not stored, the current storage location of a cutting tool lacked in the machining process or a warning message is displayed at the operation interface for reminding the operator.

Abstract: A dispenser for a construction string, cord, or wire contains: an end member, a handle member, and a fixer. The end member includes a first stem formed on a first end thereof, a second stem arranged on a second end thereof and separated from the first stem by a shoulder, a disposable spool fitted on the second stem on which two opposite first ribs extend away from the shoulder, a fitting part defined between the two opposite first ribs, a notch defined on a top of the fitting part, and inner threads formed on an inner wall of the notch. The handle member is rotatably connected with the first stem. The fixer includes a body and a threaded post extending outward from the body, wherein the threaded post has outer threads arranged on an outer wall thereof so as to screw with the inner threads of the notch.

Abstract: A dispenser for a construction string, cord, or wire contains: an end member, a handle member, and a fixer. The end member includes a first stein formed on a first end thereof, a second stein arranged on a second end thereof and separated from the first stein by a shoulder, a disposable spool fitted on the second stein on which two opposite first ribs extend away from the shoulder, a fitting part defined between the two opposite first ribs, a notch defined on a top of the fitting part, and inner threads formed on an inner wall of the notch. The handle member is rotatably connected with the first stein. The fixer includes a body and a threaded post extending outward from the body, wherein the threaded post has outer threads arranged on an outer wall thereof so as to screw with the inner threads of the notch.

Abstract: A thermal insulation apparatus for a burner comprises a bracket, which is attached to the bottom of the burner, a thermal insulating device disposed above the bracket, a thermal seal interposed between the thermal insulating devices for integrating adjacent thermal insulating devices; wherein the thermal seal is adhesive, and a thermal insulating tape wrapping around the exterior surface of the thermal insulating device for enhancement of thermal insulation by letting the thermal insulating device get closer to each other and to the burner. The thermal insulating device is preferably made of the materials with equal to or more than 1000 degrees Fahrenheit of heat resistant temperature and with equal to or less than 4 Watts per meter kelvin of thermal conductivity. A supporter can be disposed between the bracket and the thermal insulating device to provide further supporting.

Abstract: A multilayer leadframe module with embedded passive components and method of fabricating the same. The leadframe, comprising opposite first and second surfaces, includes an active device base exposed on the first and second surfaces, a trace line, exposed on the first surface, beyond the active device base, a contact pad, exposed at least on the second surface, beyond the trace line, a wiring layer, comprising a passive device, between the first and second surfaces and electrically connecting the trace line and contact pad, and an insulating material among the active device, trace line, contact pad, and the wiring layer, and completely covering the wiring layer.

Abstract: A transistor switch comprises a first field-effect transistor, a second field-effect transistor, a clamping circuit and a coupling circuit. The first field-effect transistor is controlled by a first voltage source to be turned on during a transmission mode. The second field-effect transistor, which is controlled by a second voltage source to be turned off during the transmission mode, has one current carrying terminal connected to the first field-effect transistor. The clamping circuit is connected between a gate of the second field-effect transistor and the second voltage source. The coupling circuit is connected between the gate and one current carrying terminal of the second field-effect transistor.

Abstract: An optical receiver preamplifier provides a transimpedance feedback path between the output node and the input node that comprises a feedback resister and the two diodes are coupled ("paralleled") in opposite direction. While the input current signal is too large, and the voltage reach the diode's threshold voltage. The preamplifier can provide current path passing the signal to solve the problem that charge-discharge time is not uniform and changed over duty-cycle. Further, the two diodes are coupled ("paralleled") in opposite direction make photo-diode working under the large-signal current by anode or cathode input. Thus, increase the dynamic range of the transimpedance preamplifier. Besides, the low impedance of series resistance connects with input node and feedback network. The influence of bandwidth and stability that the aforementioned two paralleled diodes resulted in diode junction capacitor will reduce due to the low impedance of series resistance.

Abstract: A surface mountable microwave IC package with broad bandwidth and low loss has been developed. The impedance mismatch due to the electrical discontinuity of the I/O pads and via holes in the structure is compensated. The compensation structure has two features. In one feature, ground planes are printed on both sides of a dielectric substrate to increase the distributed capacitance between the signal line and the ground, thereby obtaining a matched characteristic impedance. In the second feature, two grounding via holes are used to compensate for the mismatch of the charactersitic impedance due to the feedthrough via-slot connection of the signal line from the back-side to the front-side of the substrate.

Abstract: The present invention discloses an apparatus for testing an integrated circuit (IC) chip having a plurality of testing ports, each of the testing ports being used for connection with an testing interface assembly for further connection with external testing equipment. The apparatus includes a testing platform having a top surface, the top surface includes a chip placement means for securely placing the IC chip therein. The testing platform further includes a plurality of guiding posts extending upwardly from the top surface. The testing apparatus further includes a frame-housing which has a plurality of inter-connected walls, each of the walls further has an inner surface including an inner beam attached thereon. The inner surface and the inner beam define an elongated vertical space corresponding to each of the guiding posts of the testing platform.

Abstract: This invention discloses a monolithic microwave integrated circuit (MMIC) package with filtering property. The filtering action is inherent with the structure of the package. This structure overcomes the limitation of traditional packages, which can only transmit the signal without processing the signal. A specially designed surface-mountable structure is used in the input and the output terminals. Any impedance from this special structure can be compensated by the filtering structure in each port. The filtering structure is located between the input (or the output) structure and the die cavity in each port. The package also provides ground connection to the MMIC by means of metal-filled via holes connected to the surface mounting side.